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High thermal conductivity epoxy few adhesive mica tape and preparation method of high thermal conductivity epoxy few glue mica tape

A low-glue mica tape, high thermal conductivity technology, applied in chemical instruments and methods, lamination, insulators, etc., can solve the problems of reducing dielectric properties and mechanical properties, mica tapes do not have high thermal conductivity, and aging of insulating structural materials, etc. Achieve the effect of saving production equipment costs, reducing harmful gas emissions and increasing service life

Active Publication Date: 2013-07-10
ZHUZHOU TIMES ELECTRIC INSULATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Nowadays, during the operation of ordinary high-power motors, the mica tape used in the electrical insulation material does not have high thermal conductivity. As a thermal barrier, it will prevent heat from radiating to the iron core and cooling medium, resulting in a higher temperature rise of the motor, and a higher temperature. High working temperature will inevitably cause the aging of insulating structural materials, reduce the dielectric properties and mechanical properties, and lead to a decrease in motor efficiency and a reduction in life.

Method used

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  • High thermal conductivity epoxy few adhesive mica tape and preparation method of high thermal conductivity epoxy few glue mica tape
  • High thermal conductivity epoxy few adhesive mica tape and preparation method of high thermal conductivity epoxy few glue mica tape

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Experimental program
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Effect test

Embodiment 1

[0024] The thermally conductive filler is made of nanometer (particle size 30-70nm) aluminum nitride and micron (particle size 1-40μm) aluminum oxide, which is uniformly mixed at a mass ratio of 2:1, and the silane coupling agent KH-560 is used as the thermal conductive filler 1% of the mass, and mixed with absolute ethanol to prepare a solution with a mass ratio of 1:4. Add the thermal conductive filler to the solution and disperse at a high speed of 2000r / min for 1h, then ball mill at 4000r / min for 1h, and then vacuum Suction filter and dry in an oven at 100°C, and seal for later use.

[0025] Heat the polyesterimide-modified epoxy adhesive to 80°C-90°C, add 20% by volume of thermally conductive filler, disperse at a speed of 1500r / min for 1 hour to evenly disperse the thermally conductive filler in the adhesive, and cool the adhesive to Crush into rubber powder after room temperature.

[0026] Uncoil the non-alkali glass cloth for electrical purposes with a thickness of 0....

Embodiment 2

[0028] The thermally conductive filler is made of nanometer (particle size 30-70nm) α-phase crystal aluminum oxide and micron (particle size 1-40μm) aluminum oxide, which are uniformly mixed at a mass ratio of 3:2, and the silane coupling agent KH -550 is 3.5% of the mass of the thermally conductive filler, and it is mixed with anhydrous ethanol to prepare a solution with a mass ratio of 1:4. Add the thermally conductive filler to the solution and disperse at a high speed of 2000r / min for 1h, and then disperse at 4000r / min Ball milled for 3 hours, vacuum filtered and dried in an oven at 100°C, sealed for later use.

[0029] Heat the polyester modified epoxy adhesive to 80°C-90°C, add 30% by volume of thermally conductive filler, disperse at a speed of 1500r / min for 2 hours to disperse the thermally conductive filler evenly in the adhesive, cool the adhesive to room temperature and pulverize into powder.

[0030] Unroll the non-alkali glass cloth for electrical purposes with a...

Embodiment 3

[0033]The thermal conductive filler is mixed with nanometer (particle size 30-70nm) grade spherical silica and nanometer (particle size 30-70nm) aluminum nitride at a mass ratio of 1:1, and then mixed with micron (particle size 1-40μm) nitrogen Boron, mix uniformly according to the mass ratio of 5:4, take the silane coupling agent KH-550 as 5% of the mass of the thermally conductive filler, and prepare a solution with a mass ratio of 1:4 with absolute ethanol, and add the thermally conductive filler to the Disperse in the solution at a high speed of 2000r / min for 1h, then ball mill at 4000r / min for 5h, vacuum filter and dry in an oven at 100°C, seal for later use.

[0034] Heat the bisphenol A type epoxy resin and polyester modified epoxy adhesive with a mass ratio of 1:4 to 80°C-90°C, add 40% by volume of thermally conductive filler, and disperse the thermally conductive filler at a speed of 1500r / min for 2 hours. Disperse evenly in the adhesive, cool the adhesive to room tem...

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Abstract

The invention discloses a high thermal conductivity epoxy few adhesive mica tape and a preparation method of the high thermal conductivity epoxy few adhesive mica tape. The high thermal conductivity epoxy few adhesive mica tape is composed of mica paper, an epoxy adhesive layer filled with high thermal conductivity filler, and alkali-free glass cloth. The volume of the high thermal conductivity filler is 20%-40% of the volume of an epoxy adhesive. The high thermal conductivity filler is prepared through the steps of preprocessing with a solution of a silane coupling agent and an absolute ethyl alcohol solution, dispersion, scatter of adhesive powder, press roller hot press composition, cooling, secondary adhesive sizing, baking, rolling-up, cutting and the like. Due to the fact that the inorganic high thermal conductivity filler is used for filling an adhesive of the high thermal conductivity epoxy few adhesive mica tape, a heat conduction network chain is formed inside the adhesive between the mica paper and glass fiber cloth in a high thermal conductivity epoxy few adhesive mica tape system, not only can the temperature of a winding bar be effectively reduced, but also influence on electrical performance and mechanical performance of the high thermal conductivity epoxy few adhesive mica tape is small. The preparation method of the high thermal conductivity epoxy few adhesive mica tape greatly reduces consumption of solvent, and has the advantages of reducing production cost, being energy-saving, reducing emission, and reducing environmental pollution.

Description

technical field [0001] The invention relates to a mica tape and a preparation method thereof, in particular to a high thermal conductivity epoxy mica tape with less glue and a preparation method thereof. Background technique [0002] With the continuous development of motors in the direction of high voltage, large capacity, stable operation and environmental protection, new requirements are put forward for the insulation structure of high-voltage motors or generators: thinning the insulation structure, reducing temperature rise, and increasing the design power of the whole machine. This requires the insulation structure in the motor to have better electrical insulation performance and thermal conductivity. During the operation of ordinary high-power motors, the mica tape used in the electrical insulation material does not have high thermal conductivity. As a thermal barrier, it will prevent heat from dissipating to the iron core and cooling medium, resulting in a higher temp...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B17/60H01B19/00B32B17/10B32B19/02B32B37/24
Inventor 李忠良陈子荣盛科山李亮亮李强军何碧波
Owner ZHUZHOU TIMES ELECTRIC INSULATION
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