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Etching liquid composition for nickel or nickel/copper alloy

A technology of etching solution and composition, which is applied in the field of microstructure etching, can solve the problems of poor stability of working solution, large copper corrosion, and low nickel etching rate, etc., and achieve the effect of reducing corrosion

Inactive Publication Date: 2011-11-02
西安东旺精细化学有限公司
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  • Abstract
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Problems solved by technology

[0003] The present invention aims to provide a nickel or nickel / copper alloy etching solution composition to solve the problems of low nickel etching rate or large copper corrosion and poor stability of working fluid in the prior art

Method used

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  • Etching liquid composition for nickel or nickel/copper alloy
  • Etching liquid composition for nickel or nickel/copper alloy

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Embodiment Construction

[0033] The etching solution composition of the present invention is an etching solution containing inorganic acid, hydrogen peroxide and water, wherein the inorganic acid is nitric acid or sulfuric acid or a mixed solution of nitric acid and sulfuric acid; the etching solution composition also contains ammonium salt, aromatic Amines and nitro compounds.

[0034] Ammonium salt has the function of adjusting the concentration of H+. As a specific example of ammonium salt, it can be selected from ammonium sulfate, ammonium bisulfate, ammonium nitrate, ammonium carbonate, ammonium bicarbonate, ammonium formate, ammonium acetate, ammonium benzoate, ammonium chloride, ammonium bromide, ammonium fluoride, ammonia water 1 or 2 of them. The content of the ammonium salt is 0.01-50.0wt%, preferably 0.1-30.0wt%, more preferably 1-15.0wt%. When the concentration is less than 0.01wt%, the regulating effect cannot be achieved; when it is greater than 50.0wt%, no more Good conditioning effec...

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Abstract

The invention provides an etching liquid composition for nickel or nickel alloy so as to enable the solving of the problems existing in the prior art that etching rate of nickel is low or corrosion to copper is great, and operating liquid has poor stability. The etching liquid composition comprises nitric acid or sulfuric acid, hydrogen peroxide, ammonium salts, aromatic amine, nitro compounds and deionized water. The etching liquid composition provided in the invention has a uniform and stable etching rate, no residues and no corrosion to other metals except nickel, especially no corrosion to copper.

Description

technical field [0001] The invention belongs to microstructure etching technology, in particular to an etching solution composition for etching nickel or nickel / copper alloy. Background technique [0002] During the preparation of electrodes and wiring of printed circuit boards or semiconductor products, copper wiring is temporarily protected by nickel plating. After the subsequent process is completed, the nickel layer is removed, but at the same time the copper layer cannot be corroded. Systems consisting of nitric acid and hydrogen peroxide have been known for nearly 30 years for microstructural etching of nickel and copper coatings. Chinese patent CN1274880C proposes an etching solution composition comprising hydrogen peroxide, inorganic acid, quaternary ammonium salt, and fatty alcohol. Chinese patent CN1011481801A proposes an etching solution composition containing nitric acid or sulfuric acid, hydrogen peroxide, polymer and water. Chinese patent CN101238242A propos...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23F1/44
Inventor 张军常积东李承孝
Owner 西安东旺精细化学有限公司
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