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Direct-coated-sticking super thin polyimide rolled substrate material and its preparing method

A technology of polyimide roll and polyetherimide, which is applied in the field of flexible circuit roll base material and its preparation, can solve the problems of complex process and unavoidable base material, and achieve the effect of simple process and low cost

Inactive Publication Date: 2006-06-07
SHENZHEN DANBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Another non-adhesive polyimide roll substrate uses three layers of different polyimide resins, namely polyimide acid primer, thermoplastic polyimide resin, and modified phenylene or Biphenyl polyimide resin, which has been disclosed in Chinese patent CN 1269285A, but its process is very complicated, the raw material purification requirements of each polyimide resin with different structures are as high as 99.99%, the mechanical precision of the equipment and the precision of electronic control, The electric heating system, nitrogen protection drying tunnel and other aspects are also very strict. When using continuous coating process, problems such as curling, twisting and warping of the substrate cannot be avoided.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] Weigh 300g of 2,2-bis[4-dicarboxyphenoxyphenyl]propane dianhydride, 44g of polyetherimide, 170g of diaminodiphenyl ether, 40g of benzophenone tetracarboxylic dianhydride, triphenyl ether 42g of tetraformic dianhydride, 20g of p-diaminobenzene, 4g of tetraethoxysilane, 2g of diaminopolysiloxane, and 3000g of dimethylacetamide. First, add polyetherimide to 1000 g of dimethylacetamide solvent for stirring and dissolving, then add it to the reaction box in sequence, then add 1000 g of dimethylacetamide solvent, and add tetraethoxysilane at the same time. Since the amount of tetraethoxysilane is relatively small, it is necessary to add diamino-terminated polysiloxane, and then immediately pass nitrogen gas, stir with electricity until the dianhydrides are completely dissolved, then add diaminodiphenyl ether, and then add dimethyl ethyl ether. Amide solvent 1000g, dissolve and add p-diaminobenzene, because p-diaminobenzene is easy to oxidize, pay attention to anti-oxidation d...

Embodiment 2

[0032] Weigh 100g of 2,2-bis[4-dicarboxyphenoxyphenyl]propane dianhydride, 20g of polyetherimide, 100g of diaminodiphenyl ether, 40g of benzophenone tetracarboxylic dianhydride, and triphenyl ether 42g of tetraformic dianhydride, 40g of p-diaminobenzene, 8g of tetraethoxysilane, 16g of diaminopolysiloxane, and 3000g of dimethylacetamide. First, add polyetherimide to 1000 g of dimethylacetamide solvent for stirring and dissolving, then add it to the reaction box in sequence, then add 1000 g of dimethylacetamide solvent, and add tetraethoxysilane at the same time. Since the amount of tetraethoxysilane is relatively small, it is necessary to add diamino-terminated polysiloxane, and then immediately pass nitrogen gas, stir with electricity until the dianhydrides are completely dissolved, then add diaminodiphenyl ether, and then add dimethyl ethyl ether. Amide solvent 1000g, dissolve and add p-diaminobenzene, because p-diaminobenzene is easy to oxidize, pay attention to anti-oxidat...

Embodiment 3

[0041]Weigh 400g of 2,2-bis[4-dicarboxyphenoxyphenyl]propane dianhydride, 70g of polyetherimide, 300g of diaminodiphenyl ether, 40g of benzophenone tetracarboxylic dianhydride, and triphenyl ether 42g of tetraformic dianhydride, 40g of p-diaminobenzene, 15g of tetraethoxysilane, 30g of diaminopolysiloxane, and 3000g of dimethylacetamide. First, add polyetherimide to 1000 g of dimethylacetamide solvent for stirring and dissolving, then add it to the reaction box in sequence, then add 1000 g of dimethylacetamide solvent, and add tetraethoxysilane at the same time. Since the amount of tetraethoxysilane is relatively small, it is necessary to add diamino-terminated polysiloxane, and then immediately pass nitrogen gas, stir with electricity until the dianhydrides are completely dissolved, then add diaminodiphenyl ether, and then add dimethyl ethyl ether. Amide solvent 1000g, dissolve and add p-diaminobenzene, because p-diaminobenzene is easy to oxidize, pay attention to anti-oxidat...

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Abstract

An ultra-thin polyimide roll substrate that is directly coated and adhered is synthesized from aromatic dianhydride, aromatic diamine and polyimide acid alkyl ester solution containing active side groups or liquid crystal side chains Diamine participates in polycondensation, adding tetraethoxysilane and diamino-terminated polysiloxane to prepare hybrid silica polyimide resin, and then coating it on copper foil to form polyimide resin on copper foil. Imide film insulating layer is obtained. The preparation process of the roll-shaped substrate includes: spraying the hybrid polyimide resin on the rolled copper foil for three times continuously, the coating thickness is 25-30 microns, automatically changing the roll after drying in the oven, and then passing Imidization was carried out for 30 minutes under the temperature condition of 350° C. in a nitrogen oven, and then post-processing and anti-oxidation treatment were performed to obtain a roll-shaped substrate. Compared with the prior art, the preparation of the roll-shaped base material does not require an adhesive, has a simple process and low cost, and can meet the production requirements of COF ultra-micro circuits.

Description

technical field [0001] The present invention relates to a layered product composed of metal and synthetic resin, in particular to a flexible circuit roll-shaped base material with a polyimide film insulation layer formed on a copper foil and a preparation method thereof. Background technique [0002] As the requirements for ultra-micro-flexible circuits are getting higher and higher, and the accuracy of line spacing and line width is required to be below 50 microns, the polyimide substrate with adhesive in the prior art can no longer meet the requirements. At present, the line spacing and line width above 70 microns are generally used with adhesive sheet and roll materials, and the line space and line width below 70 microns are generally used without adhesive sheet lamination process to suppress the occurrence of curling. . The lamination process generally adopts a three-layer structure, which has the defects of high cost and inability to achieve ultra-thin. The insulating...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09D179/08B05D7/14
Inventor 刘萍
Owner SHENZHEN DANBOND TECH