Heat conductive insulating material and preparation method thereof

A heat-conducting insulating material and heat-conducting powder technology, applied in heat exchange materials, organic insulators, chemical instruments and methods, etc., can solve the problems of increasing thermal resistance, loss, and incompetence, reducing thermal resistance and accelerating heat transfer. Effect

Inactive Publication Date: 2008-07-23
NANJING KAIHUI IND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the use of heat-conducting silicone grease is inconvenient, and it is easy to contaminate the circuit board and cause short-circuit and other faults. After many cycles of cold and heat, it will be lost and dry, which will increase the thermal resistance instead.
The emergence of phase-change thermally conductive materials and thermally conductive gels has partially solved the problem of inconvenient use of thermally conductive silicone grease, but they, like thermally conductive silicone grease, cannot be used in occasions that require electrical insulation
Although the soft and compliant thermal conductive gap filler has certain electrical insulation properties, it still cannot be used in occasions that require high insulation, and this type of material is only suitable for applications with low pressure. It is not suitable for applications such as power supplies, gas vehicles, In case of large vibration such as generator

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] (1) Put 20g of vinyl silicone resin with a viscosity of 500cps and a hardness of 5 (shore 00) into a stirrer and stir until it is evenly mixed, and the temperature is at room temperature.

[0037] (2) Weigh 5 g of defoamer phenyl silicone oil and 5 g of white carbon black, put them into the stirrer of step (1) and stir for 20 min.

[0038] (3) Weighing 40g of alumina with an average diameter of 40 microns and impregnating it in an ethanol solution containing 1g of n-hexyltrimethoxysilane, after drying, put it into the stirrer of step (2) and vacuumize and stir for 1 hour to prepare Raw material mixture.

[0039] (4) The raw material mixture is solidified at 150°C after being pressed into tablets, and it becomes a thermally conductive insulating material after 30 minutes out.

[0040] (5) Put the thermally conductive insulating material in step (4) into a hardness testing device for testing.

[0041] (6) Put the thermally conductive insulating material in step (4) into...

Embodiment 2

[0045] (1) Put 60g of vinyl silicone resin with a viscosity of 5000cps and a hardness of 25 (shore 00) into a stirrer and stir until it is evenly mixed, and the temperature is at room temperature.

[0046] (2) Weigh 2 g of antifoaming agent methyl hydrogen-containing silicone oil, 2 g of white carbon black, and 4 g of silica powder, put them into the stirrer of step (1) and stir for 20 minutes.

[0047] (3) Weighing 80 g of boron nitride with a diameter of 40 microns, impregnating it in an ethanol solution containing 0.5 g of n-decyltriethoxysilane, drying it, and putting it into the stirrer of step (2) to vacuumize and stir for 1 hour Make a mixture of ingredients.

[0048] (4) Roll-coat the raw material mixture on a 0.1mm thick polyethylene naphthalate (PEN) film coated with an adhesion enhancer at 80°C, and then cure it at 100°C, and it will be a thermally conductive insulating material after 30 minutes. .

[0049] (5) Put the thermally conductive insulating material in s...

Embodiment 3

[0054] (1) Put 40g of vinyl silicone resin with a viscosity of 50cps and a hardness of 15 (shore 00) into a stirrer and stir until it is evenly mixed, and the temperature is at room temperature.

[0055] (2) Weigh 3 g of antifoaming agent methyl ethoxy silicone oil and 3 g of white carbon black, put them into the stirrer of step (1) and stir for 20 min.

[0056] (3) A total of 60 g of magnesia with a diameter of 40 microns and aluminum nitride of 50 microns is taken by dipping in an ethanol solution containing 1 g of n-decyltriethoxysilane, dried and put into the agitator of step (2) A raw material mixture was prepared after stirring under medium vacuum for 1 hour.

[0057] (4) Print the raw material mixture at 80°C on a corona-discharged 0.015mm thick polyimide film, and then cure it at 120°C. After 30 minutes, it will be a thermally conductive insulating material.

[0058] (5) Put the thermally conductive insulating material in step (4) into a hardness testing device for te...

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Abstract

The invention discloses a heat-conducting insulation material and a preparation method; concretely, by weight, ethylene silicone 20 to 60 portion, heat-conducting powder 40 to 80 portion, coupling agent 0.1 to 1.5 portion, antifoamer 2 to 5 portion, white carbon black 2 to 5 portion are mixed evenly, solidified and moulded to form the heat-conducting insulation material. Glass fiber or polyethylene naphthalate (PEN) or polyimide film is adopted to strengthen the penetration resistance and the tear resistance in the process of application. The insulation material is used between an electronic device and a radiator in a power supply, an automobile, a generator and other devices, can cram the unevenness surface between the electronic device and the radiator, and so reduce the thermal resistance, and accelerate the heat transfer.

Description

technical field [0001] The invention belongs to the field of organosilicon chemical industry, and relates to an insulating interface heat-conducting material and a preparation method thereof. Background technique [0002] The circuit design of modern electronic instruments and equipment is becoming more and more complex, and the integration level is getting higher and higher. Design engineers strive to install more devices in a smaller area in order to realize the miniaturization of instruments and equipment. To ensure the stable operation of these highly integrated devices, the heat generated by each electronic component must be effectively and timely transferred to the surrounding environment. The usual method is to install metal radiators with high thermal conductivity such as copper and aluminum on the surface of the device, and at the same time increase the heat dissipation area. Further, a fan is installed above the radiator to force air convection and accelerate hea...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08K13/06C08K9/06C08K3/36C08K7/20C08J7/04C09K5/14H01B3/46B32B27/28
Inventor 黄和韩毓旺欧阳金强胡学超孙鹏
Owner NANJING KAIHUI IND TECH
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