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Preparation method of halogen-free, low-dielectric-loss and high-heat-resistance copper-clad plate

A low-dielectric, high-heat-resistance technology, used in chemical instruments and methods, electronic equipment, lamination, etc., can solve problems such as restricting applications, and achieve improved mechanical processing properties, improved dielectric properties, and high flame retardant effects. Effect

Pending Publication Date: 2021-12-28
SHANDONG JINBAO ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] With the widespread popularization of 5G communication technology, electronic products are changing with each passing day, requiring faster data transmission speeds and higher system operating frequencies. At the same time, lead-free soldering requires materials to withstand higher temperatures, which poses a challenge to printed circuit boards. In order to meet higher requirements, the epoxy phenolic resin system commonly used on copper clad laminates has a large dielectric loss, which limits its application in high frequency and high speed fields.

Method used

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  • Preparation method of halogen-free, low-dielectric-loss and high-heat-resistance copper-clad plate
  • Preparation method of halogen-free, low-dielectric-loss and high-heat-resistance copper-clad plate
  • Preparation method of halogen-free, low-dielectric-loss and high-heat-resistance copper-clad plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] (1) Preparation of resin glue: In parts by weight, 22 parts of biphenyl type epoxy resin, 85 parts of BT modified PPO resin (Arocy B—10 and 4,4'-diaminodiphenylmethane bisma The B-stage prepolymer of imide is blended with PPO resin at a mass ratio of 1:9), 20 parts of phosphorus-containing flame retardant phosphazene compound (phosphorus content 13%wt), 0.5 parts of curing accelerator 2 - Zinc ethyl octanoate, 0.01 part of 2-methyl 4-ethylimidazole, 0.4 part of dispersant BYK W-903, 100 parts of solvent butanone, 80 parts of filling material high-purity ultrafine spherical nano-amorphous silicon powder, 20 parts of hydrogen Aluminum oxide mixed, emulsified and stirred evenly;

[0030] (2) Dip the low-dielectric electronic grade glass fiber cloth into the resin glue solution prepared in step (1), and pass through a gluing machine at 170° C. to prepare a prepreg.

[0031] (3) Take 6 prepregs prepared in step (2) and stack them together, and cover each side with a piece o...

Embodiment 2

[0037] (1) Preparation of resin glue: in parts by weight, 35 parts of biphenyl type epoxy resin, 75 parts of BT modified PPO resin (Arocy B-10 and 4,4'-diaminodiphenylmethane dimaline The B-stage prepolymer of imide is blended with PPO resin at a mass ratio of 1:9), 10 parts of phosphorus-containing flame retardant resorcinol bis[bis(2,6-dimethylphenyl) Phosphate ester (phosphorus content 10.5%wt), 10 parts of phosphazene compound (phosphorus content 13%wt), 0.5 part of curing accelerator zinc 2-ethyl octanoate, 0.01 part of 2-methyl 4-ethylimidazole, 0.5 100 parts of dispersant BYK W-903, 100 parts of solvent butanone, 100 parts of high-purity ultrafine spherical nano-amorphous silicon micropowder as filler material, emulsified and stirred evenly;

[0038] (2) Dip the low-dielectric electronic grade glass fiber cloth into the resin glue solution prepared in step (1), and pass through a gluing machine at 170° C. to prepare a prepreg.

[0039](3) Take 6 prepregs prepared in st...

Embodiment 3

[0043] (1) Preparation of resin glue: by weight, 60 parts of biphenyl type epoxy resin methyl ethyl ketone solution (50%wt), 140 parts of BT modified PPO resin solution (Arocy B-10 and 4,4' – B-stage prepolymer of diaminodiphenylmethane bismaleimide blended with PPO resin at a mass ratio of 1:9 and dissolved in methyl ethyl ketone, 50%wt), 18 parts of phosphazene compound (Phosphorus content 13%wt), 0.5 parts of curing accelerator zinc 2-ethyloctanoate, 0.01 parts of 2-methyl 4-ethylimidazole, 0.5 parts of dispersant BYK W-903, 10 parts of solvent toluene, 100 parts of filling The material is mixed with high-purity ultrafine spherical nano-amorphous silicon powder, emulsified and stirred evenly;

[0044] (2) Dip the low-dielectric electronic grade glass fiber cloth into the resin glue solution prepared in step (1), and pass through a gluing machine at 180° C. to prepare a prepreg.

[0045] (3) Take 4 prepregs prepared in step (2) and superimpose them together, and cover each ...

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Abstract

The invention belongs to the technical field of copper-clad plate production, and relates to a preparation method of a halogen-free, low-dielectric-loss and high-heat-resistance copper-clad plate. According to a resin glue solution disclosed by the invention, a biphenyl group is introduced into an epoxy resin framework, so that the heat resistance can be improved, and the free volume is reduced so as to improve the toughness and reduce the water absorption; the stress generated in a high-temperature lead-free welding process of a manufactured PCB is reduced to some extent; and the BT modified PPO resin not only retains the original excellent heat resistance and very low metal ion migration resistance of BT resin, but also has good dimensional stability, and the dielectric property and the machining property of the BT modified PPO resin are greatly improved. According to the invention, the T288 of the prepared copper-clad plate can reach 120 min without layering, the Tg reaches 230 DEG C, the Df is smaller than 0.006, the copper-clad plate is suitable for the height layer design of a high-frequency and high-speed circuit board, and the packaging efficiency and the reliability of a PCB are greatly improved.

Description

technical field [0001] The invention belongs to the technical field of copper-clad laminate production, and in particular relates to a preparation method of a halogen-free, low-dielectric-loss, high-heat-resistant copper-clad laminate. Background technique [0002] Although the European Union (WEEE) and RoHS directives have not explicitly banned brominated flame retardants, such brominated copper-clad laminates will release a large amount of toxic gas (brominated type) when burning or electrical fires, with a large amount of smoke ; When the PCB is hot air leveled and component soldered, the board is affected by high temperature (>200°C), and a small amount of hydrogen bromide will also be released; whether it will also produce toxic gas is still under evaluation. Some electronic and electrical complete machine factories in Japan and Europe have extended the ban to all halogenated flame retardants. Whether it is forecast data or actual sales data, it shows that halogen-f...

Claims

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Application Information

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IPC IPC(8): B32B17/02B32B17/12B32B15/20B32B15/14B32B37/10B32B37/06C08L71/12C08L63/04C08L79/08C08K3/36C08K3/22C08K5/5399C08K5/523C08K7/14C08J5/24
CPCB32B5/02B32B5/26B32B15/20B32B15/14B32B37/1018B32B37/06C08J5/24B32B2262/101B32B2260/021B32B2260/046B32B2307/558B32B2307/306B32B2307/734B32B2307/20B32B2307/3065B32B2457/08C08J2371/12C08J2463/04C08J2479/08C08K3/36C08K2003/2227C08K5/5399C08K5/523C08K7/14
Inventor 李凌云刘政杨永亮郑宝林栾好帅姜晓亮
Owner SHANDONG JINBAO ELECTRONICS
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