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Normal-temperature photoresist- removing method for LED chip

A LED chip and glue removal technology, applied in the field of optoelectronics, can solve the problems of strengthening the photoresist and the photoresist on the surface of the semiconductor substrate, affecting the performance of the device or display device, and it is difficult to remove the photoresist, so as to achieve the cleaning step Simple, improve the efficiency of gel removal and cleaning, and reduce the amount of reagents

Pending Publication Date: 2022-01-28
SHANDONG INSPUR HUAGUANG OPTOELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the deglue method in this patent document is only suitable for the removal of positive photoresist on aluminum electrodes, and it needs to be heated to 28-32°C
In addition, KOH is a strong base, which is not conducive to environmental protection.
[0007] In LED production, since the etching of the film not covered with photoresist or ion doping during the patterning process will enhance the adhesion between the photoresist and the surface of the semiconductor substrate and the hardness of the photoresist, the existing The photoresist removal method is difficult to remove the photoresist that adheres stubbornly, such as the photoresist after heavily doped ion implantation and the photoresist after long-term dry etching. The residual photoresist will affect Properties of formed devices or display devices

Method used

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  • Normal-temperature photoresist- removing method for LED chip
  • Normal-temperature photoresist- removing method for LED chip
  • Normal-temperature photoresist- removing method for LED chip

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0055] Embodiment 1: A kind of glue removal and cleaning process of LED chips, the steps are as follows:

[0056] (1) Coat the surface of the GaAs substrate LED chip with Suzhou Ruihong RZJ304 positive photoresist, after exposure, development, and ICP etching, wait for the glue to be removed and clean, and put the LED chip into the card of the cleaning flower basket in sequence Put it in Startech 80R degumming solution (4L) at room temperature for ultrasonic cleaning, the ultrasonic frequency is 35KHz, and the cleaning time is 3min;

[0057] Place 24 pieces of LED chips at a time, after cleaning 480 pieces of LED chips, replace with a new degumming solution;

[0058] (2) Place the LED chip after ultrasonic cleaning with the degumming solution in an absolute ethanol solution at room temperature with a purity of 99.3% for 3 minutes, and the ultrasonic frequency is 25KHz;

[0059] (3) Place the LED chip after ultrasonic cleaning with anhydrous ethanol in an acetone solution at r...

Embodiment 2

[0063] Embodiment 2, a kind of deglue cleaning process of LED chip, comprises steps:

[0064] (1) The surface of the GaAs substrate LED chip is coated with Startech SUN116 positive photoresist. After exposure, development, and wet etching, the glue is removed and cleaned. Perform ultrasonic cleaning in Beijing Kehua KMPST601 degumming solution (3L) at room temperature, the ultrasonic frequency is 30KHz, and the cleaning time is 4min;

[0065] Place 15 LED chips at a time, after cleaning 330 LED chips, replace with a new glue removal solution;

[0066] (2) Place the LED chip after ultrasonic cleaning in step (1) in an anhydrous ethanol solution with a purity of 99.5% at room temperature for 4 minutes, and the ultrasonic frequency is 25KHz;

[0067] (3) Place the LED chip after ultrasonic cleaning in step (2) in an acetone solution at room temperature with a purity of 99.7% for 4 minutes, and the ultrasonic frequency is 25KHz;

[0068] (4) Place the LED chip after ultrasonic c...

Embodiment 3

[0071] Embodiment 3, a kind of deglue cleaning process of LED chip, the steps are as follows:

[0072] (1) The surface of the GaN substrate LED wafer is coated with SUN-lift1303 negative photoresist. After exposure, development, metal evaporation, and stripping, the chips to be cleaned are placed in sequence Clean the jam of the flower basket, place it in Sanda Oak VS1250 negative glue removal solution (3L) at room temperature for ultrasonic cleaning, the ultrasonic frequency is 30KHz, and the cleaning time is 4.5min;

[0073] Place 25 pieces of LED chips at a time, and after cleaning 300 pieces of LED chips, replace with a new degumming solution;

[0074] (2) Place the LED chip after ultrasonic cleaning in step (1) in an absolute ethanol solution at room temperature with a purity of 99.5% for 5 minutes, and the ultrasonic frequency is 20KHz;

[0075] (3) Place the LED chip cleaned in step (2) in an acetone solution at room temperature with a purity of 99.7% for 4.5 minutes, ...

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Abstract

The invention relates to a normal-temperature photoresist-removing cleaning method for an LED chip. The method comprises the following steps: placing a wafer to be degummed and cleaned in a normal-temperature degumming solution for ultrasonic cleaning, then respectively cleaning the wafer with normal-temperature absolute ethyl alcohol and normal-temperature acetone, then cleaning the wafer with normal-temperature isopropanol, and then drying the wafer so as to clean the residual glue on the surface of the chip. The surface of the cleaned chip is free of surface abnormity such as residual glue and residual foreign matters, and the quality and the yield of the chip are ensured.9 The method does not need heating, is easy to operate, is low in energy consumption and raw material consumption, improves the production efficiency and reduces the product cost.

Description

technical field [0001] The invention relates to a normal-temperature glue-removing method for LED chips, which belongs to the technical field of optoelectronics. Background technique [0002] Photoresist, also known as photoresist, is a light-sensitive mixed liquid composed of three main components: photosensitive resin, sensitizer and solvent. The photoresist should have relatively low surface tension, so that the photoresist has good fluidity and coverage. After the photosensitive resin is exposed to light, the photocuring reaction can quickly occur in the exposed area, so that the physical properties of the material, especially the solubility and affinity, will change significantly. Photoresists are widely used in the manufacture of printed circuits and integrated circuits, and in processes such as printing plate making. The technology of photoresist is complex and there are many varieties. According to its chemical reaction mechanism and development principle, it can b...

Claims

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Application Information

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IPC IPC(8): G03F7/42H01L21/02H01L33/48
CPCG03F7/42H01L33/48H01L21/02057H01L2933/0033
Inventor 王建华魏朝李晓明闫宝华
Owner SHANDONG INSPUR HUAGUANG OPTOELECTRONICS