Low-temperature chemical Ni-Cu-P plating solution and chemical Ni-Cu-P plating method applying the solution

A low-temperature chemical, ni-cu-p technology, applied in the direction of liquid chemical plating, metal material coating process, coating, etc., can solve the problem of not applying low-carbon steel substrate surface, etc., to improve the working environment conditions, Excellent hardness and wear resistance, the effect of reducing equipment investment

Inactive Publication Date: 2011-08-31
SHANDONG JIANZHU UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, ultrasonic electroless plating of Ni-Cu-P has been applied to matrix materials such as organic polymers, but so far there has been no report on the surface of low-carbon steel substrates.

Method used

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  • Low-temperature chemical Ni-Cu-P plating solution and chemical Ni-Cu-P plating method applying the solution
  • Low-temperature chemical Ni-Cu-P plating solution and chemical Ni-Cu-P plating method applying the solution
  • Low-temperature chemical Ni-Cu-P plating solution and chemical Ni-Cu-P plating method applying the solution

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0065] A kind of low temperature chemical plating Ni-Cu-P solution, the prescription of this solution is: nickel sulfate 35g / L, copper sulfate 0.2g / L, sodium hypophosphite 25g / L, sodium acetate 8g / L, trisodium citrate 25g / L L, lactic acid 22ml / L, succinic acid 8g / L, glycine 0.01g / L, ammonium bifluoride 0.2g / L, potassium iodide 8mg / L, thiourea 1.5mg / L.

[0066] The specific configuration steps are:

[0067] (1) Accurately weigh each solid drug according to the above solution formula and dissolve it with a small amount of distilled water;

[0068] (2) the solution of nickel sulfate and copper sulfate is poured in the solution containing complex trisodium citrate, lactic acid, succinic acid and glycine under constant stirring;

[0069] (3) Add reducing agent sodium hypophosphite solution and stir and pour into (2) solution;

[0070] (4) Pour the stabilizing agent potassium iodide, thiourea and buffering agent sodium acetate solution into (3) solution under sufficient stirring r...

Embodiment 2

[0081] A kind of low temperature chemical plating Ni-Cu-P solution, the prescription of this solution is: nickel sulfate 35g / L, copper sulfate 0.2g / L, sodium hypophosphite 25g / L, sodium acetate 10g / L, trisodium citrate 30g / L L, lactic acid 28ml / L, succinic acid 10g / L, glycine 0.01g / L, ammonium bifluoride 0.2g / L, potassium iodide 8mg / L, thiourea 1.5mg / L.

[0082] The specific configuration steps are:

[0083] (1) Accurately weigh each solid drug according to the above solution formula and dissolve it with a small amount of distilled water;

[0084] (2) the solution of nickel sulfate and copper sulfate is poured in the solution containing complex trisodium citrate, lactic acid and succinic acid under constant stirring;

[0085] (3) Add reducing agent sodium hypophosphite solution and stir and pour into (2) solution;

[0086] (4) Pour the stabilizing agent potassium iodide, thiourea and buffering agent sodium acetate solution into (3) solution under sufficient stirring respecti...

Embodiment 3

[0097] A kind of low temperature chemical plating Ni-Cu-P solution, the formula of this solution is: nickel sulfate 35g / L, copper sulfate 0.4g / L, sodium hypophosphite 30g / L, sodium acetate 8g / L, trisodium citrate 25g / L L, lactic acid 28ml / L, succinic acid 10g / L, glycine 0.01g / L, ammonium bifluoride 0.2g / L, potassium iodide 8mg / L, thiourea 1.5mg / L.

[0098] The specific configuration steps are:

[0099] (1) Accurately weigh each solid drug according to the above solution formula and dissolve it with a small amount of distilled water;

[0100] (2) the solution of nickel sulfate and copper sulfate is poured in the solution containing complex trisodium citrate, lactic acid and succinic acid under constant stirring;

[0101] (3) Add reducing agent sodium hypophosphite solution and stir and pour into (2) solution;

[0102] (4) Pour the stabilizing agent potassium iodide, thiourea and buffering agent sodium acetate solution into (3) solution under sufficient stirring respectively; ...

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Abstract

The invention relates to chemical plating on the surface of a metal material, in particular to a low-temperature ultrasonic wave assisted chemical Ni-Cu-P plating solution used for the surface of a low-carbon steel base material as well as a chemical Ni-Cu-P plating method. The characteristics include adopting nickel sulfate and copper sulfate as the main salt of the plating solution, sodium hypophosphite as a reducing agent, sodium acetate as a buffer, trisodium citrate and lactic acid as complexing agents, succinic acid and glycine as well as ammonium hydrogen fluoride as combined accelerators, potassium iodide and thiourea as stabilizers to prepare the chemical Ni-Cu-P plating solution, and applying the chemical Ni-Cu-P plating solution on the surface of a low-carbon steel substrate by low-temperature ultrasonic wave chemical plating. In the invention, the formula of the plating solution is environment-friendly, meets the environment-friendly requirement of clean production and reduces pollution to environment. The method for chemically plating Ni-Cu-P on the surface of the low-carbon steel substrate obviously lowers the plating application temperature, enables the deposition speed to be fast and effectively improves the performance of the low-carbon steel substrate.

Description

technical field [0001] The invention relates to electroless plating on the surface of metal materials, in particular to an ultrasonic-assisted electroless Ni-Cu-P plating solution and a method for electroless Ni-Cu-P plating on the surface of a low-carbon steel base material at low temperature. Background technique [0002] Adding copper salt to the electroless Ni-P binary alloy solution can generate a Ni-Cu-P alloy coating. Compared with the Ni-P alloy coating, the electroless Ni-Cu-P ternary alloy coating is uniform and dense, and has a more High corrosion resistance, electrical conductivity, extremely good wear resistance and some special physical properties, such as high resistivity, small temperature coefficient of resistance, antimagnetic, etc., its application fields are expanding, especially in petrochemical, automobile, electronic equipment It has great potential in industries such as precision instruments and instrument parts. [0003] In recent years, many docume...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/50
Inventor 孙华马洪芳冯立明刘科高罗辉王玥
Owner SHANDONG JIANZHU UNIV
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