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Ni-W-P plating solution for chemical plating, preparation method of Ni-W-P plating solution, Ni-W-P plating and preparation method of Ni-W-P plating

An electroless plating, ni-w-p technology, applied in the field of electroless plating, can solve problems such as difficulty, deep plating ability and leveling ability do not meet high standards, and achieve the effect of improving compactness, suitable for large-scale production and simple operation

Pending Publication Date: 2022-02-18
苏州汉宜纳米新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] As the market demand for small and micro electronic products increases, the design of printed circuit boards tends to have small apertures and high densities, which leads to the gradual miniaturization of through holes for carrying circuit connections. At present, the deep plating ability of traditional electroless Ni-W-P plating solutions And the leveling ability has not reached a high standard, and it is still difficult to perform Ni-W-P electroless plating and form a good coating in through holes with high depth-to-diameter ratio

Method used

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  • Ni-W-P plating solution for chemical plating, preparation method of Ni-W-P plating solution, Ni-W-P plating and preparation method of Ni-W-P plating
  • Ni-W-P plating solution for chemical plating, preparation method of Ni-W-P plating solution, Ni-W-P plating and preparation method of Ni-W-P plating
  • Ni-W-P plating solution for chemical plating, preparation method of Ni-W-P plating solution, Ni-W-P plating and preparation method of Ni-W-P plating

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] (1) a kind of chemical plating Ni-W-P plating bath, each component and content are as follows:

[0040] components content NiSO 4

40g / L Na 2 WO 4

85g / L NaH 2 PO 3

60g / L potassium iodate 30ppm Acetic acid 30g / L sodium tartrate 35g / L Sodium vinyl sulfonate 3g / L 2-vinylpyridine 5g / L Cerium oxalate 3g / L

[0041] (2) the preparation method of above-mentioned Ni-W-P plating solution is:

[0042] S1: Add 60-70% volume of deionized water to the cleaned chemical plating tank, heat to 75-85°C, and add the above-mentioned content of NiSO 4 , stirred until completely dissolved to obtain solution A;

[0043] S2: Add appropriate amount of deionized water to a separate container, heat to 75-85°C, add the above content of Na 2 WO 4 , NaH 2 PO 3 , potassium iodate, acetic acid and sodium tartrate, stirred until completely dissolved, and put into a chemical aqueduct to obtain solution B;

...

Embodiment 2

[0051] (1) a kind of chemical plating Ni-W-P plating bath, each component and content are as follows:

[0052]

[0053]

[0054] (2) the preparation method of above-mentioned Ni-W-P plating solution is:

[0055] S1: Add 60-70% volume of deionized water to the cleaned chemical plating tank, heat to 75-85°C, and add the above-mentioned content of NiSO 4 , stirred until completely dissolved to obtain solution A;

[0056] S2: In a separate container, add an appropriate amount of deionized water, heat to 75-85°C, add the above content of Na 2 WO 4 , NaH 2 PO 3 , potassium polysulfide, thiourea, ammonium citrate and tartaric acid, stirred until completely dissolved, put into the electroless plating tank, obtain solution B;

[0057] S3: Mix the solution A and the solution B in the electroless plating tank, add the above-mentioned sodium α-alkenyl sulfonate, ethylene-d4-diamine and ammonium cerium sulfate while stirring, adjust with 10% NaOH solution When the pH value reac...

Embodiment 3

[0064] (1) a kind of chemical plating Ni-W-P plating bath, each component and content are as follows:

[0065] components content NiSO 4

20g / L Na 2 WO 4

55g / L NaH 2 PO 3

30g / L Sodium polysulfide 5ppm lead sulfate 10ppm Sodium citrate 25g / L lactic acid 15g / L Sodium vinyl sulfonate 0.5g / L Isomerized fatty alcohol polyoxyethylene ether 0.5g / L Lanthanum perchlorate 0.1g / L

[0066] (2) the preparation method of above-mentioned Ni-W-P plating solution is:

[0067] S1: Add 60-70% volume of deionized water to the cleaned chemical plating tank, heat to 75-85°C, and add the above-mentioned content of NiSO 4 , stirred until completely dissolved to obtain solution A;

[0068] S2: In a separate container, add an appropriate amount of deionized water, heat to 75-85°C, add the above-mentioned content of Na 2 WO 4 , NaH 2 PO 3 , sodium polysulfide, lead sulfate, sodium citrate and lactic ...

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Abstract

The invention discloses a Ni-W-P plating solution for chemical plating, preparation method of Ni-W-P plating solution, Ni-W-P plating and preparation method of Ni-W-P plating. The Ni-W-P plating solution for chemical plating comprises 20-50 g / L of soluble nickel salt, 55-105 g / L of soluble tungstate, 30-70 g / L of a phosphorus-containing reducing agent, 40-100 g / L of a complexing agent, 1-15 g / L of a fine foam agent and 0.1-5 g / L of a deep hole agent. The Ni-W-P plating solution for chemical plating has very strong filling capacity for a through hole with a small aperture, is strong in deep plating and leveling capacity, and can effectively prevent a black heart area generated due to the fact that the plating solution cannot be completely immersed into the hole in a plating process, so the chemical plating Ni-W-P plating solution is suitable for workpieces with high-depth-diameter-ratio through holes such as a printed circuit board. The Ni-W-P plating solution for chemical plating provided by the invention is simple in preparation method, clean, free of pollution and easy to industrialize and commercialize.

Description

technical field [0001] The invention belongs to the technical field of electroless plating, and in particular relates to an electroless Ni-W-P plating solution and a preparation method thereof, a Ni-W-P coating and a preparation method thereof. Background technique [0002] Electroless plating, also known as electroless plating, refers to the deposition of an amorphous coating on the surface of a workpiece by means of a self-catalyzed redox reaction. Compared with electroplating, the electroless plating method has lower requirements on the shape of the workpiece and is suitable for the surface treatment of various irregularly shaped workpieces. Therefore, the electroless plating method is widely used in the field of workpiece surface treatment. The electroless Ni-W-P ternary alloy coating is doped with W element on the basis of electroless Ni-P binary alloy plating. The introduction of W element can enhance the corrosion resistance and wear resistance of the coating. Some st...

Claims

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Application Information

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IPC IPC(8): C23C18/50C23C18/18H05K3/18
CPCC23C18/50C23C18/1824H05K3/181
Inventor 高宇航徐英君孙华敏赵东军
Owner 苏州汉宜纳米新材料有限公司