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Simplified tungsten-titanium alloy film photolithography process

A technology of tungsten-titanium alloy and photolithography technology, which is applied in the direction of metal material coating technology, photoplate making technology of pattern surface, technology for producing decorative surface effect, etc. Reduce other problems, achieve simple process steps, improve lithography accuracy and success rate, and improve applicability

Inactive Publication Date: 2013-08-07
BEIJING INSTITUTE OF TECHNOLOGYGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

At the same time, it solves the problems of complex process, reduced precision and reduced process reliability caused by the aluminum forming layer in the tungsten-titanium alloy photolithography process

Method used

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  • Simplified tungsten-titanium alloy film photolithography process
  • Simplified tungsten-titanium alloy film photolithography process

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Embodiment 1

[0025] The specific implementation steps of a simplified tungsten-titanium alloy thin film photolithography process disclosed in this embodiment are as follows:

[0026] Step 1: All process steps are realized in a clean room. The substrate substrate covered with tungsten-titanium alloy film including but not limited to silicon wafer (hereinafter referred to as substrate) is cleaned with acetone, isopropanol and deionized water, and dried.

[0027] Step 2: Spin-coat the liquid positive photoresist on the substrate to be etched using a coater. Control the photoresist to a specific thickness by adjusting the speed of the homogenizer. The glued substrate is heated and cured on a hot plate. After the glue is fully cooled, use a mask on the alignment exposure machine for ultraviolet exposure. The exposed substrate is then fully developed in a developer. Heat the developed substrate on a hot plate to fully cure the adhesive layer. Coating and exposure processes are completed in ...

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Abstract

The invention discloses a simplified tungsten-titanium alloy film photolithography process, and belongs to the field of micro-electro-mechanic system manufacturing processes. According to the process, a positive photoresist is adopted as a forming layer; an aluminum forming layer in the general process is eliminated; the photoresist layer is subjected to exposing and developing under ultraviolet light through controlling parameters and environments for photoresist uniformization and photoresist drying so as to produce a forming layer suitable for hydrogen peroxide etching; a hydrogen peroxide etching solution temperature is controlled, such that the tungsten-titanium alloy film is completely etched in cold hydrogen peroxide without affecting of photoresist layer protection ability; and graphics resolution of a tungsten-titanium alloy structure etched by the process is superior to 2 micron. According to the present invention, high precision tungsten-titanium alloy film photolithography is achieved, an application range of the tungsten-titanium alloy film is increased, precision error and process complexity introduced by the aluminum forming layer in the traditional tungsten-titanium alloy photolithography are eliminated, photolithography precision and reliability are improved, and success rates of micro-electro-mechanic system device manufacturing by adopting the tungsten-titanium alloy structure are easily increased.

Description

Technical field: [0001] The invention relates to a simplified tungsten-titanium alloy thin film photolithography process. It belongs to the field of micro-electromechanical system manufacturing technology. Background technique: [0002] Tungsten-titanium alloy (WTi) is widely used in micromachine manufacturing. The tungsten-titanium alloy thin film deposited by sputtering process has high density, moderate film stress, excellent surface flatness, excellent thermal and chemical stability, so it is an ideal choice for structural layer and sacrificial layer material in MEMS manufacturing. Tungsten-titanium alloys have some unique advantages. On the one hand, tungsten-titanium alloys can be etched quickly and stably with 40°C hydrogen peroxide (H2O2) without destroying most common metal layers such as aluminum and copper. And most acids will not etch tungsten-titanium alloy, which makes tungsten-titanium alloy and other metals have good etching selectivity. Therefore, tungste...

Claims

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Application Information

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IPC IPC(8): C23F1/26G03F7/00B81C1/00
Inventor 徐立新王刚王婷
Owner BEIJING INSTITUTE OF TECHNOLOGYGY