Preparation method of self-assembled sulfonic acid group silane-titanium dioxide composite film on monocrystalline silicon substrate surface
A technology of sulfonic acid silane and titanium dioxide, which is applied in the field of thin film preparation, can solve the problems of long film forming cycle and achieve the effects of low cost, simple configuration and uniform distribution
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Embodiment 1
[0019] Pre-treat the monocrystalline silicon wafer, soak the monocrystalline silicon wafer in aqua regia, heat the aqua regia with an electric furnace for 5 hours, and naturally cool it at room temperature for 8 hours, take out the monocrystalline silicon wafer, and use a deionized Rinse repeatedly with water and dry in a desiccator;
[0020] Immerse the treated monocrystalline silicon wafer in the prepared mercaptosilane solution, let it stand for 8 hours, take it out, wash it with acetone, chloroform and deionized water respectively, dry it with nitrogen, place it in nitric acid solution, and set it at 80 React at ℃ for 2 hours, take it out and wash it with a large amount of deionized water, and oxidize the terminal sulfhydryl group into a sulfonic acid group in situ.
[0021] The substrate with the sulfonic acid silane film on the surface is placed in the prepared titanium dioxide self-assembly solution, and assembled at 80°C for 12 hours to obtain the sulfonic acid silane-...
Embodiment 2
[0028] Embodiment 2: the preparation process of this embodiment is the same as embodiment 1.
[0029] The molar concentration of the components of the mercaptosilane assembly solution used in this embodiment is: 0.3 mmol / L of mercaptosilane, and the solvent is benzene solution.
[0030] The concentration of the nitric acid solution for in-situ oxidation of sulfhydryl groups to sulfonic acid groups is: 40%.
[0031] The component weight percent of titania self-assembly solution is:
[0032] Ethanol content: 83%, titanate: 3.5%, ethylenediaminetetraacetic acid: 1%, ammonium chloride: 2%, urea: 10%, concentrated hydrochloric acid: 0.5%.
[0033] The characterization means in Example 1 were used to evaluate the film quality.
[0034] The results show that the thickness of the organic film self-assembled on the single crystal silicon wafer is between 5-8nm, and the film thickness of the composite film is between 15-40nm. The XPS spectrum shows that the composite film self-assemb...
Embodiment 3
[0035] Embodiment 3: the preparation process of this embodiment is the same as embodiment 1.
[0036] The molar concentration of the components of the mercaptosilane assembly solution used in this embodiment is: 1 mmol / L of mercaptosilane, and the solvent is benzene solution.
[0037] The concentration of the nitric acid solution for in-situ oxidation of sulfhydryl groups to sulfonic acid groups is: 60%.
[0038] The component weight percent of titania self-assembly solution is:
[0039] Ethanol content: 70%, titanate: 5%, ethylenediaminetetraacetic acid: 4%, ammonium chloride: 5%, urea: 15%, concentrated hydrochloric acid: 1%.
[0040] Adopt the experimental instrument in embodiment 1 to evaluate thin film, the result of characterization shows: the result shows that the organic thin film film thickness that self-assembles on single crystal silicon chip is between 5~7nm, and the film thickness of composite film is between 15~50nm between. The XPS pattern shows that the merc...
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