Conductive copper paste for surface electrodes of chip ceramic capacitor and preparation method thereof

A ceramic capacitor, surface layer technology, applied in fixed capacitor electrodes, cable/conductor manufacturing, conductive materials dispersed in non-conductive inorganic materials, etc., can solve the problems of small capacity, poor performance, large loss, etc. Improved wetting properties, improved performance effects

Inactive Publication Date: 2012-09-12
HEFEI UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

There are no measures to control the oxidation of copper powder in individual invention patent applications, and inevitably there are problems of small capacity and large loss, and the performance is far inferior to that of the surface silver electrode.

Method used

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  • Conductive copper paste for surface electrodes of chip ceramic capacitor and preparation method thereof
  • Conductive copper paste for surface electrodes of chip ceramic capacitor and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] 1. Glass powder: weigh CaO: 10%, ZnO: 15%, Bi 2 o 3 : 44%, BaO: 8%, SiO 2 : 10%, B 2 o 3 : 10%, Al 2 o 3 : 3%, mixed evenly, then placed in a high-temperature furnace to melt at 1300~1500°C and stirred evenly to obtain molten glass, quickly quenched the molten glass to obtain glass beads, and ground for a long time (more than 24 hours) to obtain a particle size of 2 ~3 μm glass powder, set aside.

[0030] 2. Metal powder: Evenly mix 9.9 parts of Cu powder and 0.1 part of W powder with a particle size of 0.5-3 μm, and set aside.

[0031] 3. Organic binder: add 0.7 parts of ethyl cellulose to 9.1 parts of terpineol, stir to dissolve; then add 0.1 parts of silane coupling agent KH-550 and 0.1 parts of lecithin, and stir until completely Dissolved to obtain an organic binder, ready to use.

[0032] 4. Conductive copper paste: Weigh 6.9 parts of metal powder and 0.5 parts of glass powder, add 2.6 parts of organic binder in turn, mix thoroughly, and stir to make it ev...

Embodiment 2

[0035] 1. Glass powder: weigh CaO: 10%, ZnO: 10%, Bi 2 o 3 : 48%, BaO: 7%, SiO 2 : 10%, B 2 o 3 : 10%, Al 2 o 3: 5%, mixed evenly, then placed in a high-temperature furnace to melt at 1300~1500°C, and stirred evenly to obtain molten glass, quickly quenched the molten glass to obtain glass beads, and ground for a long time (more than 24 hours) to obtain a particle size of 2~3μm glass powder, set aside.

[0036] 2. Metal powder: Evenly mix 9.95 parts of Cu powder and 0.05 part of Mo powder with a particle size of 0.5-3 μm, and set aside.

[0037] 3. Organic binder: add 0.7 parts of ethyl cellulose to 9.2 parts of terpineol, stir to dissolve; then add 0.05 parts of silane coupling agent KH-550 and 0.05 parts of lecithin, and stir until completely Dissolved to obtain an organic binder, ready to use.

[0038] 4. Conductive copper paste: Weigh 7.0 parts of metal powder and 0.4 parts of glass powder, add 2.6 parts of organic binder in turn, mix thoroughly, and stir to make it...

Embodiment 3

[0041] 1. Glass powder: weigh CaO: 10%, ZnO: 8%, Bi 2 o 3 : 49%, BaO: 8%, SiO 2 : 10%, B 2 o 3 : 10%, Al 2 o 3 : 5%, mixed evenly, then placed in a high-temperature furnace to melt at 1300~1500°C, and stirred evenly to obtain molten glass, quickly quenched the molten glass to obtain glass beads, and ground for a long time (more than 24 hours) to obtain a particle size of 2~3μm glass powder, set aside.

[0042] 2. Metal powder: uniformly mix 9.9 parts of Cu powder and 0.1 part of W powder with a particle size of 0.5-3 μm, and set aside.

[0043] 3. Organic binder: add 0.74 parts of ethyl cellulose to 9.1 parts of terpineol, stir to dissolve; then add 0.08 parts of silane coupling agent KH-550 and 0.08 parts of lecithin, and stir until completely Dissolved to obtain an organic binder, ready to use.

[0044] 4. Conductive copper paste: Weigh 7.2 parts of metal powder and 0.4 parts of glass powder, add 2.4 parts of organic binder in turn, mix thoroughly, and stir to make i...

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Abstract

The invention discloses conductive copper paste for surface electrodes of a chip ceramic capacitor. The conductive copper paste comprises the following raw materials in percentage by mass: 65 to 72 percent of metal powder, 4 to 7 percent of glass powder and 24 to 30 percent of organic binder, wherein the metal powder consists of Cu and W or Cu and Mo; the glass powder consists of CaO, ZnO, Bi2O3, BaO, SiO2, B2O3 and Al2O3; and the organic binder consists of solvent, ethyl cellulose, silane coupling agent and surfactant. The conductive copper paste is printed through silk screens and sintered under the protection of N2 gas, the performance of the obtained finished product of the chip ceramic capacitor can completely meet the technical requirements of the ceramic capacitor, and the conductive copper paste can be used for replacing conductive silver paste on the surface of the corresponding chip ceramic capacitor.

Description

1. Technical field [0001] The invention relates to a conductive copper paste and a preparation method thereof, in particular to a conductive copper paste for surface electrodes of chip ceramic capacitors and a preparation method thereof. After the copper paste of the invention is screen-printed on a ceramic capacitor substrate, a chip ceramic capacitor with large capacity, low loss, good solderability and high tensile strength can be obtained, and belongs to the technical field of electronic materials and surface engineering. 2. Background technology [0002] Ceramic capacitors use ceramics as the dielectric, and then form silver layers on both sides of the ceramic substrate (mostly circular) as electrodes. The methods for forming electrodes generally include electroplating (or electroless plating) and screen printing. The former is rarely used due to problems such as complex process, low production efficiency, and environmental pollution. The commonly used screen printing ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/22H01B13/00H01G4/008
Inventor 宣天鹏张万利汪亮周赟
Owner HEFEI UNIV OF TECH
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