Method for utilizing low co-fusion type ionic liquid electro-deposition to manufacture nanometer copper powder

A technology of ionic liquid and nano-copper powder, which is applied in the field of low-eutectic ionic liquid electrodeposition to prepare nano-copper powder, can solve the problems of water introduction, hydrogen evolution interference, etc., and achieve high added value, short production process and stable product quality Effect

Inactive Publication Date: 2014-03-19
KUNMING UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

But this method: 1) need to dissolve a certain amount of anhydrous CuCl in advance 2 Under conditions that induce continuous dissolution of anodic copper, due to the anhydrous CuCl 2 The strong hygroscopicity makes it inevitable to introduce water during the experimental operation, which will cause the interference of hydrogen evolution; 2) The method of sacrificial copper anode can replenish the copper ions consumed by cathodic deposition, but the anode copper dissolves in the ionic liquid and is charged Chemical control, while cathodic deposition to obtain copper powder reaction is controlled by diffusion

Method used

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  • Method for utilizing low co-fusion type ionic liquid electro-deposition to manufacture nanometer copper powder
  • Method for utilizing low co-fusion type ionic liquid electro-deposition to manufacture nanometer copper powder
  • Method for utilizing low co-fusion type ionic liquid electro-deposition to manufacture nanometer copper powder

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Embodiment 1

[0017] The method for preparing nano-copper powder by electrodeposition of low-eutectic ionic liquids, the specific steps are as follows: firstly, choline chloride and urea are dried under vacuum at 80°C, then mixed according to the molar ratio of 1:2 and heated at a constant temperature of 80°C The low-eutectic ionic liquid can be prepared by reacting for 2 hours under the same conditions; the copper precursor is added to the prepared 50mL low-eutectic ionic liquid and mixed evenly, and the ionic liquid-copper salt composite electrolyte is prepared, wherein the copper precursor is Cuprous oxide, the mass ratio of the volume of eutectic ionic liquid to cuprous oxide is 100:300ml / mg; under an inert atmosphere, use stainless steel (1.0cm×1.0cm×0.2cm) as the cathode and graphite as the anode, The electrode spacing is 1cm, and the temperature is 30°C, the stirring rate is 100r / min, the control cell voltage is 2.5V, and the electrodeposition is in the ionic liquid-copper salt compos...

Embodiment 2

[0020] The method for preparing nano-copper powder by electrodeposition of low-eutectic ionic liquids, the specific steps are as follows: firstly, choline chloride and urea are dried under vacuum at 80°C, then mixed according to the molar ratio of 1:4 and heated at a constant temperature of 80°C Under the conditions, the low eutectic ionic liquid can be prepared by reacting for 2 hours; the copper precursor is added to the prepared 50ml low eutectic ionic liquid and mixed evenly, and the ionic liquid-copper salt composite electrolyte is prepared, wherein the copper precursor is Cuprous oxide, the mass ratio of the volume of low-eutectic ionic liquid to cuprous oxide is 100:600ml / mg; under an inert atmosphere, use a nickel sheet (1.0cm×1.0cm×0.2cm) as the cathode and graphite as the anode , with a pole spacing of 1 cm, electrodeposited in the prepared ionic liquid-copper salt composite electrolyte for 2 hours at a temperature of 30 °C, a stirring rate of 300 r / min, and a control...

Embodiment 3

[0023] The method for preparing nano-copper powder by electrodeposition of low-eutectic ionic liquids, the specific steps are as follows: first, dry choline chloride and urea under vacuum at 80°C, mix them in a molar ratio of 1:3, and heat at a constant temperature of 80°C Under the conditions, the low eutectic ionic liquid can be prepared by reacting for 2 hours; the copper precursor is added to the prepared 50ml low eutectic ionic liquid and mixed evenly, and the ionic liquid-copper salt composite electrolyte is prepared, wherein the copper precursor is Cuprous oxide, the mass ratio of the volume of low eutectic ionic liquid to cuprous oxide is 100:500ml / mg; then under an inert atmosphere, graphite is used as the anode, nickel sheet (1.0cm×1.0cm×0.2cm) is used as The cathode, the distance between electrodes is 1cm, the above-mentioned low eutectic ionic liquid is electrolyte solution, at a temperature of 50°C, a stirring rate of 300r / min, and a controlled current density of 5...

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Abstract

The invention relates to a method for utilizing low co-fusion type ionic liquid electro-deposition to manufacture nanometer copper powder and is mainly applied to the field of material preparation. The method comprises the steps of mixing choline chloride and urea after performing vacuum drying on choline chloride and urea, performing reaction to obtain low co-fusion type ionic liquid, adding a copper precursor to perform uniform mixing, and obtaining an ionic liquid-copper salt compound electrolyte; finally under the inert atmosphere, enabling stainless steel, a nickel sheet or a titanium sheet to serve as a negative pole, enabling graphite or an inertial positive pole to serve as a positive pole, performing electro-deposition in the ionic liquid-copper salt compound electrolyte, and obtaining the nanometer copper powder with the grain size of 30-50nm on the surface of the negative pole. The method has the advantages that the method is low in cost and reaction energy consumption, short in production flow, free of pollution and simple in process, product quality is stable, and added values are high.

Description

technical field [0001] The invention relates to a method for preparing nano-copper powder by electrodeposition of a low-eutectic ionic liquid, which is mainly used in the field of material preparation. Background technique [0002] Because of its excellent electrochemical properties, copper powder is often used as conductive adhesive, conductive coating and electrode material widely used in machinery, metallurgy, chemical industry, aerospace and other fields; nano copper powder has small size effect, surface effect, quantum size Effect, macroscopic electron tunneling effect and dielectric confinement effect and other characteristics greatly broaden its traditional use. In recent years, studies have found that nano-copper powder can be used to make catalysts, lubricant additives, and treat osteoporosis and fractures in the medical field; with the development of the electronics industry, ultra-fine thick-film paste prepared from nano-copper powder will be used on a large scale...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F9/24C25C5/02
Inventor 张启波汪瑞华一新徐存英李艳李坚
Owner KUNMING UNIV OF SCI & TECH
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