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Epoxy resin composition

A technology of epoxy resin and composition, applied in the direction of electrical components, printed circuits, circuit substrate materials, etc., can solve the problems that the end group cannot provide cross-linking, poor heat resistance, low cross-linking density, etc., and achieve excellent Effects of flame retardancy, good solder crack resistance, and low dielectric loss factor

Inactive Publication Date: 2004-08-18
DAINIPPON INK & CHEM INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the curing reaction, the terminal group cannot provide crosslinking, so when the number of terminal groups is large, the crosslinking density in the cured product becomes low, and the heat resistance deteriorates

Method used

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  • Epoxy resin composition
  • Epoxy resin composition
  • Epoxy resin composition

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0098] 1000 ml of water and 20 g of sodium hydroxide were put into a reaction vessel, and the aromatic monohydroxy compounds and aromatic polyhydroxy compounds in the amounts shown in the column 1 of Synthesis Example 1 in Table 1 were put in a nitrogen gas stream. A Pfaudler impeller was stirred at 300 revolutions per minute for 1 hour. Then, the solution which melt|dissolved the acid halide of the aromatic polyhydric carboxylic acid of the quantity shown in Table 1 in 1000 ml of methylene chloride was dripped into the reaction container maintained at 30 degreeC over 15 seconds, and stirring was continued for 4 hours. The obtained mixed solution was allowed to stand for liquid separation, the aqueous phase was removed, the residual methylene chloride phase was washed with a 0.5% concentration of sodium hydroxide aqueous solution, and the aqueous phase was removed, and the process was repeated 3 times. Water washing and removal of the aqueous phase. After concentrating the wa...

Synthetic example 2～9

[0100] From the raw material compositions of Tables 2 to 3, it was synthesized in the same manner as in Synthesis Example 1 to obtain polyesters (A2) to (A8) and an ester compound (A9).

Synthetic example 10

[0102]400ml of tetrahydrofuran was put into the reaction vessel, 11g of triethylamine and 5.1g of resorcinol were dissolved in a nitrogen stream, and 5.1g of isophthaloyl chloride was dissolved in 100ml by dropwise addition over 30 minutes while cooling with ice. solution in tetrahydrofuran. After stirring for 4 hours, a solution of 19.9 g of p-acetoxybenzoyl chloride dissolved in 100 ml of tetrahydrofuran was added dropwise. After the dropwise addition, the solution was poured into a 5% sodium carbonate aqueous solution, and the precipitate was filtered off with suction, washed with water and methanol, and dried under reduced pressure to obtain a polyester (H1) represented by the following structural formula (in terms of polystyrene). The number average molecular weight of 2900).

[0103]

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Abstract

An epoxy resin cured article has a high glass transition temperature and low dissipation factor. An epoxy resin composition from which the cured article can be having excellent solubility in solvents is used to produce the cured articles. A polyester as a curing agent of an epoxy resin composition having an aromatic polyhydroxy coumpound residue including an aryloxycarbonyl group at the molecule of the terminal, an aromatic polyvalent hydrocarbon group residue, and bulky structure, is used. Since the curing agent behaves as a polyfunctional curing agent, a cured article produced therefrom has a high crosslink density. Since highly polar hydroxyl groups are not formed during curing, a cured article has high glass transition temperature and a low dissipation factor. The cured article does not release low molecular weight carboxylic acids though hydrolysis of ester bonds at crosslinked bonds. Since the polyester has a bulky structure, the crystallization of the molecular chain is prevented and the solubility of the epoxy resin composition containing the polyester is excellent.

Description

technical field [0001] The present invention relates to an epoxy resin composition and a cured product thereof that provide a cured product having a low dielectric loss factor and high heat resistance. Background technique [0002] Epoxy resins are widely used in the fields of electrical components and electronic components such as semiconductor packaging materials, varnishes for printed circuit boards, and resist materials because of their excellent electrical insulating properties, mechanical properties, and adhesive properties. In the fields of electric components and electronic components, as curing agents used in combination with epoxy resins, amine-based curing agents such as dicyandiamide, phenol-based curing agents such as novolak resins, and acid anhydride curing agents are generally widely used. . [0003] However, due to an increase in the amount of information communication in recent years, the high-frequency band has been used in the fields of electrical compon...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/22C08L63/00H05K1/03
CPCH05K1/0326C08G59/22C08L63/00C08L2666/18
Inventor 出村智山田雅生藤本恒一高桥胜治
Owner DAINIPPON INK & CHEM INC
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