GaN dual heterogeneity node field effect transistor structure and its making method
A field effect transistor, gallium nitride based technology, applied in the fields of semiconductor/solid state device manufacturing, semiconductor devices, electrical components, etc. Problems such as the adverse effect of electron gas transport performance and device performance, to achieve the effect of reducing electron scattering, suppressing current collapse effect, and improving mobility
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[0058] The present invention is a gallium nitride-based double heterojunction field effect transistor structure using a double aluminum nitride insertion layer. Between the channel layer and the aluminum (indium) gallium nitride barrier layer, and between the gallium nitride-based channel layer and the gallium nitride high-resistance buffer layer, insert thin layers of aluminum nitride to form a double heterogeneous field effect Transistor structure, through precise control of growth conditions, such as temperature, pressure, V / III ratio, high-quality gallium nitride-based double heterojunction field effect transistor structure materials are grown. Double aluminum nitride inserted into the thin layer can further increase the barrier height on both sides of the channel layer, which can better confine the two-dimensional electron gas in the channel layer, and effectively limit the flow of electrons to the aluminum (indium) gallium nitrogen barrier. layer and GaN buffer layer lea...
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