Nickel plating method for surface of silicon nanowires
A technology of silicon nanowires and nickel plating, which is applied in the field of semiconductor microelectronics and nanoelectronics, can solve the problems of interface electromigration size effect, which cannot meet the shrinkage of device size, etc., and achieve the reduction of resistivity, contact resistance and performance and good structure
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[0020] Example 1
[0021] (1) Preparation of silicon nanowires by thermal evaporation of SiO
[0022] The experimental device is a low vacuum tube furnace (Hefei Kejing, GSL-1400X vacuum tube furnace), which consists of a tube heating furnace with a length of 75cm, a corundum tube with a diameter of 60cm and a length of 120cm, a bipolar vacuum pump, and a gas flow meter. , The vacuum of the equipment can reach 10 -2 torr. Before the experiment, the quartz boat was cleaned with acetone and alcohol, rinsed with deionized water and dried, and then pushed into the end of the tube furnace. At the same time, a small porcelain boat containing SiO was pushed into the middle of the tube furnace, and the two ends were sealed and pumped. Vacuum for 30 minutes, at this time the vacuum in the furnace reaches 10 -2 torr, after the tube furnace reaches 800°C at a heating rate of 15°C / min, Ar gas (purity: 99.999%) is introduced into the furnace at a flow rate of 60sccm, and the furnace tube is ra...
Example Embodiment
[0029] Example 2
[0030] The preparation and pretreatment of silicon nanowires are the same as in Example 1. The silicon nanowires from which the silicon oxide layer is removed are dispersed on a polished silicon wafer after being ultrasonically dispersed. An argon ion sputtering device (Denton Discovery-18 sputtering system) is used as the sputtering equipment. , The vacuum degree of the sputtering system is 5×10 -6 Torr, nickel-plated silicon nanowires on the surface with HF treatment with a sputtering power of 9.1W; set the sputtering time to 240s, and the results are as follows image 3 Shown; the surface of the sputtered silicon nanowire is covered by amorphous nickel particles, and on this basis it is annealed. Annealing is carried out in a tube furnace (Hefei Kejing, GSL-1400X vacuum tube furnace), and the vacuum degree in the furnace tube is drawn to 10 with a mechanical pump before the annealing temperature rises. -2 torr, then charge 5×10 4 Pa Ar gas is protective gas a...
Example Embodiment
[0031] Example 3
[0032] The preparation and pretreatment of silicon nanowires are the same as in Example 1. The silicon nanowires from which the silicon oxide layer is removed are dispersed on a polished silicon wafer after being ultrasonically dispersed. An argon ion sputtering device (Denton Discovery-18 sputtering system) is used as the sputtering equipment. , The vacuum degree of the sputtering system is 10 -6 Torr, nickel-plated silicon nanowires treated with HF at a sputtering power of 9.1W; set the sputtering time to 270s, and the results are as follows Figure 4 Shown; the surface of the sputtered silicon nanowire is covered by amorphous nickel particles, and on this basis it is annealed. Annealing is carried out in a tube furnace (Hefei Kejing, GSL-1400X vacuum tube furnace), and the vacuum degree in the furnace tube is drawn to 10 with a mechanical pump before the annealing temperature rises. -2 torr, then charge 1×10 5 Pa Ar gas is protective gas and carrier gas, Ar f...
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