Chemical nickeling liquid and its process

A technology for electroless nickel plating and plating solution, applied in the field of chemical plating, can solve the problems of complicated process operation, increased equipment cost, inconvenient production operation, etc., and achieves the effects of easy process control operation, cost saving and low energy consumption.

Inactive Publication Date: 2007-01-17
MITAC PRECISION TECH CO LTD SHUNDE DISTRICT FOSHAN CITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] For example, in the Chinese patent application, the application number is 02815773.7, which discloses a kind of electroless nickel plating bath and its method, using sodium hypophosphite Sodium hypophosphite as reducing agent, alkali metal hydroxide, alkaline earth metal hydroxide, etc. as pH adjustment Although there is no need to use ammonia water, its process operation is very complicated. Since the operating temperature is about 80-90°C, and the chemical plating solution must be cooled to below 60°C before adjustment with alkali metal hydroxide, so in this application In technology, to adjust the pH value, first of all, part of the high-temperature plating solution should be regularly or continuously removed from the plating tank, cooled to below 60°C, the pH value of the part removed from the plating solution is detected, and a pH regulator is added to adjust the pH After the value is reached, this part of the plating solution is sent back to the plating tank, which not only increases the equipment cost, but also is not convenient for production operation

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] Process formula composition

[0034] Main salt: Nickelous sulfate (NiSO 4 .7H 2 O) 20g / L

[0035] Complexing agent: Sodium citrate (Na 3 C 6 h 5 o 7 .2H 2 O) 15g / L

[0036] Buffer: Ammonium chloride (NH 4 Cl) 10g / L

[0037] Reducing agent: Sodium hypophosphite (NaH 2 PO 2 .H 2 O) 20g / L

[0038] pH adjuster: Sodium hydroxide (NaOH) added to pH 7.0-8.5

[0039] Stabilizer: Thiourea ((NH 2 ) 2 CS) 1mg / L

[0040] Plating solution operation process

[0041] Temperature: 50-55, pH: 7.0-8.5. Because the temperature of the plating tank is low, sodium hydroxide can be directly added to the plating solution of the plating tank when adjusting the pH value, without additional cooling process. With the increase of the concentration of nickel salt and hypophosphite, the deposition rate gradually increased, and then tended to be stable or slightly decreased, but the stability of the solution decreased at this time. These two drugs are the main consumption component...

Embodiment 2

[0043] Process formula composition

[0044] Main salt: Nickel sulfate 30g / L Complexing agent: Sodium citrate 25g / L

[0045] Buffer: Ammonium Chloride 20g / L Reducing Agent: Sodium Hypophosphite 30g / L

[0046] pH adjuster: sodium hydroxide added to pH 7.0-8.5

[0047] Stabilizer: Thiourea 2mg / L

[0048] Plating solution operation process is the same as embodiment 1.

Embodiment 3

[0050] Process formula composition

[0051] Main salt: Nickel sulfate 25g / L Complexing agent: Sodium citrate 20g / L

[0052] Buffer: Ammonium Chloride 15g / L Reducing Agent: Sodium Hypophosphite 25g / L

[0053] pH adjuster: sodium hydroxide added to pH 7.0-8.5

[0054] Stabilizer: Thiourea 1.5mg / L

[0055] Plating solution operation process is the same as embodiment 1.

[0056] The performance of the plating layer plated by the above plating solution and process, including the thickness of the plating layer, the phosphorus content of the plating layer, the adhesion performance and other indicators, all meet the requirements.

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Abstract

The present invention discloses a chemical nickel bath that is composed of solvable nickel salt, complexing agent, buffer, pH regulator of alkali metal hydroxide, and stabilizer. The operation temperature of the bath is 50-55DEG C, and the pH value is 7.0-8.5. This invention is a mesothermal alkali chemical nickel plating process that has low energy consumption and stable bath. Furthermore, the pH value is nearly neural and not regulated by ammonia, which saves the cost and improves the work condition.

Description

technical field [0001] The invention relates to the field of electroless plating, in particular to an electroless nickel plating solution and process. Background technique [0002] Electroless plating is a process in which metal deposition is produced through a controllable redox reaction under the catalysis of metals. It is also known as autocatalytic plating or electroless plating. [0003] To achieve electroless plating, the following conditions should be met: (1) the potential of the reducing agent in the solution to be oxidized is significantly lower than the potential of the metal ion to be reduced, so that the metal may be deposited on the substrate; (2) the prepared The solution does not spontaneously decompose, and the metal deposition process occurs only when it is in contact with the catalytic surface; (3) When the pH and temperature of the solution are adjusted, the reduction rate of the metal can be controlled, that is, the plating speed can be adjusted; (4) It...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/32
Inventor 赵顺王江锋
Owner MITAC PRECISION TECH CO LTD SHUNDE DISTRICT FOSHAN CITY
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