Synthesis method and application of over-speed hole-filling copper plating leveling agent

A synthesis method and technology of leveling agent, applied in the direction of electrical connection of printed components, printed circuit components, etc., can solve the problems of low solubility of copper oxide powder, insufficient supply of copper sources, affecting production capacity, etc. Surface copper control ability and effect of improving plating efficiency

Active Publication Date: 2022-04-22
广州市慧科高新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, the copper plating process for filling blind holes in the market uses small current (1ASD-2ASD) for long-term plating. For example, for blind holes with a diameter of 125um and a layer of about 75um, it takes about 60 Minutes, low efficiency, seriously affecting production capacity
[0005] In addition, when the anode of the conventional acidic hole-filling copper plating solution is an insoluble anode, the copper source is mainly supplemented with copper oxide powder, but its temperature is low, resulting in low solubility of the copper oxide powder. If the current density is increased, the copper The supply of sources will be insufficient

Method used

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  • Synthesis method and application of over-speed hole-filling copper plating leveling agent
  • Synthesis method and application of over-speed hole-filling copper plating leveling agent
  • Synthesis method and application of over-speed hole-filling copper plating leveling agent

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040]Add 300g of absolute ethanol and 150g of dimethylamine aqueous solution with a mass fraction of 33% into the reaction vessel, stir and disperse fully, slowly add 145g of pentaerythritol tetraglycidyl ether dropwise, control the ambient temperature at 25-30°C, and stir at a rate of 150rpm Reaction for 16h, after the reaction was completed, the mixture was rotatably evaporated to remove excess dimethylamine, water and ethanol to obtain a yellow oily compound, and 300g of anhydrous ethanol solution containing 84g of allyl chloride was added to the above-mentioned oily compound, and then heated in an oil bath Raise the temperature to 110°C, and stir the reaction at a rate of 150 rpm for 8 hours under reflux. After the reaction, the mixture is rotated and evaporated, and the obtained yellow oil is washed with anhydrous ether several times to obtain a quaternary ammonium salt-type leveling agent;

[0041] Add 200mL deionized water and 0.5mol imidazole compound into the reactio...

Embodiment 2

[0051] Compared with Example 1, this example changes the composition of the quaternary ammonium salt type leveling agent;

[0052] Add 300g of absolute ethanol and 103g of diethylamine aqueous solution with a mass fraction of 33% into the reaction vessel, stir and disperse fully, slowly add 294g of polypropylene glycol diglycidyl ether dropwise, control the ambient temperature at 25-30°C, and at a rate of 150rpm Stir the reaction for 24 hours. After the reaction is completed, the mixture is rotary evaporated to remove excess diethylamine, water and ethanol to obtain a yellow oily compound. Add 300 g of anhydrous ethanol solution containing 14 g of benzyl chloride to the above oily compound, and then heat in an oil bath Raise the temperature to 900°C, and stir the reaction at a rate of 150 rpm for 12 hours under reflux conditions. After the reaction, the mixture is rotated to evaporate, and the obtained yellow oil is washed with anhydrous ether several times to obtain a quaterna...

Embodiment 3

[0062] Compared with Example 1, this example changes the composition of the IMEP type dispersant.

[0063] Add 300g of absolute ethanol and 150g of dimethylamine aqueous solution with a mass fraction of 33% into the reaction vessel, stir and disperse fully, slowly add 145g of pentaerythritol tetraglycidyl ether dropwise, control the ambient temperature at 25-30°C, and stir at a rate of 150rpm Reaction for 16h, after the reaction was completed, the mixture was rotatably evaporated to remove excess dimethylamine, water and ethanol to obtain a yellow oily compound, and 300g of anhydrous ethanol solution containing 84g of allyl chloride was added to the above-mentioned oily compound, and then heated in an oil bath Raise the temperature to 110°C, and stir the reaction at a rate of 150 rpm for 8 hours under reflux. After the reaction, the mixture is rotated and evaporated, and the obtained yellow oil is washed with anhydrous ether several times to obtain a quaternary ammonium salt-ty...

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Abstract

The invention discloses a synthesis method and application of an overspeed porefilling copper plating leveling agent. The invention provides a copper plating technology capable of filling blind holes of substrates such as circuit boards, semiconductor support plates, organic material substrates, ceramic plates and the like in an over-speed manner. In particular to a synthesis method of a leveling agent for blind hole over-speed hole-filling electro-coppering and an application of the leveling agent in PCB (printed circuit board) copper plating. The leveling agent is composed of a quaternary ammonium salt type leveling agent and an IMEP type leveling agent. According to the electroplating solution obtained by matching the leveling agent with other additives, an insoluble anode is adopted, the temperature of the electroplating solution is increased to 30-50 DEG C, the electroplating solution has good hole filling capacity and excellent surface copper control capacity when the current density range is 3 ASD-5 ASD, the hole filling rate of obtained blind holes is high, and a copper plating layer is compact, flat, free of cavities and good in ductility. Compared with a common hole filling technology, the electroplating efficiency is improved, and the capacity of a client side is greatly improved.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a synthesis method and application of an ultra-fast hole-filling copper-plating leveling agent. Background technique [0002] In recent years, the miniaturization and multi-functionalization of electronic products have promoted the development of printed circuit boards (PCBs) in the direction of fine lines and miniaturization of small holes. The mainstream products are HDI (high-density interconnect) boards and IC (integrated circuit boards). ) substrate. In order to meet the high-density and high-integration requirements of HDI and IC substrates, the PCB manufacturing industry has pioneered the electroplating hole filling technology. [0003] Blind hole filling can improve the conduction performance of the circuit board, improve the thermal conductivity of the product, reduce the void in the hole, reduce the loss of the transmission signal, and effectively improv...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/38C25D7/00H05K1/11
CPCC25D3/38C25D7/00H05K1/115
Inventor 罗东明张之勇
Owner 广州市慧科高新材料科技有限公司
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