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an underfill

An underfill and resin technology, used in adhesives and other directions, can solve the problems of poor moisture resistance and heat resistance, single curing method, poor weather resistance, etc., to improve temperature and corrosion resistance and weather resistance, reduce costs, and short curing time. Effect

Active Publication Date: 2016-02-03
东莞市新懿电子材料技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, underfills in the prior art generally use epoxy resin as the main component, and epoxy resin has disadvantages such as high viscosity, poor fluidity, poor weather resistance, poor moisture and heat resistance, and is prone to failure when used outdoors
In addition, underfills in the prior art generally can only use one curing method: heat curing, light curing or moisture curing, and the curing method is relatively single.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] An underfill provided in this embodiment includes the following components by mass percentage:

[0044] Hydroxyethyl acrylate modified silicone resin 65%;

[0045] Dibenzoyl peroxide 5%;

[0046] 2-Hydroxy-2-methyl-1-phenylacetone 5%;

[0047] Tripropylene glycol diacrylate 15%;

[0048] Nano calcium carbonate 5%;

[0049] Fumed silica 4.5%;

[0050] Toner Permanent Yellow 0.5%

[0051] Silicone resins contain phenyl groups.

[0052] Its preparation method comprises the following steps:

[0053] The first step, the preparation of silicone resin:

[0054] (1) Alcoholysis, under the ice-water bath, add the mixture of methyltrichlorosilane and phenyltrichlorosilane to the container, the molar ratio of methyltrichlorosilane and phenyltrichlorosilane is 1:1, and then add The molar ratio of absolute ethanol, the mixture of absolute ethanol and the two (ie methyltrichlorosilane and phenyltrichlorosilane) is 1:1. After stirring for 30min, add dimethyldichlorosilane and di...

Embodiment 2

[0061] An underfill provided in this embodiment includes the following components by mass percentage:

[0062] 70% of hydroxypropyl methacrylate modified silicone resin;

[0063] Dicumyl peroxide 6%;

[0064] Hydroxycyclohexyl phenyl ketone 4%;

[0065] Isobornyl Acrylate 15%;

[0066] Organic bentonite 3.7%;

[0067] Titanium dioxide 1.3%.

[0068] Silicone resins contain phenyl groups.

[0069] The preparation method of the underfill comprises the following steps:

[0070] The first step, the preparation of silicone resin:

[0071] (1) Alcoholysis, in an ice-water bath, add a mixture of methyltrichlorosilane and phenyltrichlorosilane to the container, the molar ratio of methyltrichlorosilane and phenyltrichlorosilane is 3:1, and then add The molar ratio of absolute ethanol, the mixture of absolute ethanol and the two (ie methyltrichlorosilane and phenyltrichlorosilane) is 1.02:1, after stirring for 40min, add dimethyldichlorosilane and diphenyldichlorosilane. The mix...

Embodiment 3

[0078] A kind of bottom filler, it comprises the following components by mass percentage:

[0079] 70% silicone resin modified with hydroxyethyl methacrylate;

[0080] tert-butyl peroxybenzoate 5%;

[0081] 2,4-Dihydroxybenzophenone 5%;

[0082] 1,6 hexanediol diacrylate 10%;

[0083] Nano titanium dioxide 5%;

[0084] Polyamide wax 4.3%;

[0085] Toner Phthalocyanine Blue 0.7%

[0086] Silicone resins contain phenyl groups.

[0087] The preparation method of the underfill comprises the following steps:

[0088] The first step, the preparation of silicone resin:

[0089] (1) Alcoholysis, under an ice-water bath, add a mixture of methyltrichlorosilane and phenyltrichlorosilane to the container, and the molar ratio of the methyltrichlorosilane to the phenyltrichlorosilane is 5: 1, then add absolute ethanol, the molar ratio of absolute ethanol and the mixture of the two (ie methyltrichlorosilane and phenyltrichlorosilane) is 0.99:1, after stirring for 60min, add dimethyld...

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Abstract

The invention belongs to the technical field of an adhesive, and particularly relates to an adhesive for underfilling or surface packaging. The underfill adhesive comprises the following components in percentage by mass: acrylic ester-modified organic silicon resin, a curing agent, a photoinitator, a diluent, a thixotropic agent and the like. Compared with the prior art, the underfill adhesive has the advantages that the acrylic ester-modified organic silicon resin is adopted to replace epoxy resin, so that the temperature resistance, corrosion resistance, weather resistance and flexibility of the cured adhesive can be greatly improved. In addition, the adhesive can be cured by multiple curing modes such as photocuring and thermocuring, and the technological application types of the adhesive can be increased, so that the adhesive not only can be used for underfilling of a chip, but also can be used for surface coating and packaging of electronic components.

Description

technical field [0001] The invention belongs to the technical field of adhesives, and in particular relates to an underfill. Background technique [0002] With the rapid development of the electronic industry, the closely related electronic packaging technology is also becoming more and more advanced. Intelligent, light weight, small size, fast speed, strong function and good reliability have become the main development trend of electronic products. Under this development trend, the underfill of CSP / BGA chips has been more and more widely used due to its advantages of good process operation, easy maintenance, impact resistance, and drop resistance. [0003] However, the underfill adhesive in the prior art generally uses epoxy resin as the main component, and epoxy resin has disadvantages such as high viscosity, poor fluidity, poor weather resistance, poor moisture resistance and heat resistance, and is prone to failure when used outdoors. In addition, the underfill adhesiv...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J183/07C08G77/38
Inventor 黄剑滨居仁贤黄伟希
Owner 东莞市新懿电子材料技术有限公司