Preparation method of nano nickel copper zinc ferrite powder

Abstract

The invention relates to a method for preparing nano-scale nickel-copper-zinc-iron oxide powder, which comprises the following steps: using nickel sulfate, copper sulfate, zinc sulfate and ferrous sulfate as raw materials, ammonium oxalate as co-precipitation agent, high molecular material plasmosan as dispersant, deionized water as solvent and anhydrous ethyl alcohol as washing agent to prepare nickel sulfate solution, copper sulfate solution, zinc sulfate solution, ferrous sulfate solution and ammonium oxalate solution through selecting chemical substances; and under the heating state at the temperature of 50 DEG C in a water bathtub, in four flasks, dripping the plasmosan solution and the nickel-copper-zinc-iron mixed solution into the ammonium oxalate solution, stirring the mixture by magnetic force, and mixing the solutions fully to prepare co-precipitation solution, and finally obtaining the nano-scale nickel-copper-zinc-iron oxide powder through vacuum filtering, washing, filtering, vacuum drying and calcining at the temperature of 800 DEG C, wherein the particle diameter of the powder is 50 to 80 nanometers, and the saturation intensity is 52eum / g. The method has the advantages of short process flow, high yield up to 98.33 percent and good product purity, and can be used for manufacturing sheet type devices of electronic elements.

Description

technical field [0001] The invention relates to a preparation method of nickel-copper-zinc ferrite powder, which belongs to the technical field of preparation of chip inductor material for electronic components. Background technique [0002] Soft magnetic ferrite material is the earliest and most widely used ferrite material. With the application and continuous improvement of microelectronic circuits and surface mount technology SMT, electronic products are becoming lighter, thinner and shorter. , Small aspects of development, the miniaturization of electronic equipment, will inevitably involve the miniaturization of electronic components. [0003] Chipping of resistors and capacitors as passive electronic components is the most widely used and fastest-growing technology. Chip devices can not only miniaturize electronic products, but also realize high automation of the whole machine. The application of chip devices , the manufacturing method of electronic products has under...

AI Technical Summary

Problems solved by technology

[0004] The size of electronic chip devices is getting smaller and smaller, and the size of multilayer capacitors and resistors has reached the level of 1005 (1.0×0.5mm) models, but the development of electromagnetic coils is slow, and it has only developed from 3216 (3.2×1.6mm) models to 2012 model, this is because the laminated electromagnetic coil is composed of metal silver wire and soft ferrite material, and the internal silver wire and ferrite are sintered at the same time, which is prone to problems such as disconnection, voids and magnetic weakening, so it must be sintered at low temperature. It can be completed, and the commonly used low temperature reduction method sacrifices more magnetic properties. As the main dielectric material used in medium and high frequency chip inductors - nickel copper zinc ferrite has received widespread attention from domestic and foreign academic circles. At present, there are still many disadvantages and deficiencies in the preparation of nickel-copper-zinc ferrite soft magnetic materials by low-temperature sintering

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