Halogen and phosphor-free flame-proof epoxy resin composition and bonding sheet and copper clad laminate prepared thereby

Abstract

The invention relates to a halogen-free non-phosphate fire-retardant epoxy resin composition and a bonding sheet and a copper-clad laminate which are manufactured by the same. The resin composition consists of compositions and a solvent, wherein the compositions comprise biphenyl epoxy resin, a composite curing agent and filler; and the composite curing agent consists of benzoxazine resin, azotic phenol-formaldehyde resin and diaminodiphenylsulfone. The copper-clad laminate which is manufactured by the resin composition comprises a laminate and metal foils which are covered on one side or both sides of the laminate, wherein the laminate comprises a plurality of adhered bonding sheets which are manufactured by the halogen-free non-phosphate fire-retardant epoxy resin composition. The resin composition does not contain halogen and phosphor element, and the fire resistance reaches UL94V-0 level; and the bonding sheet and the copper-clad laminate which are manufactured by the resin composition have high heat resistance, high reliability, high glass-transition temperature, flame retardancy, low water absorption rate, low dielectric loss, low thermal expansion coefficient and good processability.

Description

technical field [0001] The invention relates to an epoxy resin composition, an adhesive sheet and a copper-clad laminate made of it, in particular to a halogen-free and phosphorus-free flame-retardant epoxy resin composition, and a printed circuit made of it Adhesive sheets and copper clad laminates. Background technique [0002] Traditional copper-clad laminates for printed circuits mainly use brominated epoxy resin, and bromine is used to realize the flame-retardant function of the board. However, in recent years, carcinogens such as dioxin and dibenzofuran have been detected in the combustion products of electronic and electrical equipment wastes containing halogens such as bromine and chlorine, and highly toxic substances may be released during the combustion process of halogen-containing products hydrogen halide. On July 1, 2006, the EU's two environmental protection directives "Regarding Waste Electrical and Electronic Equipment" and "Restricting the Use of Certain H...

AI Technical Summary

Problems solved by technology

[0003] At present, there are two main technical approaches to realize halogen-free flame retardancy of copper-clad laminates. The first approach uses phosphorus-containing epoxy resin as the main resin, and then uses dicyandiamide or phenolic resin as the curing agent, adding a certain amount Aluminum hydroxide and other inorganic fillers, using dicyandiamide as the curing agent for phosphorus-containing epoxy resin, the board has poor heat resistance and high water absorption; using phenolic resin as the curing agent for phosphorus-containing epoxy resin, the surface of the adhesive sheet Poor appearance, the brittleness of the plate is large, and the processability is poor

The second way is to use benzoxazine resin as the main resin, add an appropriate amount of phosphorus-containing epoxy resin or a phosphorus-containing, nitrogen-containing curing agent, and then add an appropriate amount of organic or inorganic fillers. The benzoxazine resin has good Excellent heat resistance and low water absorption, but high brittleness and poor processing performance of the plate

[0004] Japanese Patent Laid-Open No. 61-148619 discloses the preparation of phosphorus-containing compound flame retardants by combining phosphorus atoms on aliphatic compounds, which are used in the preparation of halogen-free copper-clad laminates, which improves the flame retardancy, but the heat resistance and moisture resistance are not good. it is good

In addition, phosphorus is used for flame retardancy, and various intermediates and production processes of phosphorus-based flame retardants have certain toxicity; phosphorus-based flame retardants may produce toxic gases (such as methylphosphine) and toxic substances ( such as triphenylphosphine, etc.), and its waste may cause potential harm to the aquatic environment

Images