Polishing solution containing ceric oxide powder/colloid silicon dioxide mixed abrasive and preparing process thereof

Abstract

The invention relates to a chemically mechanical polishing solution and a preparation process thereof, and particularly to a polishing solution containing a ceric oxide powder / colloid silicon dioxide mixed abrasive and a preparing process thereof. The polishing solution containing the mixed abrasive is simple in preparing process, practical and prone to production. Raw materials of the polishing solution comprise 3-10% of ceric oxide powder having a particle size of 100-2000 nm, 5-50% of colloid silicon dioxide having a particle size of 10-200 nm, and 0.001-0.5% of a dispersing agent, with the balance being water. The polishing solution is prepared by selecting a container, adding the colloid silicon dioxide solution, adding the ceric oxide powder, stirring uniformly, adding the dispersing agent and the water to the required volume, and stirring uniformly. The ceric oxide powder and the colloid silicon dioxide of different particle sizes are adopted as the abrasive. In the polishing solution, the smaller silicon dioxide particles decrease scratches, pits, and other defects so as to improve the surface quality, and the larger ceric oxide particles obtain a high removing rate.

Description

technical field [0001] The invention relates to a chemical mechanical polishing liquid and a preparation process thereof, in particular to a polishing liquid containing cerium oxide powder and colloidal silicon dioxide mixed abrasives and a preparation process thereof. Background technique [0002] With the rapid development of computer technology, the requirements for the storage capacity of computer hard disks are getting higher and higher. Due to the high mechanical strength, impact resistance, and non-deformation characteristics of glass, glass substrate hard disks gradually replace the previous aluminum substrate hard disks. [0003] As the substrate of computer hard disk, glass requires a smooth surface without dents, and chemical mechanical polishing is an important means to reduce the surface roughness of glass substrates. [0004] The traditional glass rough polishing liquid generally uses a single abrasive of ceria, but due to the large particle size, it often prod...

AI Technical Summary

Problems solved by technology

[0004] The traditional glass rough polishing liquid generally uses a single abrasive of ceria, but due to the large particle size, it often produces hard impact when it hits the glass surface, which is easy to cause microscopic defects such as large scratches and pits, so the single abrasive is gradually compounded / mixed abrasive instead

[0005] Generally, the preparation of composite abrasives generally adopts the methods of precipitation, filtration, and high-temperature calcination. The preparation method is complicated, the time is long, and the size and shape of the prepared composite particles are not uniform.

Images