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Silicon tiny powder surface treating and modifying method, epoxy resin combination and preparation method thereof

A surface treatment, epoxy resin technology, applied in the field of integrated circuit packaging material preparation, can solve the problems of poor comprehensive EMC performance, decreased EMC fluidity, and insignificant improvement in fluidity, and achieves increased filling amount, improved mechanical properties and thermal conductivity. properties, and the effect of reducing water absorption and coefficient of thermal expansion

Inactive Publication Date: 2009-12-09
BEIJING INSTITUTE OF PETROCHEMICAL TECHNOLOGY +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The main disadvantage of increasing the filling amount of microsilica powder is that the fluidity of EMC is greatly reduced, which is not conducive to the packaging and molding process
The traditional method is to use silane coupling agent to treat silicon micropowder, but this method does not significantly improve the fluidity of EMC, especially when the content of silicon micropowder is higher than 80%, the fluidity of EMC is worse. Poor overall performance

Method used

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  • Silicon tiny powder surface treating and modifying method, epoxy resin combination and preparation method thereof
  • Silicon tiny powder surface treating and modifying method, epoxy resin combination and preparation method thereof
  • Silicon tiny powder surface treating and modifying method, epoxy resin combination and preparation method thereof

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Embodiment 1

[0024] An embodiment of the present invention provides a method for modifying the surface of silicon micropowder by plasma treatment, which can prepare plasma-coated modified silicon micropowder. The silicon micropowder can be used to manufacture epoxy resin compositions for packaging large-scale integrated circuits. The method includes:

[0025] Under the vacuum condition of 50Pa~100Pa, use radio frequency plasma discharge with radio frequency of 13.56MHz to polymerize any monomer or any mixture of monomers in pyrrole, 1,3-diaminopropane, acrylic acid and urea Coating on the surface of silicon micropowder to obtain modified silicon micropowder. The discharge power of the RF plasma is 100-120W, and the discharge time is 60-80s.

[0026] Combine below figure 1 Described reaction device, the above-mentioned modification method to silicon micropowder surface treatment is described further:

[0027] The silicon micropowder can be cleaned first: specifically, the surface cleaning...

Embodiment 2

[0032] This embodiment 2 provides an epoxy resin composition, specifically using the silicon micropowder prepared in the above embodiment 1 as a raw material, the prepared epoxy resin composition can be used for large-scale integrated circuit packaging, the epoxy resin composition include:

[0033] Get each raw material by following mass ratio:

[0034] 10-30 parts by mass of epoxy resin

[0035] Curing Accelerator 5-25 parts by mass

[0036] 100-150 parts by mass of the modified silicon micropowder prepared by any one of the above-mentioned claims 1-7

[0037] Imidazole curing accelerator 0.1-2 parts by mass

[0038] Toughener 2~10 parts by mass

[0039] Lubricant 0.5-5 parts by mass

[0040] The epoxy resin composition is obtained by mixing silicon micropowder with epoxy resin, curing agent, imidazole curing accelerator, lubricant, toughening agent, etc., kneading, pulverizing and degaussing.

[0041] In the above epoxy resin composition, the epoxy resin is o-cresol no...

Embodiment 3

[0047] This embodiment provides a method for surface treatment and modification of silicon micropowder, which can be figure 1 Shown reaction unit, this method is specifically as follows:

[0048] In the reaction bottle of reaction device, add 10g spherical microsilica powder (particle diameter D 50 = 10 microns), pump the reaction bottle to a vacuum of 50Pa ~ 60Pa, open the argon Ar inlet valve to feed argon Ar into the reaction bottle, and keep the vacuum in the reaction bottle at 50Pa ~ 50Pa by adjusting the Ar inlet valve. 60Pa, start the discharge of the spherical silicon micropowder, stop the discharge after 5min, turn off the vacuum pump and the argon Ar inlet valve, let it into the atmosphere, return the reaction bottle of the reaction device to normal pressure, add 1g of 1,3-diamine propane monomer, and stir it evenly with a glass rod; re-evacuate the reaction bottle of the reaction device to a vacuum of 50Pa ~ 60Pa, open the argon Ar inlet valve to feed argon Ar, and...

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Abstract

The invention discloses a silicon tiny powder surface treating and modifying method, epoxy resin combination and a preparation method thereof. The method comprises the following steps: using radio frequency plasma with the radio frequency of 13.56MHz for discharging so as to lead monomer to polymerize and encapsulate on the surface of the processed silicon tiny powder, thus obtaining the plasma polymerization and encapsulation modified silicon tiny powder. The method for preparing epoxy resin combination by the modified silicon tiny powder comprises the following steps: mixing the modified silicon tiny powder, epoxy resin, firming agent, benzimidazoles curing accelerator, lubricant, flexibilizer and the like, then milling, pulverizing, demagnetizing to obtain the epoxy resin combination. The epoxy resin combination prepared by the method in the invention can be used for preparing encapsulation moulding compound (EMC) for large scale integrated circuits, thus greatly improving the bend strength and impact strength, lowering CTE and water absorption rate and enormously enhancing the comprehensive performance of the EMC.

Description

technical field [0001] The invention relates to the field of preparation of integrated circuit packaging materials, in particular to a silicon micropowder surface treatment modification method, an epoxy resin composition and a preparation method thereof. Background technique [0002] Epoxy resin has excellent physical and mechanical properties and electrical properties, and has a good cost performance ratio, so it is widely used as coatings, adhesives, composite resin matrix, electronic packaging materials, etc. Especially in the packaging of electronic components and integrated circuits (ICs), epoxy resin has played a great role. At present, more than 95% of electronic components and integrated circuits are packaged with epoxy resin composite materials. The matrix resin used is mainly o-cresol novolac epoxy resin, and the filler used is mainly silicon micropowder. [0003] With the development of integrated circuits towards ultra-large-scale, high-density, high-power, hig...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09C1/28C09C3/10C08K9/04C08K3/34C08L63/00C08J3/12C08J3/20
Inventor 杨明山李林楷何杰罗海平张建国
Owner BEIJING INSTITUTE OF PETROCHEMICAL TECHNOLOGY
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