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Intermediate-temperature curing type phenolic resin for artificial board and preparation method thereof

A technology of phenolic resin and wood-based panels, applied in the direction of aldehyde/ketone condensation polymer adhesives, adhesive types, adhesives, etc., can solve the problems of reducing material yield, product bubbling and delamination, and low production efficiency. Achieve the effect of improving production efficiency, reducing curing temperature and improving production efficiency

Active Publication Date: 2011-11-23
湖南風河竹木科技股ふん有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Because it needs to be cured at a higher temperature, it will lead to the following problems: 1. The heat energy consumption is large and the production cost is high; 2. The high temperature effect of hot pressing will cause the thermal strain of the wood-based panel to increase and increase the difficulty of secondary processing. Reduce the output rate; 3. The hot pressing process of some products is limited. For example, the film-coated bamboo plywood can only use the "cold in and cold out" process, and the production efficiency is low; 4. Unloading the board under high temperature conditions, the product Bubble delamination prone to occur, resulting in product downgrade or scrap
In addition to room temperature curing phenolic resins, as far as the current research results are concerned, the curing temperature of phenolic resin adhesives can generally only be reduced to 120-130 ° C, so it cannot meet the needs of wood-based panel products that require lower curing temperatures. And the production cost is high, so that the practical application is limited

Method used

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  • Intermediate-temperature curing type phenolic resin for artificial board and preparation method thereof
  • Intermediate-temperature curing type phenolic resin for artificial board and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] Weigh 500 g of phenol, 65 g of urea, 780 g of formaldehyde solution, 35 g of resorcinol, 50 g of sodium hydroxide, 20 g of magnesium oxide, and 30 g of polyvinyl alcohol.

[0022] Add 500g of melted phenol, 35g of sodium hydroxide, and 12g of magnesium oxide into the reaction kettle, start the agitator, raise the temperature to 40°C, add 580g of formaldehyde solution, 35g of resorcinol and 30g of polyvinyl alcohol, and raise the temperature to 80°C-82°C . After maintaining for 20 minutes, add the remaining 200g of formaldehyde solution, the remaining 15g of sodium hydroxide, 8g of magnesium oxide and 45g of urea, heat up to boiling in 30min and reflux for 10min. Lower the temperature to 92°C-94°C, continue the reaction until the viscosity is 310mpa.s, lower the temperature to 62°C, add the remaining 20g of urea, react for 30min, and discharge when the temperature drops to 38°C.

[0023] Resin technical indicators: solid content 42%; viscosity 385Pa·s; free phenol conte...

Embodiment 2

[0025] Weigh 500 g of phenol, 90 g of urea, 820 g of formaldehyde solution, 45 g of isocyanate, 60 g of sodium hydroxide, 30 g of calcium oxide, and 35 g of polyvinyl acetal.

[0026] Add 500g of melted phenol, 45g of sodium hydroxide, and 20g of calcium oxide into the reactor, start the stirrer, raise the temperature to 40°C, add 620g of formaldehyde solution, 45g of isocyanate and 35g of polyvinyl acetal, and raise the temperature to 80°C-82°C. After maintaining for 25 minutes, add the remaining 200g of formaldehyde solution, the remaining 15g of sodium hydroxide, 10g of calcium oxide and 65g of urea, heat up to boiling in 35 minutes and reflux for 15 minutes. Lower the temperature to 92°C-94°C, continue the reaction until the viscosity is 350mpa.s, lower the temperature to 60°C, add the remaining 25g of urea, react for 30min, and discharge when the temperature drops to 38°C.

[0027] Resin technical indicators: solid content 46%; viscosity 425Pa·s; free phenol content 2.1%,...

Embodiment 3

[0029] Weigh 500 g of phenol, 105 g of urea, 910 g of formaldehyde solution, 60 g of carbonate, 60 g of sodium hydroxide, 25 g of zinc oxide, and 35 g of polyvinyl alcohol.

[0030] Add 500g of melted phenol, 45g of sodium hydroxide, and 15g of zinc oxide into the reactor, start the stirrer, raise the temperature to 40°C, add 650g of formaldehyde solution, 60g of carbonate and 35g of polyvinyl alcohol, and raise the temperature to 80°C-82°C. After maintaining for 20 minutes, add the remaining 260g of formaldehyde solution, the remaining 15g of sodium hydroxide, 10g of zinc oxide and 75g of urea, heat up to boiling in 35min and reflux for 10min. Lower the temperature to 92°C-94°C, continue the reaction until the viscosity is 420mpa.s, lower the temperature to 60°C, add the remaining 30g of urea, react for 30min, and discharge when the temperature drops to 38°C.

[0031] Resin technical indicators: solid content 49%; viscosity 435Pa·s; free phenol content 2.1%, free aldehyde con...

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Abstract

The invention provides intermediate-temperature curing type phenolic resin capable of being used for producing outdoor and structural artificial boards, relating to the field of high molecular materials. The intermediate-temperature curing type phenolic resin is prepared by taking phenol, a formaldehyde solution and carbamide as main raw materials and one or more of sodium hydroxide, magnesium oxide, calcium oxide and zinc oxide as a catalyst and adding a promoter and a plasticiser; in the particular preparation process, the formaldehyde solution and the carbamide are subjected to secondary charging, and the intermediate-temperature curing type phenolic resin can be cured under the condition of the temperature of 105-110 DEG C through the technical measures of carrying out boiling reflux, enhancing the degree of initial resin reaction, and the like. Compared with the traditional phenolic resin which is applied to the artificial board production and has the curing temperature of 140-150 DEG C, the intermediate-temperature curing type phenolic resin provided by the invention has the advantages of greatly reduced curing temperature and greatly enhanced production efficiency.

Description

technical field [0001] The invention relates to the field of polymer materials, and specifically refers to a phenolic resin that can be quickly cured at a medium temperature of 105-110°C, and the phenolic resin can be used as an adhesive to produce a high-gluing-strength wood-based panel that is resistant to boiling water. Background technique [0002] Phenolic resin is a synthetic resin widely used in wood-based panel production. When phenolic resin is used as an adhesive for gluing wood materials, it has high bonding strength. At the same time, phenolic resin has good water resistance, acid resistance, heat resistance and aging resistance. At present, the phenolic resins used in the production of wood-based panels are all high-temperature curing types, and the curing temperature is 140-150°C. Because it needs to be cured at a higher temperature, it will lead to the following problems: 1. The heat energy consumption is large and the production cost is high; 2. The high te...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G14/08C09J161/34
Inventor 韩健
Owner 湖南風河竹木科技股ふん有限公司
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