Preparation method for copper foil current collector and application
A technology of current collector and copper foil, applied in the field of new material synthesis and preparation, can solve the problems of weak adhesion between copper foil and active material, complicated technology of coating a conductive carbon layer, affecting the utilization rate of electrode materials, etc. Effects of improved power density and low contact resistance
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0030] A method for preparing a copper foil current collector, comprising the following steps:
[0031] (1) Provide a copper foil with a thickness of 9 μm, soak the copper foil in a hydrochloric acid solution with a concentration of 0.1mol / L for 10 minutes to remove surface oxides, and then ultrasonically clean the copper foil with ethanol and acetone for 20 minutes to remove surface oil and then place it in a chemical Inside the vapor deposition equipment, sealed;
[0032] (2) Introduce 100 sccm of hydrogen gas into the chemical vapor deposition equipment, start heating after exhausting the air, turn on the plasma equipment after heating to 1000°C (the power of the radio frequency matching device is 500w), and inject 200 sccm of methane for 100 minutes After the reaction is over, stop heating, turn off the plasma equipment, stop feeding methane, cool to room temperature under the protection of hydrogen, stop feeding hydrogen, and obtain a copper foil current collector with gr...
Embodiment 2
[0040] A method for preparing a copper foil current collector, comprising the following steps:
[0041](1) Provide a copper foil with a thickness of 15 μm, soak the copper foil in a sulfuric acid solution with a concentration of 0.5mol / L for 5 minutes to remove surface oxides, and then undergo ultrasonic cleaning with ethanol and acetone for 20 minutes to remove surface oil and then place it in a chemical Inside the vapor deposition equipment, sealed;
[0042] (2) Introduce 50 sccm of argon gas into the chemical vapor deposition equipment, and start heating after exhausting the air. After heating to 800°C, turn on the plasma equipment (the power of the radio frequency matching device is 500w), and inject 50 sccm of acetylene to keep After 300 minutes, after the reaction is over, stop heating, turn off the plasma equipment, stop feeding acetylene, cool to room temperature under the protection of argon, stop feeding argon, and obtain a copper foil current collector with graphene...
Embodiment 3
[0045] A method for preparing a copper foil current collector, comprising the following steps:
[0046] (1) Provide a copper foil with a thickness of 12 μm, soak the copper foil in a nitric acid solution with a concentration of 0.3mol / L for 6 minutes to remove surface oxides, and then ultrasonically clean the copper foil with ethanol and acetone for 20 minutes to remove surface oil and then place it in a chemical Inside the vapor deposition equipment, sealed;
[0047] (2) Introduce 60 sccm of nitrogen gas into the chemical vapor deposition equipment, and start heating after exhausting the air. After heating to 900°C, turn on the plasma equipment (the power of the radio frequency matching device is 500w), and inject 100 sccm of ethane to keep After 200 minutes, after the reaction is over, stop heating, turn off the plasma equipment, stop feeding ethane, cool to room temperature under the protection of nitrogen, stop feeding nitrogen, and obtain a copper foil current collector w...
PUM
Property | Measurement | Unit |
---|---|---|
Thickness | aaaaa | aaaaa |
Thickness | aaaaa | aaaaa |
Internal resistance | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com