Directional growth regulation and control method of super-hydrophobic nano-structure organic film

Abstract

The invention relates to a directional growth regulation and control method of a super-hydrophobic nano-structure organic thin film. The method is characterized by comprising the following steps: carrying out ultrasonic cleaning on a metal substrate; carrying out pre-sputtering on the polytetrafluoroethylene target; adjusting and controlling the distance between the Hall ion source and the metal substrate and the anode voltage, the anode current and the filament current of the Hall ion source, and directionally etching the surface of the metal substrate; sputtering a fluorocarbon organic film on the surface of the metal substrate; and carrying out high-temperature annealing on the sample deposited with the fluorocarbon organic thin film, rapidly heating, and then cooling to room temperature to obtain the super-hydrophobic nano-structure organic thin film. The deposition site of sputtering particles is changed through ion etching, the kinetic energy and potential energy of the particles are regulated and controlled through the sputtering process, the deposition site is optimized, the crystallinity of the film is improved through the high-temperature annealing process, the oriented growth process of the film is controllable, and the film has the advantages of being super-hydrophobic, low in secondary electron emission coefficient and the like; the cable is especially suitable for improving environmental weather resistance and insulation stability of electrical equipment such as a switch cabinet and a composite apparatus.

Description

Technical field [0001] The present invention belongs to the technical field of electrical materials, in particular, a directional growth regulation method for superhydrophobic nanostructures. Background technique [0002] The organic film represented by the fluorocarbon film is caused by its widespread concern due to its uniqueness in electrical, mechanics, thermal and optical, etc.. In terms of electrical properties, the thin film dielectric constant is low, and the dielectric constant is closely related to the fluorine content. The higher the fluorine content, the more the amount of the fluorocarbon bond, the number of unsaturated suspension bonds in the film, the less film The trend of transformation to a highlighted structure is the insulation material for integrated electronic circuitry. In terms of mechanical properties, the film friction coefficient is low, with self-lubrication, which can be used as a solid lubricating material. The thermal stability of the film is closel...

AI Technical Summary

Problems solved by technology

In view of the above problems, the deposition of organic thin films on the metal surface of power equipment is an effective means to ensure the environmental stability and electrical strength of the equipment. Organic thin films can be deposited on different types of substrates by sputtering, evaporation, spin coating, etc., but the metal phase Compared with organic substrates, the interface adhesion is smaller, the growth process is less controllable, and it is more difficult to achieve directional growth, while the hydrophobicity and secondary electron emission characteristics of organic films are the key to evaluating their environmental weather resistance and insulation stability

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