Novel heat insulating plate and manufacturing method thereof

A thermal insulation board, a new type of technology, applied in the field of thermal insulation boards, can solve the problems of high thermal conductivity, low mechanical strength, and strong water absorption of expanded perlite thermal insulation boards, and achieve the effects of high thermal conductivity, low mechanical strength, and excellent fireproof performance

Active Publication Date: 2014-09-24
合肥候鸟新型材料有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] For this reason, the technical problem to be solved by the present invention is that the new expanded perlite insulation board prepared by the prior art still has the defects of strong water absorption, low mechanical strength, and large thermal conductivity, so a new type of expanded perlite insulation board with both fire prevention and thermal insulation is proposed. Novel thermal insulation board with high performance and preparation method thereof

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  • Novel heat insulating plate and manufacturing method thereof
  • Novel heat insulating plate and manufacturing method thereof
  • Novel heat insulating plate and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] This embodiment provides a new type of insulation board, the structure of which is as follows: figure 1 and figure 2 As shown, it is prepared using the following raw materials:

[0032] Expanded perlite particles, 80kg;

[0033] Unsaturated phenolic resin, 10kg;

[0034] Modifier silane coupling agent, 0.2kg;

[0035] Silica powder, 0.4kg;

[0036] Foaming agent n-pentane, 0.1kg;

[0037] Curing agent hexamethylenetetramine, 0.5kg.

[0038] The novel insulation board is prepared by the following method:

[0039] (1) Take the organic coating film material, modifying agent, inorganic micropowder, foaming agent according to the above weight, and after diluting with 4kg of ethanol, the coating slurry is obtained;

[0040] (2) According to the above weight, the expanded perlite particles are added to the mixer together with the coating slurry described in step (1), the particle size of the expanded perlite particles is 0.2mm, and the porosity is 85%. Under stirring co...

Embodiment 2

[0043] This embodiment provides a novel insulation board, which is prepared from the following raw materials:

[0044] Vitrified microbeads, 90kg;

[0045] Polyurethane, 20kg;

[0046] Modifier stearic acid, 0.5kg;

[0047] Calcium carbonate, 3kg;

[0048] Foaming agent petroleum ether, 0.5kg;

[0049] Curing agent polyamide, 1kg.

[0050] The novel insulation board is prepared by the following method:

[0051] (1) Take the organic coating film material, modifying agent, inorganic micropowder, foaming agent according to the above weight, and after diluting with 4kg of ethanol, the coating slurry is obtained;

[0052] (2) Take the vitrified microbead particle according to the above weight and add it to the mixer together with the coating slurry described in step (1), the particle size of the vitrified microbead particle is 2.5mm, and the porosity is 80%. , making it fully mixed for 10 minutes under stirring conditions, so that each expanded perlite particle is evenly coat...

Embodiment 3

[0055] This embodiment provides a novel insulation board, which is prepared from the following raw materials:

[0056] The mixture of expanded perlite, vitrified microspheres, foam glass and ceramic microspheres in a mass ratio of 1:1:1:1, 95kg;

[0057] A mixture of polyurethane, polystyrene, epoxy resin, unsaturated phenolic resin, and urea-formaldehyde resin in a mass ratio of 1:1:1:1, 30kg;

[0058] The modifier is a mixture of silane coupling agent, titanate coupling agent, aluminate coupling agent, and stearic acid in a mass ratio of 1:1:1:1:1, 2kg;

[0059] A mixture of silica, calcium carbonate, silicon carbide, alumina, and graphite in a mass ratio of 1:1:1:1, 10kg;

[0060] Foaming agent n-heptane, 2kg;

[0061] The curing agent is a mixture composed of hexamethylenetetramine, p-phenylmethanesulfonic acid, aliphatic polyamine, and polyamide in a mass ratio of 1:1:1:1, 3kg.

[0062] The novel insulation board is prepared by the following method:

[0063] (1) Take ...

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Abstract

The invention provides a novel heat insulating plate. Active components of the novel heat insulating plate comprise 70-95 parts by weight of inorganic heat insulating particles and 5-30 parts by weight of an organic coating membrane material, wherein the outer surfaces of all inorganic heat insulating particles are coated with the organic coating membrane material to form 'capsule' type inorganic-organic composite heat insulating units, subsequently the 'capsule' type inorganic-organic composite heat insulating units are connected together by using a curing agent, and then a plate is formed in a mold, namely the novel heat insulating plate is obtained. The novel heat insulating plate disclosed by the invention can be used for improving the mechanical strength, also preventing exposure and water absorption of the inorganic heat insulating particles and limiting the air inside the 'capsule' type inorganic-organic composite heat insulating units as well so as to effectively reduce air motion inside the plate and reduce convective heat transfer, thus the heat conductivity coefficient is relatively as low as 0.032W/(m.K) to 0.040W/(m.K) and A-grade non-ignition can be truly realized, and therefore the novel heat insulating plate has both excellent fireproof performance and relatively-good heat insulation performance.

Description

technical field [0001] The invention relates to a novel insulation board and a preparation method thereof, belonging to the technical field of insulation boards. Background technique [0002] At present, thermal insulation materials for external walls can be divided into organic materials and inorganic materials. Among them, the organic materials are mainly polystyrene materials, foamed polyurethane, foamed phenolic resin, etc., and the inorganic materials are rock wool, foamed cement, glass wool, pearls, etc. Mainly rocks. Judging from the thermal conductivity of different thermal insulation materials, the thermal conductivity of organic thermal insulation materials is lower than that of inorganic thermal insulation materials, so the thermal insulation performance of organic materials is generally better than that of inorganic materials. For example, the thermal conductivity of polyurethane foam materials is lower than that of inorganic thermal insulation materials, so orga...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B26/04C04B26/14C04B26/12C04B14/18C04B14/22C04B14/24
Inventor 王璐
Owner 合肥候鸟新型材料有限公司
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