PCB (Printed Circuit Board) silver paste and manufacturing method thereof

Abstract

The invention provides a PCB silver paste. The PCB silver paste is manufactured by the following raw material by weight, glass powder 8 to 10, 10 to 15mum flake silver powder 40 to 50, nanoscale flake silver powder 15 to 20, silver coated nickel powder 10 to 15, bisphenol F-type epoxy resin 8 to 12, isopropyl myristate 1 to 2, tartaric acid 1 to 2, sebacic acid 2 to 3, nano chitin 0.3 to 0.5, polyvinyl alcohol 1 to 2, terpineol 4 to 6, 2-methyl imidazole 0.3 to 0.5, butylcarbitol 4 to 6, methyl cellosolve 3 to 5, and butyl carbitol acet 3 to 5. According to the silver paste of the invention, through using flake silver powder different in particle sizes, contact is tight, and conductive performance is good; the cost is saved through using the silver coated nickel powder; the production technology is unique, and silver powder can be prevented from being aggregated to influence the conductvie performance; and the printing performance is good, the circuit board yield is high, falling is not easy, and the use time is long.

Description

technical field [0001] The invention belongs to the technical field of electronic paste, and in particular relates to a PCB printed circuit board silver paste and a preparation method thereof. Background technique [0002] In the modern microelectronics industry, people have higher and higher requirements for electronic components, and production is mostly carried out by process and standardization to reduce costs. Printed circuit boards (PCBs) were born to meet the needs of the microelectronics industry. Correspondingly, the conductive paste, electrode paste, dielectric paste, resistor paste, filling paste and other electronic pastes that require new requirements are matched with the printed circuit board (PCB), and research on new conductive pastes is carried out. It is imperative. [0003] Generally speaking, the main components of electronic paste include functional phase such as metal, precious metal powder, etc., inorganic binder such as glass powder, oxide powder, et...

AI Technical Summary

Problems solved by technology

[0005] The binder in the conductive silver paste has a great influence on the yield of circuit printing, such as viscosity, cohesiveness, adhesion, leveling, film formation, solvent volatility, etc. will affect the printing performance of the circuit , there are pores, open circuits, etc., and sometimes the glass phase has not yet begun to melt after the organic matter has volatilized, resulting in the phenomenon that the conductive line falls off from the substrate, and the conductive line is scrapped. Therefore, the performance of the organic binder needs to be improved.

[0006] At present, many inorganic binders use glass powder. Glass powder is made of metal oxides, silicon oxide and other materials. If the melting point is too high, the glass phase has not yet started to melt after the volatilization of organic matter is completed, resulting in conductive lines obtained from conductive silver paste. The phenomenon of falling off from the substrate makes the conductive circuit scrapped; and many of the current glass powders contain harmful substances such as lead, which is not good for the environment, so it is necessary to develop glass powders with better performance