Preparation of conductive titanium nitride/silicon nitride nano composite material
A nano-composite material, silicon nitride technology, applied in the direction of nitrogen compounds, chemical instruments and methods, inorganic chemistry, etc., can solve the problems of high cost, high brittleness, difficult processing, etc., and achieve simple process, easy composition, and fine particles Effect
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example 1
[0041] Example 1 Co-precipitated TiN / Si 3 N 4
[0042] Design TiNvol% = 40, raw material: TiCl 4 5 g; SiCl 4 5.8 grams; reducing agent: Na 5.7 grams
[0043] Preparation and post-treatment process parameters are:
[0044] ammoniation temperature ammoniation time temperature reflex Reaction time 0℃ 12 hours -40℃ 2 hours
[0045] Ammonia wash temperature
Ammonia washing times
heat treatment gas
atmosphere heat treatment temperature
-45℃ 100 times vacuum 950℃ 2 hours
[0046] The SPS parameter control is:
[0047] Sintering temperature
example 2
[0048] Example 2 Co-coated TiN / Si 3 N 4
[0049] Design TiNvol%=15, wherein the volume percentage of TiN in the nanocomposite powder is 50%, and the volume percentage of the nanocomposite powder is 30%. Raw material: TiCl 4 5 g; SiCl 4 5.8 g; Si 3 N 4 4.56 grams; reducing agent: Na 5.7 grams
[0050]
[0051] The SPS parameter control is:
[0052] Sintering temperature
Spend
Heating rate
put pressure on
1500℃
100°C
/ min
50MPa
3 minutes
[0053] The density of the sintered body material obtained by the above-mentioned preparation process is different according to the difference of the sintering temperature, the holding time and the applied pressure, and it is all above 95% within the parameter control range of the present invention. When the TiN content is only 15vol% in Example 1, The resistivity of the sintered body was reduced to 1.51×10 -3 Ω·cm, which can meet the re...
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