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A single-sided pcb printed circuit board and its processing technology

A technology of printed circuit board and processing technology, which is applied in the fields of printed circuit, printed circuit coating, printed circuit manufacturing, etc., can solve the problems of printed circuit board signal transmission loss, etc., and achieve improved dielectric properties, reduced dielectric constant, high freedom volume effect

Active Publication Date: 2022-07-29
珠海市骏德电业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Studies have found that some solder resist inks can cause loss of signal transmission on printed circuit boards

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0049] The solder mask ink includes the following components by weight: Component A: 40 parts of cured resin, 25 parts of titanium dioxide, 4 parts of photoinitiator, 2 parts of auxiliary; Component B: 25 parts of epoxy resin, 2 parts of fumed silica , 20 parts of diluent, 5 parts of auxiliary agent, 15 parts of solvent;

[0050] The cured resin is prepared by the following process:

[0051] 1.1. Mix dicyclopentadiene and aluminum chloride, in a nitrogen atmosphere, heat up to 120 ° C, keep warm for 1.6 hours; slowly add divinylbenzene, keep the reaction for 3.6 hours; add 5% sodium hydroxide solution, stir for 50 minutes, Filtration, washing; taking the organic phase for distillation; dissolving in toluene, extracting with deionized water, repeating multiple times, and distilling to obtain dicyclopentadiene derivative A;

[0052] 1.2. Mix 2,2-bis[(3-amino-4-hydroxy)phenyl]hexafluoropropane, Et3N, Sm(OTf)3, add an aqueous solution of ethanol, in a nitrogen atmosphere, at a te...

Embodiment 2

[0063] The solder mask ink includes the following components by weight: Component A: 50 parts of cured resin, 35 parts of titanium dioxide, 7 parts of barium sulfate, 5 parts of photoinitiator, 4 parts of auxiliary; Component B: 32 parts of epoxy resin, 10 parts of Parts of titanium dioxide, 3 parts of fumed silica, 32 parts of diluent, 8 parts of auxiliary agent, 22 parts of solvent;

[0064] The cured resin is prepared by the following process:

[0065] 1.1. Mix dicyclopentadiene and aluminum chloride, in a nitrogen atmosphere, heat up to 125 ° C, keep warm for 2 hours; slowly add divinylbenzene, keep the reaction for 4 hours; add 5% sodium hydroxide solution, stir for 64 minutes, filter, washing; taking the organic phase for distillation; dissolving in toluene, extracting with deionized water, repeating multiple times, and distilling to obtain dicyclopentadiene derivative A;

[0066] 1.2. Mix 2,2-bis[(3-amino-4-hydroxy)phenyl]hexafluoropropane, Et3N, Sm(OTf)3, add an aqueo...

Embodiment 3

[0077] The solder mask ink includes the following components by weight: Component A: 60 parts of cured resin, 45 parts of titanium dioxide, 15 parts of barium sulfate, 7 parts of photoinitiator, 7 parts of auxiliary; Component B: 40 parts of epoxy resin, 20 parts of Parts of titanium dioxide, 5 parts of fumed silica, 45 parts of diluent, 12 parts of additives, 30 parts of solvent;

[0078] The cured resin is made by the following process:

[0079] 1.1. Mix dicyclopentadiene and aluminum chloride, heat up to 130°C in a nitrogen atmosphere, and keep the temperature for 2.5h; slowly add divinylbenzene, keep the reaction for 4.5h; add 5% sodium hydroxide solution, stir for 75min, Filtration, washing; taking the organic phase for distillation; dissolving in toluene, extracting with deionized water, repeating multiple times, and distilling to obtain dicyclopentadiene derivative A;

[0080]1.2. Mix 2,2-bis[(3-amino-4-hydroxy)phenyl]hexafluoropropane, Et3N, Sm(OTf)3, add an aqueous s...

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Abstract

The invention discloses a single-sided PCB printed circuit board and its processing technology, including the following processes: (1) pretreatment: cutting and cleaning a copper-clad substrate; (2) circuit preparation: printing circuit patterns, UV drying, etching (3) Solder mask printing: coating solder mask ink, UV drying; (3) Character printing: printing characters on the back and front of the copper clad substrate, UV drying; (5) Post-processing: drilling positioning holes ,punching. The present invention has low molar polarizability and low dielectric constant by introducing dicyclopentadiene and benzothiazole into the molecular structure of the cured resin; when it is co-cured with epoxy resin, due to its large steric hindrance, the cross-linkage is reduced. The bonding density can form a cured product with larger molecular space gap and lower density, which is beneficial to the improvement of the dielectric properties of the cured resin and epoxy resin after curing; at the same time, due to its strong electron-absorbing ability, it can enhance the resistance Bonding properties of solder layer and circuit pattern.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a single-sided PCB printed circuit board and a processing technology thereof. Background technique [0002] PCB, also known as printed circuit board, is an important electronic component of electronic components and a carrier for electrical interconnection of electronic components. After the circuit pattern is formed by printing, it is necessary to use screen printing, gravure printing on the non-welded parts on the surface of the circuit board. Solder resist ink is applied by inkjet printing or other methods, and then cured to form a solder resist ink protective layer to protect the circuit. With the advent of the 5G era, electronic information products have entered the gigahertz (GHz) era, and high-speed printed circuits have gradually become a research hotspot. Studies have found that some solder mask inks can cause losses in the signal transmission of printed circuit ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00B41M7/00B41M1/12
CPCH05K3/0091H05K3/0047H05K3/005B41M1/12B41M7/0081
Inventor 黎斌尚晴晴张荣敏
Owner 珠海市骏德电业有限公司
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