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Composite phenolic glue composition and application method thereof

A composition, phenolic adhesive technology, applied in the direction of aldehyde/ketone condensation polymer adhesives, adhesives, adhesive types, etc., can solve the problems of free phenol and free aldehyde escape, strong corrosion, toxicity and so on

Inactive Publication Date: 2013-10-23
周广胜
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] But the main defect of phenolic glue is: the main raw material phenol and formaldehyde of producing this glue all pollute the environment seriously, free phenol and free aldehyde escape during the glue making process, and the finished product made releases toxic gas free phenol and free aldehyde for a long time, Seriously endanger people's health; especially phenol is highly toxic to animals and plants, carcinogenic, and highly corrosive to skin and human tissues
However, all the modification processes of PF are complicated, and different catalysts need to be added, and there is no report of large-scale use in the production of wood-based panels.
[0007] At present, in the process of research on the detoxification of phenolic resin glue, in order to reduce the content of free phenol and aldehyde, most of them use various additives or modifiers in the process of making glue or during use, although it can reduce the release of free phenol and aldehyde It has a certain effect, but the defects faced are still the high cost, the reduction of other physical and chemical properties such as the bonding strength of the modified resin, and the reduction of the production efficiency of wood-based panels (extended hot pressing time), etc.
At present, there is no report on the direct use of biomass materials to replace phenolic resin glue to press wood-based panels without modification and without changing the hot-pressing process conditions.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] Thermosetting phenolic resin 60 parts

[0048] 20 parts bark powder

[0049] illite 1 part

[0050] 1 part pyrophyllite

[0051] 1 part muscovite

[0052] Negative ion powder 2 parts

[0053] Xu Yongtu 1 part

[0054] Calcite 1 part

[0055] 1 carbon fiber

[0056] Shell powder 2 parts

[0057] 10 parts of water.

[0058] The size of the carbon fiber is 100nm, the solid content of the thermosetting resin is 50%, the viscosity is 300-600cp at 25°C, and the density is 1.2g / cm at 20°C 3 , polymerization time, 80s at 120°C, storage stability >60 days at 20°C, the particle size of the bark powder is 80 mesh, and the particle size of other mineral and shell powder is 100 mesh.

[0059] For the production of 5-layer plywood: the thickness of the veneer is 1.3-1.4mm, the moisture content of the veneer is ≤8%, and the glue amount is 300g / cm 2 (double-sided), hot-pressing pressure 3.5MPa, temperature 160°C, hot-pressing time 7 minutes, aged for 24 hours after unloading. ...

Embodiment 2

[0061] Thermosetting phenolic resin 80 parts

[0062] 10 parts bark powder

[0063] illite 1 part

[0064] 1 part pyrophyllite

[0065] 1 part muscovite

[0066] Negative ion powder 1 part

[0067] Xu Yongtu 1 part

[0068] Calcite 1 part

[0069] 1 carbon fiber

[0070] Shell powder 1 part

[0071] 2 parts of water.

[0072] The size of the carbon fiber is 200nm, the solid content of the thermosetting resin is 50%, the viscosity is 300-600cp at 25°C, and the density is 1.2g / cm at 20°C 3 , polymerization time, 80s at 120°C, storage stability >60 days at 20°C, the particle size of the bark powder is 150 mesh, and the particle size of other mineral and shell powder is 120 mesh.

[0073] For the production of 5-layer birch plywood: the thickness of the veneer is 1.3-1.4mm, the moisture content of the veneer is ≤7%, and the glue amount is 280g / cm 2 (double-sided), hot-pressing pressure 1.0MPa, temperature 100-120°C, hot-pressing time 7 minutes, after unloading, put it as...

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PUM

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Abstract

The invention relates to a composite phenolic glue composition which comprises thermosetting phenolic resin, bark powder, illite, pyrophyllite, muscovite, anion powder, halloysite, calcite, carbon fiber, shell powder and water. When a certain amount of larch bark powder, which contains abundant tannin and lignin, is added into a phenolic resin glue in due time, the larch bark powder can perform the functions of substituting equal amount of glue, saving the glue and lowering the free phenols and aldehydes, and can also enhance the quality of the artificial board and prevent the artificial board from cracking. The bark is a wood production leftover, and is a pure natural nontoxic biomass material; and thus, when the bark is substituted for part of the phenolic glue, the artificial board production technique, including gluing, hot pressing and the like, is not changed, the inspection proves that the produced artificial board satisfies the national standard, and the release amounts of phenols and aldehydes can be greatly lowered.

Description

[0001] technical field [0002] The invention belongs to the field of wood science and technology in forestry engineering, and in particular relates to a compound phenolic glue composition and an application method thereof. [0003] Background technique [0004] Thermosetting phenolic resin adhesive is one of the adhesives widely used in the field of wood-based panel production. Due to its high bonding strength, good water resistance and heat resistance, its consumption in the wood-based panel industry is second only to urea-formaldehyde resin. It is widely used in Gluing of water-resistant and heat-resistant wood-based panels and wood products such as Class I plywood, container floor, finger-jointed timber, and laminated timber. [0005] But the main defect of phenolic glue is: the main raw material phenol and formaldehyde of producing this glue all pollute the environment seriously, free phenol and free aldehyde escape during the glue making process, and the finished prod...

Claims

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Application Information

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IPC IPC(8): C09J161/06C09J197/02C09J11/04C09J11/00
Inventor 周广胜周轶
Owner 周广胜
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