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A technology of LED packaging and epoxy resin, applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve the problems of poor UV resistance, low short-wave transmittance and high cost
Inactive Publication Date: 2012-12-26
JIANGSU TETRA NEW MATERIAL TECH
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[0005] The purpose of the present invention is to provide a new type of LED encapsulant with high transparency, good UV aging resistance, strong cohesive force, high toughness, fast curing, low viscosity and low hygroscopicity, which is modified by silane coupling agent. Nano-silica is doped with alicyclic epoxy resin, avoiding the use of high-cost silicone, and at the same time overcoming the shortcomings of existing bisphenol A epoxy resin encapsulation adhesives such as high moisture absorption, poor UV resistance, and low short-wave transmittance. More suitable for high-end LED encapsulants, high-power LED encapsulants or white and blue LED encapsulants based on ultraviolet light
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Embodiment 1
[0020] (1) Preparation of Component A: 96.6% 4-vinyl epoxycyclohexane, 2.6% propylene oxide butyl ether, 0.6% softener, 0.14% defoamer and 0.06% transparent blue-violet dye The color paste is weighed according to the proportion, and stirred at 70-90°C for 3-4h until the mixture is uniform;
[0021] (2) Preparation of modified nanoparticles: adjust the pH value of 15% silane coupling agent aqueous solution to 3-4, pour it into a constant pressure dropping funnel, and then slowly add it dropwise to 85% nano-silica dispersion at 75°C In 30min, drop it off within 30min and keep it warm for 3h;
[0022] (3) Preparation of component B: the mixture of 98.4% by mass percentage of methylhexahydrophthalic anhydride and polyazelaic anhydride, 0.97% of tetramethylammonium bromide, 0.5% of glycerin, and 0.05% of silane coupling agent were modified Proportional nano-silica and 0.08% tetrakis[β-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate] pentaerythritol ester are weighed in proportion, ...
Embodiment 2
[0025] (1) Preparation of component A: 96.8% 3-oxiranyl-7-oxabicyclo[4,1,0]heptane, 2.5% propylene oxide phenyl ether, 0.5% softener , 0.14% defoamer and 0.06% transparent blue-violet dye paste are weighed in proportion, and stirred at 70-90°C for 3-4h until they are evenly mixed;
[0026] (2) Preparation of modified nanoparticles: adjust the PH value of 15% silane coupling agent aqueous solution to 3-4, pour it into a constant pressure dropping funnel, and then slowly add it dropwise to 85% nano-silica dispersion at 75°C In 30min, drop it off within 30min and keep it warm for 3h;
[0027] (3) Preparation of component B: the mixture of 98.4% by mass of methylhexahydrophthalic anhydride and polyazelaic anhydride, 1% of tetramethylammonium iodide, 0.5% of glycerin, and 0.05% of silane coupling agent were modified Proportional nano-silica and 0.05% 2,6-di-tert-butyl-p-cresol are weighed in proportion, and stirred at 70-90°C for 3-4h until they are evenly mixed;
[0028] ⑷ A and...
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Abstract
The invention relates to a coupling agent modified silicon dioxide doped cycloaliphatic epoxy resin LED packaging adhesive. The adhesive is characterized in that: it is composed of component A and component B that are mixed in a ratio of 1: (0.9-1) for construction. Specifically, the component A consists of cycloaliphatic epoxy resin, an active diluent, a transparent blue-violet purple dye color paste, a defoaming agent and a softening agent. The component B consists of a curing agent, an accelerator, a silane coupling agent modified nano-ultraviolet absorbent, polyol and an antioxidant. The nano-silicon dioxide doped cycloaliphatic epoxy resin LED packaging adhesive provided in the invention has the advantages of good ageing resistance, strong binding power, fast curing, low viscosity and moisture absorption, so that employment of organosilicone with a high cost can be avoided. Meanwhile, the defects of high moisture absorption, poor ultraviolet resistance and low shortwave transmittance and the like of existing bisphenol A type epoxy resin can be overcome. The LED packaging adhesive provided in the invention is more suitable to be used as a high-end LED packaging adhesive, a high power LED packaging adhesive or an ultraviolet light-based white light and blue light LED packaging adhesive.
Description
technical field [0001] The invention relates to an LED encapsulation glue, in particular to a nano silicon dioxide-doped alicyclic epoxy resin LED encapsulation glue modified by a silane coupling agent with good ultraviolet aging resistance and strong adhesion. Background technique [0002] Light-emitting diodes (LEDs), as the third-generation semiconductor lighting source, are widely used in lighting, radiation sources, and displays because they have advantages in all aspects compared with incandescent lamps and fluorescent lamps. During the use of LEDs, the photons generated by radiative recombination will be lost when they are emitted outwards, and a lot of light cannot be emitted from the chip to the outside. By coating the surface of the chip with a transparent adhesive layer with a relatively high refractive index, that is, encapsulation adhesive, since the adhesive layer is between the chip and the air, the loss of photons at the interface can be effectively reduced ...
Claims
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