Preparation method of copper-clad plate with low dielectric constant, low dielectric loss and low CTE

Abstract

The invention belongs to the technical field of copper-clad plate production, and relates to a preparation method of a copper-clad plate with low dielectric constant, low dielectric loss and low CTE. The method comprises the following steps: (1) preparing a resin glue solution: mixing 60-100 parts by weight of special epoxy resin, 150-200 parts by weight of SMA resin, 10-40 parts by weight of benzoxazine resin, 0.1-20 parts by weight of a cross-linking curing agent, 0.1-1 part by weight of a dispersing agent, 40-100 parts by weight of a solvent, 30-80 parts by weight of a flame retardant, and 10-150 parts by weight of a filling material, and carrying out emulsifying and uniformly stirring; (2) preparing a prepreg; and (3) preparing the copper-clad plate with low dielectric constant, low dielectric loss and low CTE. The dielectric constant of the prepared copper-clad plate is less than 3.9, the dielectric loss is less than 0.007, the Z-CTE is less than or equal to 1.05%, the T288 can reach 120 minutes without layering, the copper-clad plate has lower dielectric loss and higher heat resistance, is suitable for the high-level design of a high-frequency and high-speed circuit board, and greatly improves the packaging efficiency and the reliability of a PCB (Printed Circuit Board).

Description

technical field [0001] The invention belongs to the technical field of copper clad laminate production, and in particular relates to a method for preparing a copper clad laminate with low dielectric constant, low dielectric loss and low CTE. Background technique [0002] With the widespread popularization of 5G communication technology, electronic products are changing with each passing day. In order to meet the high-precision control of the characteristic impedance of the whole electronic product and the high-speed transmission of signals, it must be excellent in the dielectric properties of CCL (copper foil substrate) (with low dielectric constant, etc.). Especially under high frequency and high humidity conditions, its dielectric properties are required to be stable. The guarantee and improvement of the quality of the plated via hole is directly related to the long-term operation reliability of the whole electronic product. Therefore, the manufacturing quality of the vi...

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Problems solved by technology

The epoxy phenolic resin system commonly used on copper clad laminates has a large dielectric loss and general dimensional stability, which limits its application in the field of high-frequency, high-speed, and high-density interconnections.

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