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Photocurable resin composition, dry film and cured product of the photocurable resin composition, and printed wiring board using the photocurable resin composition, the dry film, and the cured product

A technology of photocurable resin and photosensitive resin, applied in printed circuit, printed circuit manufacturing, printed circuit secondary treatment, etc., can solve the problems of reduced sensitivity, reduced developability, unable to obtain acid value, etc.

Active Publication Date: 2013-09-04
TAIYO HLDG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in this case, there are problems in that since the polyester (meth)acrylate is bifunctional and semi-solid, the sensitivity is lowered, and the softening point of the dried coating film is increased, so the developability is lowered.
However, for the carboxyl group-containing photosensitive resin obtained by reacting the reaction product of novolac type phenolic resin and alkylene oxide with an unsaturated group-containing monocarboxylic acid, and reacting the resulting reaction product with a polybasic acid anhydride, the Monocarboxylic acid and polybasic acid anhydride containing unsaturated groups are added to the hydroxyl group formed by the ring opening of alkylene oxide, so there is the following trade-off relationship between sensitivity and development: To obtain the required acid value, the unsaturated group The content of the group is reduced, if a large amount of unsaturated groups are to be contained, the required acid value cannot be obtained

Method used

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  • Photocurable resin composition, dry film and cured product of the photocurable resin composition, and printed wiring board using the photocurable resin composition, the dry film, and the cured product
  • Photocurable resin composition, dry film and cured product of the photocurable resin composition, and printed wiring board using the photocurable resin composition, the dry film, and the cured product
  • Photocurable resin composition, dry film and cured product of the photocurable resin composition, and printed wiring board using the photocurable resin composition, the dry film, and the cured product

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0176] The present invention will be specifically described below by showing examples and comparative examples, but the present invention is not limited by the following examples. In addition, the following "parts" and "%" are all mass standards unless otherwise stated.

Synthetic example 1

[0178] 106 parts of novolak type phenolic resin (manufactured by Showa High Molecular Co., Ltd., hydroxyl equivalent 106), 2.6 parts of 50% sodium hydroxide are charged in an autoclave with a thermometer, a nitrogen gas introduction device and an alkylene oxide introduction device and a stirring device Aqueous solution, 100 parts of toluene / methyl isobutyl ketone (mass ratio = 2 / 1), carry out nitrogen replacement in the system while stirring, then heat up, at 150°C, 8kg / cm 2 Slowly introduce 60 parts of propylene oxide to react. Until the gauge pressure is 0.0kg / cm 2 , the reaction was continued for about 4 hours and then cooled to room temperature. To this reaction solution, 3.3 parts of 36% aqueous hydrochloric acid solution was added and mixed to neutralize sodium hydroxide. This neutralized reaction product was diluted with toluene, washed with water three times, and the solvent was removed by an evaporator to obtain an alkylene oxide adduct of a novolak-type phenolic re...

Synthetic example 2

[0181] 164 parts of alkylene oxide adducts of the novolac type phenolic resin obtained in Synthesis Example 1, 72 parts of acrylic acid, 3.0 parts of p-toluenesulfonic acid, 0.05 parts of hydroquinone monomethyl ether, and 100 parts of toluene are charged into a stirrer, The reaction was carried out at 90° C. for 12 hours with stirring while blowing air into a reactor with a thermometer and an air blowing tube. After the water produced by the reaction started to distill off as an azeotrope with toluene, the reaction was further carried out for 5 hours, followed by cooling to room temperature. Use 5% NaCl aqueous solution to carry out water washing to gained reaction solution, remove toluene with evaporator distillation, add carbitol acetate, thereby obtain the novolak type PO addition acrylate resin solution (double bond equivalent of 70% of non-volatile content) 236g / eq·acid value 0). Call it A-2 Varnish.

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PUM

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Abstract

Disclosed is a photocurable resin composition that can form a dried coating film, which is highly dry to the touch, has high sensitivity, and can form a cured film which is soft and particularly has a high insulating resistance under high temperature and humidified conditions.  Also disclosed are a dry film and a cured product of the photocurable resin composition, and a printed wiring board comprising a cured film such as a solder resist formed using the photocurable resin composition, the dry film and the cured product. The photocurable resin composition is alkaline-developable and comprises a photosensitive resin having a structure represented by general formula (I), a carboxyl group-containing resin, and a photopolymerization initiator.  Preferably, the photocurale resin composition further comprises a heat curable component and more preferably further comprises a colorant.  In general formula (I), R1s, which may be the same or different, represent a hydrogen atom and an organic group having 1 to 20 carbon atoms; R2 represents at least one functional group selected from the group consisting of alkyl groups having 1 to 10 carbon atoms, alkylene groups having 1 to 10 carbon atoms, and phenylene groups; R3 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms; R4 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms; R5 represents a hydrogen atom or a methyl group; p is an integer of 1 to 5; q is an integer of 3 or more; m is an integer of 1 to 4; and n is an integer of 1 to 10.

Description

technical field [0001] The present invention relates to a photocurable resin composition that can be developed by dilute alkali aqueous solution, especially a composition for solder resist that is photocurable by ultraviolet exposure or laser exposure, its dry film and cured product, and a cured resin composition formed by using them. Film printed circuit boards. Background technique [0002] Conventionally, alkali-developing type photosensitive resin compositions have been used in large quantities as solder resists for printed wiring boards. The purpose of the solder resist is to protect the circuit of the printed circuit board, and it is mainly composed of a carboxyl group-containing resin, a polyfunctional acrylate compound, a photopolymerization initiator, a thermosetting resin, and the like. As the polyfunctional acrylate-based compound, mainly liquid polyfunctional polyester acrylates are widely used from the viewpoint of high sensitivity and development resistance. ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/038C08F290/14G03F7/004G03F7/032H05K3/28
CPCC08F299/024H05K3/287G03F7/161G03F7/0388
Inventor 秋山学峰岸昌司有马圣夫
Owner TAIYO HLDG CO LTD