Chemical nickeling liquid and its process
A technology for electroless nickel plating and plating solution, applied in the field of chemical plating, can solve the problems of complicated process operation, increased equipment cost, inconvenient production operation, etc., and achieves the effects of easy process control operation, cost saving and low energy consumption.
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Embodiment 1
[0033] Process formula composition
[0034] Main salt: Nickelous sulfate (NiSO 4 .7H 2 O) 20g / L
[0035] Complexing agent: Sodium citrate (Na 3 C 6 h 5 o 7 .2H 2 O) 15g / L
[0036] Buffer: Ammonium chloride (NH 4 Cl) 10g / L
[0037] Reducing agent: Sodium hypophosphite (NaH 2 PO 2 .H 2 O) 20g / L
[0038] pH adjuster: Sodium hydroxide (NaOH) added to pH 7.0-8.5
[0039] Stabilizer: Thiourea ((NH 2 ) 2 CS) 1mg / L
[0040] Plating solution operation process
[0041] Temperature: 50-55, pH: 7.0-8.5. Because the temperature of the plating tank is low, sodium hydroxide can be directly added to the plating solution of the plating tank when adjusting the pH value, without additional cooling process. With the increase of the concentration of nickel salt and hypophosphite, the deposition rate gradually increased, and then tended to be stable or slightly decreased, but the stability of the solution decreased at this time. These two drugs are the main consumption component...
Embodiment 2
[0043] Process formula composition
[0044] Main salt: Nickel sulfate 30g / L Complexing agent: Sodium citrate 25g / L
[0045] Buffer: Ammonium Chloride 20g / L Reducing Agent: Sodium Hypophosphite 30g / L
[0046] pH adjuster: sodium hydroxide added to pH 7.0-8.5
[0047] Stabilizer: Thiourea 2mg / L
[0048] Plating solution operation process is the same as embodiment 1.
Embodiment 3
[0050] Process formula composition
[0051] Main salt: Nickel sulfate 25g / L Complexing agent: Sodium citrate 20g / L
[0052] Buffer: Ammonium Chloride 15g / L Reducing Agent: Sodium Hypophosphite 25g / L
[0053] pH adjuster: sodium hydroxide added to pH 7.0-8.5
[0054] Stabilizer: Thiourea 1.5mg / L
[0055] Plating solution operation process is the same as embodiment 1.
[0056] The performance of the plating layer plated by the above plating solution and process, including the thickness of the plating layer, the phosphorus content of the plating layer, the adhesion performance and other indicators, all meet the requirements.
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