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Preparation method of micron-aperture foamy copper

A technology of foamed copper and pore size, which is applied in the field of metal foam, can solve the problems of susceptibility to external seepage pressure and temperature, uneven distribution of foamed copper pore size, and many powder metallurgy processes, etc., to achieve short heat treatment time and low production cost Low cost, simple and controllable operation process

Inactive Publication Date: 2022-06-14
BEIJING INSTITUTE OF TECHNOLOGYGY +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing preparation methods of foamed copper are mainly divided into directional solidification method, infiltration casting method, dealloying method, electrodeposition method and powder metallurgy method. However, the directional solidification method has uneven pore size distribution, inconsistent pore size and parameter control Difficulties and other problems; infiltration casting method has problems such as discontinuous foam copper structure, uneven porosity, and easy to be affected by external seepage pressure and temperature; dealloying method has problems such as serious pollution and difficult recovery; electrodeposition method has environmental pollution Large size, long production time, high energy consumption, etc.; the powder metallurgy method has many technological processes, high equipment requirements, and large pore size of foamed copper.

Method used

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  • Preparation method of micron-aperture foamy copper
  • Preparation method of micron-aperture foamy copper
  • Preparation method of micron-aperture foamy copper

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Preparation of slurry: Weigh 0.4 g of copper oxide powder with a particle size of 10 microns and transfer it to an agate mortar; then add 0.25 g of N-methylpyrrolidone, mix and grind for 20 minutes to obtain a slurry of copper oxide particles. The content is 61.5%.

[0033] Slurry coating: transfer the copper oxide particle slurry to the quartz glass sheet, and use a doctor blade to uniformly coat the slurry on the surface of the quartz glass sheet, and the coating thickness of the slurry is 80 microns.

[0034] Slurry drying: Transfer the quartz glass sheet coated with the copper oxide particle slurry to a 100°C vacuum oven, vacuumize and maintain it at -1bar, heat and dry for 10 hours, and the copper oxide particle slurry on the quartz glass sheet is fully dried. A coating of copper oxide particles is obtained on the support.

[0035] Thermal reduction treatment: transfer the quartz glass sheet loaded with copper oxide particle coating into a tube furnace, and pass H...

Embodiment 2

[0038] Preparation of slurry: Weigh 0.3g of pure copper powder with a particle size of 2 microns and transfer it to an agate mortar; then add 0.2g of N-methylpyrrolidone, mix and grind for 20min to obtain pure copper particle slurry, the solid content in the slurry is 60%.

[0039] Slurry coating: transfer the pure copper particle slurry to the quartz glass sheet, and use a doctor blade to uniformly coat the slurry on the surface of the quartz glass sheet, and the coating thickness of the slurry is 40 microns.

[0040] Slurry drying: Transfer the quartz glass sheet coated with pure copper particle slurry to a 100°C vacuum oven, vacuumize and maintain at -1 bar, heat and dry for 10 hours, and the pure copper particle slurry on the quartz glass sheet is fully dried. A coating of pure copper particles is obtained on the support.

[0041] Heat treatment: transfer the polycrystalline silicon wafer loaded with pure copper particle coating into a tube furnace, pass argon gas for 30m...

Embodiment 3

[0044] Preparation of slurry: Weigh 0.3 g of copper oxide powder with a particle size of 40 nanometers and transfer it to an agate mortar; then add 0.4 g of N-methylpyrrolidone, mix and grind for 20 minutes to obtain a slurry of copper oxide particles. The content is 42.8%.

[0045] Slurry coating: The copper oxide particle slurry is transferred to the polycrystalline silicon wafer, and the slurry is uniformly coated on the surface of the polycrystalline silicon wafer using a doctor blade, and the coating thickness of the slurry is 20 microns.

[0046] Slurry drying: Transfer the polycrystalline silicon wafer coated with the copper oxide particle slurry to a 100°C vacuum oven, vacuumize and maintain it at -1bar, heat and dry for 10 hours, and the copper oxide particle slurry coating on the polycrystalline silicon wafer is fully dried. A copper oxide coating is obtained on the support.

[0047] Thermal reduction treatment: transfer the quartz glass sheet loaded with copper oxi...

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Abstract

The invention relates to a preparation method of foamy copper with a micron aperture, and belongs to the technical field of foam metal. The method comprises the following steps: firstly, mixing pure copper particles or copper oxide particles with a solvent to prepare slurry; coating the pure copper slurry or the copper oxide slurry on a carrier; and drying the slurry, and then carrying out heat treatment or heat reduction treatment to obtain the foamy copper with the micron aperture. The foamy copper has the advantages of being complete in structure, uniform in pore structure distribution, micron in pore diameter and controllable in thickness.

Description

technical field [0001] The invention relates to a preparation method of micron pore size copper foam, and belongs to the technical field of foam metal. Background technique [0002] Copper foam is a multi-functional material with a large number of connected or disconnected pores based on copper. It has the advantages of low density, high porosity, good thermal conductivity, and good noise reduction effect. It is widely used in construction, electrochemical and energy sector. The existing preparation methods of copper foam are mainly divided into directional solidification method, seepage casting method, dealloying method, electrodeposition method and powder metallurgy method. However, the directional solidification method has uneven pore size distribution of foam copper, inconsistent pore size and parameter control. Difficulties and other problems; seepage casting method has problems such as discontinuous copper foam structure, uneven porosity and easy to be affected by ext...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F3/11
CPCB22F3/1143
Inventor 闫康苏岳锋陈来卢赟李宁包丽颖黄擎王萌曹端云蒋晓平董锦洋石奇张洪允赵晨颖陈实吴锋
Owner BEIJING INSTITUTE OF TECHNOLOGYGY
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