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Modified maleimide compound as well as preparation method and application thereof

A maleimide and maleimide-based technology, applied in the field of modified maleimide compounds and their preparation, can solve the problems of the dielectric properties of the cured product, the adverse effects of water absorption rate and resistance to humidity and heat, and the like, Achieve the effect of excellent dielectric properties, good dielectric properties and processing properties, and low water absorption

Pending Publication Date: 2022-05-17
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the maleimide compound used in this resin varnish contains acidic substituents such as hydroxyl, carboxyl or sulfonic acid groups, and reacts with epoxy resin to generate a large and easily water-absorbing secondary alcoholic hydroxyl group, thereby affecting the cured product. Adverse effects on dielectric properties, water absorption, and heat and humidity resistance

Method used

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  • Modified maleimide compound as well as preparation method and application thereof
  • Modified maleimide compound as well as preparation method and application thereof
  • Modified maleimide compound as well as preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example 1

[0095] An aromatic monoamine compound L-1 containing an active ester group, the structural formula is as follows:

[0096]

[0097] The preparation method comprises the following steps:

[0098] (1) In a 3L flask equipped with a thermometer, dropping funnel, and stirring device, add 139.1g (1mol) p-nitrophenol, 140.6g (1mol) benzoyl chloride and 1500g methylene chloride, stir and dissolve; place the flask Slowly add 106.2 g (1.05 mol) of triethylamine dropwise in a low-temperature tank at -5°C over 2 hours, and control the temperature of the system within the range of -5 to 10°C. After the dropwise addition of triethylamine is completed, continue the reaction for 1 hour. After the reaction, add deionized water and stir for 10 min, remove the water layer by standing and separating the liquid, and repeat the washing operation of the obtained dichloromethane layer until the pH of the water layer is 7; finally, concentrate and dry by heating under reduced pressure, so as to obt...

preparation example 2

[0102] A kind of aromatic monoamine compound L-2 containing active ester group, structural formula is as follows:

[0103]

[0104] The preparation method comprises the following steps:

[0105] (1) In a 3L flask equipped with a thermometer, dropping funnel, and stirring device, add 139.1g (1mol) p-nitrophenol, 78.5g (1mol) acetyl chloride and 1000g methylene chloride, stir and dissolve; place the flask on Slowly add 106.2 g (1.05 mol) of triethylamine dropwise in a low-temperature tank at -5°C over 2 hours, and control the temperature of the system within the range of -5 to 5°C. After the dropwise addition of triethylamine is completed, continue the reaction for 1 hour. After the reaction, add deionized water and stir for 10 min, remove the water layer by standing and separating the liquid, and repeat the washing operation of the obtained dichloromethane layer until the pH of the water layer is 7; finally, concentrate and dry by heating under reduced pressure, so as to obt...

preparation example 3

[0109] A kind of aromatic diamine compound L-3, structural formula is as follows:

[0110]

[0111] The preparation method comprises the following steps:

[0112] (1) In a 3L flask equipped with a thermometer, dropping funnel, and stirring device, add 55.1g (0.5mol) of hydroquinone, 203g (1mol) of terephthaloyl chloride and 2000g of dichloromethane, and stir to dissolve; Place the flask in a low-temperature tank at -10°C, slowly add 106.2g (1.05mol) of triethylamine dropwise, and control the temperature of the system within the range of -10 to 0°C. After the addition of triethylamine is complete, continue the reaction for 1 hour Add 139.1 g (1 mol) of p-nitrophenol, and slowly add 106.2 g (1.05 mol) of triethylamine dropwise. After the addition of triethylamine is completed, the reaction is continued for 2 h. After the completion of the reaction, let it stand for 2 hours, filter at room temperature to remove the precipitated triethylamine salt, distill the filtrate under r...

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Abstract

The invention provides a modified maleimide compound as well as a preparation method and application thereof. The modified maleimide compound is prepared from the following raw materials: a maleimide group-containing compound and an active ester group-containing aromatic monoamine compound with a structure as shown in a formula I which is described in the specification. The modified maleimide compound is prepared from specific raw materials, the molecular structure of the modified maleimide compound contains a maleimide group and an active ester group, and the two active groups cooperate with each other, so that the modified maleimide compound has relatively high reaction crosslinking sites, low water absorption rate, low dielectric constant and dielectric loss; the modified maleimide compound is used as a curing agent to react with epoxy resin, and an obtained cured product is low in water absorption rate, high in glass transition temperature, excellent in dielectric property, heat resistance and humidity and heat resistance, low in thermal expansion coefficient and high in metal binding force and can fully meet the application requirements of high-performance circuit substrates.

Description

technical field [0001] The invention belongs to the technical field of copper clad laminates, and in particular relates to a modified maleimide compound and its preparation method and application. Background technique [0002] In recent years, with the rapid development of the information industry, electronic products have become increasingly short, thin, high-performance and multi-functional. In order to meet the development needs of various electronic equipment, information and communication equipment tends to increase the speed and frequency of signal transmission. Integrated circuits are advancing toward high density, high precision, and high integration, which requires printed circuit substrate materials to have good dielectric properties, and also requires substrates to have good heat resistance to meet the requirements of reliable printed circuit board technology. sexual demands. For example, in the substrates of smart mobile phones, etc., which are being thinned and...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C07D207/416C08G63/685C08G63/91C08G63/20C08G63/191C08J5/24C08G59/40H01L23/29
CPCC07D207/416C08G63/6856C08G63/916C08G63/20C08G63/191C08J5/24C08G59/4042H01L23/293C08J2363/00
Inventor 林伟奚龙黄天辉游江许永静
Owner GUANGDONG SHENGYI SCI TECH