Chemical vapor deposition preparation method of nanocrystal/quantum dot sensitized crystalline silicon battery cell
A technology of chemical vapor deposition and sensitization of crystalline silicon, applied in electrical components, circuits, climate sustainability, etc., can solve the problems of high production cost, narrow energy band of single crystal silicon, cumbersome process, etc., to reduce damage, strengthen Absorbent effect, suitable for a wide range of effects
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Embodiment 1
[0030] a) Prepare the cleaning solution according to the ratio of 28% ammonia water: 30% hydrogen peroxide: pure water volume ratio of 1:1:4, put the diffused monocrystalline silicon cell into the cleaning solution, ultrasonically clean for 10 minutes, take it out, and wash with pure water ;
[0031] b) Prepare the etching solution according to the ratio of 40% hydrofluoric acid: absolute ethanol volume ratio of 3:1, put the cleaned diffusion monocrystalline silicon cell into the etching solution, ultrasonically etch for 5 minutes, take it out, and wash with pure water;
[0032] c) Immerse the corroded single crystal silicon cell in a 0.5mol / L ammonium fluoride solution ultrasonically for 5 minutes to perform surface hydrogen capping treatment;
[0033] d) Put the hydrogen-terminated monocrystalline silicon cell into a 0.1mol / L tin tetrachloride aqueous solution, immerse it in an ultrasonic solution for 5 minutes, perform metal salt treatment, take it out, and put it into a vacuum dr...
Embodiment 2
[0038] a) Prepare the cleaning solution according to the ratio of 28% ammonia water: 30% hydrogen peroxide: pure water volume ratio of 1:1:3, put the diffused polysilicon cell into the cleaning solution, ultrasonically clean for 10 minutes, take it out, and wash with pure water;
[0039] b) Prepare the etching solution according to the ratio of 40% hydrofluoric acid: absolute ethanol volume ratio of 1:1, put the cleaned diffusion polysilicon cell into the etching solution, ultrasonically etch for 3 minutes, take it out, and wash with pure water;
[0040] c) Immerse the corroded polycrystalline silicon cell in a 0.5mol / L ammonium fluoride solution ultrasonically for 3 minutes to perform surface hydrogen capping treatment;
[0041] d) Put the hydrogen-terminated polysilicon cell into a 0.1mol / L tin tetrachloride aqueous solution, immerse it in an ultrasonic solution for 3 minutes, perform metal salt treatment, take it out, and put it into a vacuum drying oven;
[0042] e) According to th...
Embodiment 3
[0046] The preparation method of this embodiment is the same as that described in embodiment 1, except that in step b) an etching solution is prepared in a ratio of 40% hydrofluoric acid: anhydrous ethanol with a volume ratio of 2:1, and the cleaned diffusion single crystal The silicon cell was put into the etching solution, ultrasonically etched for 15 minutes, taken out, and washed with pure water.
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