Capacitor lead processing method

A treatment method and capacitor technology, which is applied in the direction of fixed capacitor leads, capacitors, capacitor manufacturing, etc., can solve the problems of corrosion of lead wires and circuit boards, troublesome processing, uneven sagging of tin-lead plating, etc., and achieve good solderability and electrical connectivity, easy disposal and recycling, and environmentally friendly effects

Pending Publication Date: 2022-03-08
北京七星飞行电子有限公司
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Problems solved by technology

[0004] Direct hot-dip coating of tin-lead layer, due to the existence of surface oxide layer, impurity pollutants, etc., the treatment effect is not good, often the tin-lead coating layer is unevenly sagging, not smooth, and there are many defects such as tin tip and tin tumor;
[0005] Grinding with fine sandpaper or treating with an acidic solution such as dilute hydrochlo

Method used

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  • Capacitor lead processing method

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Embodiment Construction

[0027] In the following, embodiments of the present invention will be described below, and those skilled in the art can easily understand other advantages and efficacy of the present invention, apparently, as described in the present invention. , Not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art are in the range of the present invention without making creative labor premise.

[0028] According to an embodiment of the present invention, a method of processing a capacitor lead is provided, such as figure 1 As shown, including:

[0029] S11, using a certain ratio of citric acid and sodium citrate to water, configure it to weak acid buffer solution;

[0030] S12, the surface of the capacitor lead in a weak acid buffer solution is subjected to a first preset time;

[0031] S13, flushing the soaking capacitor leads;

[0032] S14, the capacitor lead after purined water is alcoholized and dri...

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Abstract

The invention discloses a capacitor lead processing method which comprises the following steps: dissolving citric acid and sodium citrate in water according to a certain ratio to prepare a weak acid buffer solution; soaking the surface of the capacitor lead in a weak acid buffer solution for a first preset duration; the soaked capacitor lead is washed with clear water; carrying out alcohol degreasing and airing on the capacitor lead washed by the clear water; and carrying out hot dipping on the dried capacitor lead by using the tin-lead solder to obtain the capacitor lead with the tin-lead coating layer. Sodium citrate and citric acid in a certain proportion are dissolved in water, and the prepared weak acid buffer solution can properly and effectively treat an oxide layer on the surface of the lead, so that a new tin-lead coating layer can be coated, good weldability and electric connectivity during use are ensured, and the service life of the lead is prolonged. Meanwhile, compared with inorganic acid, the weak acid buffer solution is more environment-friendly and convenient to treat and recycle.

Description

Technical field [0001] The present invention relates to the technical field of processing of capacitor leads, and more particularly to a method of processing a capacitor lead. Background technique [0002] Multi-layer ceramic capacitors do bypass, filtering, corruption, and coupling in the circuit. Capacitors in the form of lead mounting are inserted on the wire board, and weld welding with wave welding process. The action of the lead is to achieve an effective electrical connection of the capacitor to the board. The material of the lead is polyprotic copper wire, in order to antioxidize, well-weldable, surface tinned treatment. [0003] In the military field, considering the service time of equipment, the use environment is harsh, and the lead wires of the pure tin coating are not allowed to prevent tin must grow, causing the circuit to fail. However, as the environmental awareness of the whole society continues to strengthen, the popularity of international and domestic environ...

Claims

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Application Information

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IPC IPC(8): H01G13/06H01G13/04H01G13/00B05D1/18B05D7/24H01G4/12H01G4/232H01G4/30
CPCH01G13/06H01G13/04H01G13/006H01G13/00B05D1/18B05D7/24H01G4/2325H01G4/30H01G4/12
Inventor 赵丽颖李仁胜赵静波
Owner 北京七星飞行电子有限公司
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