High-thermal conductivity insulating packaging material for solar thermoelectricity utilization and preparation method thereof
A technology for packaging materials and solar cells, which is applied in the field of hot-melt bonding heat-conducting insulating materials for solar photoelectric-thermal integration system packaging, can solve the problems of easy yellowing and aging, poor thermal conductivity, etc., achieve lower temperature, excellent weather resistance, Good heat resistance
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Embodiment 1
[0022] according to figure 1 In the steps shown, the raw materials for preparing a high thermal conductivity insulating solar cell encapsulation material are 100 parts by mass of AEVA, 0.5 parts by mass of tackifier 138 rosin glycerides, 0.8 parts by mass of cross-linking curing agent dicumyl peroxide, 0.2 Part by mass of benzoyl peroxide, 0.1 part by mass of crosslinking curing accelerator 1,2-divinylbenzene, 0.1 part by mass of MPP230, 0.3 part by mass of antioxidant bis(2,4-dicumylphenyl) Pentaerythritol diphosphite, 0.2 parts by mass of ultraviolet light absorber UV-326, 0.2 parts by mass of silane coupling agent KH-550, 40 parts by mass of nano-zinc oxide, 10 parts by mass of aluminum nitride whiskers (aspect ratio 25-30), put into the extruder for mixing and plasticizing after mixing evenly, and the temperature of the extruder is controlled at 85°C. Extruding and dicing, molding and molding, the high thermal conductivity insulating solar cell encapsulation film of the p...
Embodiment 2
[0024] The raw materials for preparing a high thermal conductivity insulating solar cell packaging material are 100 mass AEVA, 0.5 mass part tackifier r-glycidyl ether oxypropyl trimethoxysilane, 0.8 mass part crosslinking curing agent dicumyl peroxide , 0.2 parts by mass of benzoyl peroxide, 0.1 parts by mass of cross-linking curing accelerator triallyl isocyanurate, 0.15 parts by mass of MPP620, 0.15 parts by mass of antioxidant bis(2,4-dicumyl) Phenyl) pentaerythritol diphosphite, 0.15 parts by mass of antioxidant distearyl pentaerythritol diphosphite, 0.3 parts by mass of ultraviolet absorber UV-326, 0.2 parts by mass of silane coupling agent KH-570, 40 parts by mass 10 parts by mass of aluminum nitride and 10 parts by mass of silicon carbide whiskers (with an aspect ratio of 20-30) are uniformly mixed and put into an extruder for kneading and plasticizing, and the temperature of the extruder is controlled at 88°C. Extruding and dicing, molding and molding, the high therma...
Embodiment 3
[0026] A high thermal conductivity insulating solar cell packaging material is composed of 100 parts by mass of AEVA, 0.5 parts by mass of tackifier r-glycidyl ether oxypropyl trimethoxysilane, 0.7 parts by mass of cross-linking curing agent dicumyl peroxide, 0.1 mass parts of parts benzoyl peroxide, 0.1 part by mass of cross-linking curing accelerator triallyl isocyanurate, 0.1 part by mass of cross-linking curing accelerator 1,2-divinylbenzene, 0.2 part by mass of MPP620, 0.15 Antioxidant bis(2,4-dicumylphenyl) pentaerythritol diphosphite, 0.15 mass part antioxidant distearyl pentaerythritol diphosphite, 0.3 mass part ultraviolet absorber UV- 327, 0.2 parts by mass of silane coupling agent KH-570, 40 parts by mass of aluminum nitride, and 15 parts by mass of silicon carbide whiskers, put into the extruder for mixing and plasticizing after mixing evenly, and the temperature of the extruder is controlled at 87 °C. Extruding and dicing, molding and molding, the high thermal co...
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