Liquid epoxy packaging material and its preparation method and application

An epoxy sealing and liquid technology, applied in the field of high fluidity, high purity, high filling, high heat-resistant liquid epoxy sealing material, low viscosity, can solve the heat resistance of resin cured products only at 100-110 ℃ low level problem

Inactive Publication Date: 2005-03-09
INST OF CHEM CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] US Patent 6,117,953 discloses a method for preparing a liquid epoxy encapsulant for semiconductors. The liquid epoxy encapsulant is composed of bisphenol A epoxy, cycloaliphatic epoxy and its epoxy resin, anhydride curing agent, etc., the resin The glass transition temperature of the cured product is in the range of 150-160°C; US Patent 6,365,649 discloses a liquid epoxy encapsulan

Method used

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  • Liquid epoxy packaging material and its preparation method and application
  • Liquid epoxy packaging material and its preparation method and application
  • Liquid epoxy packaging material and its preparation method and application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] Embodiment 1: In the 1000ml three-neck round bottom flask, mechanical stirrer and addition funnel are installed. Add 90 parts by weight of 3,4-epoxycyclohexanecarboxylic acid 3,4-epoxycyclohexyl methyl ester, 10 parts by weight of bisphenol A type diglycidyl ether epoxy resin, 107 parts by weight of methyl hexahydro Phthalic anhydride, 1 part by weight of 2-methyl-imidazole, and 2 parts by weight of glycidoxypropyltrimethoxysilane were uniformly stirred at room temperature to obtain a homogeneous transparent liquid. Then, add 80 parts by weight of fused spherical silica powder with an average particle diameter of 0.5 micron and 310 parts by weight of fused spherical silica powder with an average particle diameter of 4.2 microns, and stir at high speed for 30 minutes at room temperature to obtain a uniformly dispersed viscous liquid epoxy encapsulant .

Embodiment 2

[0037]Embodiment 2: In the 1000ml three-neck round bottom flask, mechanical stirrer and addition funnel are installed. Add 80 parts by weight of 3,4-epoxycyclohexyl carboxylic acid 3,4-epoxycyclohexyl methyl ester, 10 parts of bis-(2,3-epoxycyclohexyl) ether, 10 parts by weight of bisphenol F type Diglycidyl ether epoxy resin, 22 parts by weight of two-(2,3-epoxycyclohexyl) ether, 111 parts by weight of methyltetrahydrophthalic anhydride, 1 part by weight of 2,4-dimethylimidazole, 2 parts by weight of glycidyloxypropyltrimethoxysilane were stirred evenly at room temperature to obtain a homogeneous transparent liquid. Then, 20 parts by weight of an average particle diameter of 0.5 microns and 378 parts by weight of fused angular silicon micropowder with an average particle diameter of 5.6 microns were sequentially added, and stirred at high speed at room temperature for 30 minutes to obtain uniformly dispersed viscous liquid epoxy encapsulants.

Embodiment 3

[0038] Embodiment 3: In the 1000ml three-neck round bottom flask, mechanical stirrer and addition funnel are installed. Add 70 parts by weight of 3,4-epoxycyclohexyl carboxylic acid 3,4-epoxycyclohexyl methyl ester, 10 parts of bis-(2,3-epoxycyclohexyl) ether, 20 parts by weight of bisphenol A type Diglycidyl ether epoxy resin, 60 parts by weight methyltetrahydrophthalic anhydride, 50 parts by weight methyltetrahydrophthalic anhydride, 2 parts by weight 2-ethyl-4-methylimidazole, 2 parts by weight Parts of γ-aminopropyltriethoxysilane were stirred evenly at room temperature to obtain a homogeneous transparent liquid. Then, 80 parts by weight of boron nitride with an average particle diameter of 0.4 microns and 318 parts by weight of silicon micropowder with an average particle diameter of 6.5 microns were sequentially added, and stirred at room temperature for 30 minutes at high speed to obtain a uniformly dispersed viscous liquid epoxy encapsulant.

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Abstract

A liquid epoxy material for packaging high-density microelectronic devices is prepared from two kinds of liquid epoxy resin, acid anhydride as solidifying agent, solidifying promoter, silane as coupling agent and two kinds of inorganic filler. Its advantages are high purity, flowability and high-temp resistance, and low viscosity and expansibility.

Description

technical field [0001] The invention relates to a high-purity, high-filling, low-viscosity, high-fluidity, high-heat-resistant liquid epoxy encapsulation compound. [0002] The present invention also relates to a preparation method of the above encapsulation compound. [0003] The packaging compound of the invention is suitable for high-density microelectronic packaging. Background technique [0004] In recent years, microelectronic packaging technology is developing in the direction of small, light and thin, suitable for various packaging forms of SMT, such as flat quadrilateral lead (QFP), thin flat quadrilateral lead (TQFP), ball array (BGA), chip Packaging forms such as level package (CSP) are developing rapidly, especially flip chip (FC)-BGA / CSP has become the technical focus of people's attention recently. FC-BGA / CSP is the packaging form with the highest packaging density at present, and the number of pins per chip can reach 1681. It is especially suitable for appli...

Claims

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Application Information

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IPC IPC(8): C09K3/10H01L23/29
Inventor 杨士勇陶志强王德生范琳
Owner INST OF CHEM CHINESE ACAD OF SCI
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