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High nitrogen content epoxide resin an its preparation method and uses

A technology of epoxy resin and crown ether, which is applied in the direction of fireproof coatings, etc., can solve the problems of difficult manufacture of raw material monomers, inconvenient use, and high cost, and achieve the effects of low production cost, convenient use, and simple process methods

Inactive Publication Date: 2008-12-31
康富春
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

US3547918 and "Thermosetting Resin" 1992, the cyanuric acid epoxy resin that 7 (3) introduces, nitrogen content is high, and flame retardancy is also good, but because it is solid powder, it is very inconvenient to use; Oxygen and nitrogen on the cyanuric acid ring, the curing method is also different from the general bisphenol A epoxy resin, it is difficult to cure by the usual method
Yasuhiro Tang Chuan introduced an epoxy resin of p-hydroxyphenyl cyanurate in "プラスチツクス" 1991, 42 (1). The cost is too high, and the raw material monomer is particularly difficult to manufacture. It can only be used in cutting-edge technical fields, such as aviation Aerospace, etc.

Method used

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  • High nitrogen content epoxide resin an its preparation method and uses
  • High nitrogen content epoxide resin an its preparation method and uses

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] In a 1000ml three-necked flask equipped with mechanical stirring, a thermometer, and a reflux condenser, add 100g (average number of phenolic hydroxyl groups: 2; total hydroxyl value: 0.25mol) benzomelamine-phenol-formaldehyde resin, 231.3g (2.5mol) epoxy Chloropropane and 1g tetramethylammonium chloride, react at 80°C for 5 hours; cool to room temperature, add 27.5g of 40% sodium hydroxide solution, react at 20-25°C for 8 hours, separate the water layer, and use deionized water for the organic layer Wash until neutral, and distill under reduced pressure to obtain 120 g of light yellow viscous liquid.

[0032] Viscosity (rotational viscometer method, the same below): 18000mpa.s / 25℃

[0033] Epoxy value (perchloric acid-tetraethylammonium bromide method, the same below): 264

[0034] Nitrogen content (element analysis method, the same below): 14.6%

Embodiment 2

[0036] The device is the same as in Example 1, adding 62.4g (average number of phenolic hydroxyl groups: 3; total hydroxyl value: 0.3mol) melamine-o-cresol-formaldehyde resin, 222g (2.4mol) epichlorohydrin and 1.2g tetramethyl chloride Ammonium, reacted at 80°C for 5 hours; cooled to room temperature, added 44g of 37% sodium hydroxide solution, reacted at 35-40°C for 8 hours, separated the water layer, washed the organic layer with deionized water until neutral, and distilled under reduced pressure to obtain 81g pale yellow viscous liquid.

[0037] Viscosity: 35000mpa.s / 25℃

[0038] Epoxy value: 279

[0039] Nitrogen content: 10%

Embodiment 3

[0041] The device is the same as in Example 1, adding 56.8g (average number of phenolic hydroxyl groups: 5; total hydroxyl value: 0.25mol) methyl melamine-phenol-formaldehyde resin, 277.5g (3.0mol) epichlorohydrin and 1g tetramethyl chloride Ammonium, reacted at 80°C for 5 hours; cooled to room temperature, added 36g of 30% sodium hydroxide solution, reacted at 25-35°C for 8 hours, separated the water layer, washed the organic layer with deionized water until neutral, and distilled under reduced pressure to obtain 73 g of yellow semi-solid material.

[0042] Viscosity: 22000mpa s / 70℃

[0043] Epoxy value: 290

[0044] Nitrogen content: 19.2%

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Abstract

The invention discloses an epoxy resin with high nitrogen content, its preparing process and use, wherein the epoxy resin has a structural formula disclosed in the specification, wherein n>=2, X is triazine, R is H or alkyl, the epoxy resin can be prepared from nitrogen-containing phenolic resin and excess epichlorohydrin through two-step method or one-step method. The epoxy resin can be applied into flame-proof laminated product packaging in electronic industry.

Description

technical field [0001] The invention relates to an epoxy resin, in particular to an epoxy resin used for flame-retardant materials, and also relates to a preparation method and application of the epoxy resin. Background technique [0002] Copper-clad laminates and electrical packaging materials used in the electronics industry are generally made of flame-retardant materials for safety reasons. The largest amount belongs to epoxy resin, and it is brominated epoxy resin. In addition, filled flame retardants are also used in packaging materials, such as the compound of brominated diphenyl ether and antimony trioxide, etc. [0003] Because bromine-containing compounds release corrosive gas hydrogen bromide when they burn, causing great harm to human life and property, people are increasingly inclined to use environmentally friendly materials, and it is best not to produce secondary pollution during the disposal process , that is, environmentally friendly materials. Materials ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G59/20C09K21/14
Inventor 康富春
Owner 康富春