Metal-coated polyimide resin substrate with excellent thermal aging resistance properties

Abstract

Provided is a metal-coated polyimide resin substrate that exhibits a high level of adhesion after aging at 150 DEG C for 168 hours without a reduction in the initial close adhesion between a metal-coated polyimide resin film and a metal layer. The metal-coated polyimide resin substrate is produced as follows. After surface modification is applied to one surface or both surfaces of a polyimide resin film using a wet method, a dry method, or a combination thereof, a barrier layer is formed using a wet method, a seed layer is subsequently formed using a wet method or a dry method, and a conductive film is formed on the surface layer using a wet method. The metal-coated polyimide resin substrate is characterized in that the thickness of a mixed layer of a polyamide residue and a barrier-metal layer residue at the peeled surface on the conductive film layer side of said metal-coated polyimide resin substrate after the metal-coated polyimide resin substrate is subjected to a 90 DEG peel test is 2.6 nm or less, in terms of Si sputtering speed, when measured by means of a depth profile analysis using a time-of-flight secondary ion mass spectrometer (TOF-SIMS), and the peel strength retention rate after a 168-hour aging test at 150 DEG C (peel strength after aging at 150 DEG C for 168 hours / initial peel strength) is 50% or higher.

Description

technical field [0001] The present invention relates to a method for producing an adhesive-free flexible laminate that can be used as a mounting material for electronic components such as flexible printed boards, TABs, and COFs, especially a metal-clad polyimide resin substrate with excellent heat aging resistance. Background technique [0002] FCCL (Flexible Copper Clad Laminate) in which a metal conductor layer mainly composed of copper is laminated on a polyimide film is widely used as a material for circuit boards in the electronics industry. Among them, an adhesive-free flexible laminate (particularly a two-layer flexible laminate) that does not have an adhesive layer between a polyimide film and a metal layer has attracted attention as circuit wiring widths have become finer pitches. [0003] A method for producing an adhesive-free flexible laminate, especially an adhesive-free flexible laminate corresponding to a fine pitch, includes a method in which a polyimide resi...

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Problems solved by technology

[0011] However, in the actual surface modification of polyimide resin films, substances having various molecular structures including functional groups contributing to adhesion are produced depending on the treatment conditions, so the above-mentioned methods are only limited to specific methods. The surface modified layer dyed with silver nitrate was evaluated. Even if the thickness of the modified layer in the above evaluation is the same, there is a problem that there is a difference from the actual peel strength test results.

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