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Formaldehyde-phenol resin derivative and preparation method thereof

A technology for phenolic resins and derivatives, applied in the field of phenolic resin derivatives and their preparation, can solve the problems of phenolic resins being easy to absorb and increase in viscosity, and achieve the effects of low hydrolyzable chlorine content, low water absorption, and low ion content

Inactive Publication Date: 2008-08-27
RONGCHENG K & S CHEM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But the obtained phenolic resin is easy to oxidize, and its viscosity will increase rapidly with the prolongation of storage time

Method used

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  • Formaldehyde-phenol resin derivative and preparation method thereof
  • Formaldehyde-phenol resin derivative and preparation method thereof

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preparation example Construction

[0023] Preparation of phenolic resin derivatives. The resin provided by the present invention, when R is H, is a kind of phenolic resin, which can be prepared by condensation reaction of phenol of formula IV, phenol and biphenyl derivatives of formula V under acid catalysis; when R is of formula III When the epoxy substituent is used, it is a novolac epoxy resin, which can be prepared by epoxidizing the phenolic resin with halogenated propylene oxide. The method prepared by the invention is a kind of random copolymer, and various chain unit units are randomly arranged in the main chain of the polymer.

[0024] In the preparation process of phenolic resin, a water separator can be used to separate and remove water, alcohol and the like generated in the reaction process through a water separator, so as to promote a more complete and faster reaction; Remove the catalyst acid of the reaction system or the acid produced by the reaction, and then distill off the solvent and unreact...

Embodiment 1

[0027] Into a flask equipped with thermometer, nitrogen inlet, water trap, condenser, stirrer, add 270 g of 4,4'-bis(ethoxymethyl)biphenyl, 19 g of 4,4'-bis(ethoxy Base methyl) phenylene and 310 grams of phenol, heated under nitrogen protection, started stirring, all solids were dissolved to form a homogeneous liquid. Slowly add 1 g of p-toluenesulfonic acid to the above reaction liquid so that the liquid temperature does not exceed 50°C. Heating to raise the reaction temperature to 120°C, during which the color of the reaction solution deepened and began to boil. The by-product ethanol formed during the reaction was separated and removed with a water separator, and the reaction was stirred at 120° C. for 5 hours. After the reaction is complete, cool to room temperature; add 1000 grams of methyl isobutyl ketone to the reaction solution, mix and stir evenly; in a separatory funnel, wash the organic liquid with 300 grams of deionized water. Repeat washing until the washing liq...

Embodiment 2

[0029] Add 300 g of 4,4'-bis(propoxymethyl)biphenyl, 19 g of 4,4'-bis(ethoxy Base methyl) phenylene and 310 grams of phenol, heated under nitrogen protection, started stirring, all solids were dissolved to form a homogeneous liquid. Slowly add 1 g of p-toluenesulfonic acid to the above reaction liquid so that the liquid temperature does not exceed 50°C. Heating to raise the reaction temperature to 120°C, during which the color of the reaction solution deepened and began to boil. The by-products ethanol and propanol formed during the reaction were separated and removed by a water separator, and the reaction was stirred at 120° C. for 5 hours. After the reaction is complete, cool to room temperature; add 1000 grams of methyl isobutyl ketone to the reaction solution, mix and stir evenly; in a separatory funnel, wash the organic liquid with 300 grams of deionized water. Repeat washing until the washing liquid is neutral. Separate the organic phase and dry it; remove the solvent...

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Abstract

The invention discloses a phenolic resin derivant and a preparation process thereof. The phenolic resin derivant which is provided by the invention is a random array copolymer of a structural unit showed in formula I and a structural unit showed in formula II, and the sum of chain link units of the structural units in formulas I and II is 1-10, and the softening point of the phenolic resin derivant is 45-140 DEG C, wherein R is H or a substituent base in the structure of formula III. The phenolic resin whose main chain comprises biphenyl group and phenylene group and novolac epoxy whose main chain comprises biphenyl group and phenylene group have the advantages of low softening point, low melt viscosity, low ion content and low hydrolysable chlorine content and the like. A resin compound which is formed through hot curing has the advantages of excellent flame-retarding performance, and low water absorption ratio and wonderful fire-resisting property, which can be extensively applied on epoxy liquid molding compound of integrated circuits, base resin of composite material and molding compound and the like.

Description

technical field [0001] The invention relates to a phenolic resin derivative whose main chain contains a biphenyl group and a phenylene group and a preparation method thereof. Background technique [0002] With the rapid development of integrated circuits (ICs) towards high performance, multi-function, low cost, and green direction, epoxy resin materials for microelectronic packaging are also developing towards high heat resistance, high humidity resistance, oxidation resistance, chemical corrosion resistance, high Bonding, broadband, low dielectric, low moisture absorption, lead-free, bromine-free and green. And phenol aralkyl novolac resin as curing agent or further manufactured into epoxy resin can meet the above requirements; [0003] Traditional epoxy packaging materials generally use novolac resin and o-cresol novolac epoxy resin as the matrix resin, but the resin composition has poor heat resistance and moisture resistance, and the cured product is brittle, and it is ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G8/10C08G8/24
Inventor 王超
Owner RONGCHENG K & S CHEM
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