Flexible integrated ultrasonic transducer and preparation method thereof

An ultrasonic transducer and flexible technology, applied in the directions of sound-producing equipment, semiconductor/solid-state device manufacturing, instruments, etc., can solve the problems of low gain and low signal-to-noise ratio, and achieve the effect of improving sensitivity, reducing manufacturing cost and expanding the scope of application

Inactive Publication Date: 2010-11-24
SOUTH CHINA UNIV OF TECH
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

Existing flexible ultrasonic transducers realize the flexibility of the transducer by assembling the ultrasonic transducer unit on a

Method used

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  • Flexible integrated ultrasonic transducer and preparation method thereof
  • Flexible integrated ultrasonic transducer and preparation method thereof

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Embodiment Construction

[0026] The flexible integrated ultrasonic transducer of the present invention is structurally integrated with an organic thin film transistor and a piezoelectric sensor. Substrate 1, silicon dioxide isolation layer 2, source and drain electrodes 3, organic semiconductor film layer 4, gate dielectric layer 5, gate electrode layer 601, epoxy resin film layer 701, polyvinylidene fluoride PVDF piezoelectric film layer 8 , upper electrode layer 602 and epoxy resin film layer 702.

[0027] The preparation method of the flexible integrated ultrasonic transducer of the present invention is carried out according to the following steps:

[0028] (1) Preparation of moisture-proof isolation layer: Magnetron sputtering can be used to deposit silicon dioxide (SiO2) on a flexible substrate of polyethylene terephthalate (PET). 2 )film;

[0029] (2) preparation of an organic thin film transistor, the steps of which include:

[0030] Step 1: Depositing a metal thin film layer on the substrat...

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Abstract

The invention discloses a flexible integrated ultrasonic transducer, which is integrated by an organic thin-film transistor and a piezoelectric sensor. The flexible integrated ultrasonic transducer consists of a substrate, a moisture-proof isolation layer, a source drain electrode, a semiconductor thin-film layer, a gate dielectric layer, a gate electrode layer, an electrical signal coupling layer, a piezoelectric film layer, an electrode layer and an ultrasonic coupling layer in turn. In order to conveniently prepare a two-dimensional flexible ultrasonic transducer array, a layer of silicon dioxide thin film is deposited on a PET substrate and is used for isolating moisture. The piezoelectric material serving a PVDF thin film of an ultrasonic transducer has the advantages of good piezoelectric performance, low acoustic impedance, and good acoustic impedance matching with water and organisms. Therefore, the sensitivity is improved and the frequency band is widened. High flexibility ofthe PVDF thin film provides good technical basis for integrating the piezoelectric sensor. By adopting the organic thin-film transistor as a built-in signal amplifier, the gain and signal-to-noise ratio are increased, and the anti-jamming capability is improved.

Description

technical field [0001] The invention relates to the technical field of non-destructive testing. Specifically, it is a flexible integrated ultrasonic transducer and a preparation method thereof. Background technique [0002] The ultrasonic transducer is a component that realizes the mutual conversion of sound energy and electrical energy. It can not only convert ultrasonic waves into electrical signals, but also convert electrical signals into ultrasonic waves. Ultrasonic transducers are key components in ultrasonic technology and are widely used in medical diagnosis, underwater communication and detection, non-destructive testing of defects, ranging and positioning, remote sensing and remote control and other fields. [0003] Piezoelectric ultrasonic transducers are the mainstream of ultrasonic transducers, especially piezoelectric thin-film ultrasonic transducers are obtained because of their miniaturization, good impulse response, and the ability to effectively improve th...

Claims

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Application Information

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IPC IPC(8): H01L27/28H01L21/77G10K9/125G10K11/00
Inventor 刘玉荣姚若河韦岗
Owner SOUTH CHINA UNIV OF TECH
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