Low-temperature thermal control phase change microcapsule and preparation method thereof

A technology of phase-change microcapsules and low-temperature heat, which is applied in the direction of microcapsule preparation, microsphere preparation, chemical instruments and methods, etc., can solve the problems of low thermal conductivity and achieve high thermal conductivity, large latent heat, and high thermal conductivity Effect

Active Publication Date: 2015-02-18
海鹰空天材料研究院(苏州)有限责任公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the above disclosed patents use paraffin as the capsule core and obtain phase-change microcapsules by in-situ polymerization, they all have the problem of low thermal conductivity, generally less than 0.15W / (m.k), and are not suitable for use in thermal control fields such as electronic devices.

Method used

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  • Low-temperature thermal control phase change microcapsule and preparation method thereof
  • Low-temperature thermal control phase change microcapsule and preparation method thereof
  • Low-temperature thermal control phase change microcapsule and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0051] Core material: n-tetradecane, shell: urea-formaldehyde resin, thermally conductive filler: high thermally conductive carbon powder and carbon fiber, the mass of carbon fiber accounts for 50% of the mass of the thermally conductive filler; the thermally conductive filler accounts for 20% of the mass of the core material.

[0052] Concrete preparation process is as follows:

[0053] (1) Paraffin alkane preheating treatment

[0054] Preheat 2000g of n-tetradecane phase change raw material (Alfalfa reagent, purity ≥ 99%) in a 60°C water bath for 1 hour to ensure that the system temperature does not drop after the materials are mixed in the later stage.

[0055] (2) Prepolymer synthesis

[0056] Weigh 750g of urea into a 5L three-neck bottle, add 1700g of formaldehyde and 164g of melamine with a concentration of 37% respectively, set the temperature of the water bath at 70°C, stir and heat for 1h, add 8.0g of triethanolamine reagent, and adjust the pH value of the reaction ...

Embodiment 2

[0071] Core material: n-pentadecane, shell: urea-formaldehyde resin, thermally conductive filler: high thermally conductive carbon powder and carbon fiber, the mass of carbon fiber accounts for 17.5% of the mass of the thermally conductive filler; the thermally conductive filler accounts for 5% of the mass of the core material.

[0072] The specific preparation process is the same as in Example 1. The performance test was carried out on the phase change microcapsules after drying, and its parameters are shown in Table 2.

Embodiment 3

[0074] Core material: n-heptadecane, shell: urea-formaldehyde resin, thermally conductive filler: high thermally conductive carbon powder and carbon fiber, the mass of carbon fiber accounts for 32.5% of the mass of the thermally conductive filler; the thermally conductive filler accounts for 30% of the mass of the core material.

[0075] The specific preparation process is the same as in Example 1. The performance test was carried out on the phase change microcapsules after drying, and its parameters are shown in Table 2.

[0076] Table 2

[0077]

[0078] Note: The enthalpy values ​​of n-pentadecane and n-heptadecane in Table 2 are the effective enthalpy values ​​in the DSC test.

[0079] As can be seen from Table 2, along with the increase of thermally conductive fillers, the better the thermal conductivity of the phase change material, the lower the phase change enthalpy. Control, so the content of thermally conductive fillers cannot be added indefinitely, and the pres...

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Abstract

The invention provides a low-temperature thermal control phase change microcapsule and a preparation method thereof. The low-temperature thermal control phase change microcapsule takes paraffin alkane as a core material and urea resin as a shell, and further comprises a heat conduction filler, the heat conduction filler is added in the process of coating the paraffin alkane by the urea resin, and the amount of the added heat conduction filler is 5%-30% that of the paraffin alkane. The low-temperature thermal control phase change microcapsule prepared by the invention is solid-solid phase change, the problems of fusion flowing and permeation migration are avoided, the range of phase change temperature is wide, the latent heat is large, the condensate depression is small, the phase change process is stable, the phase change is reversible, the material further has a higher heat conduction property, and as a relatively ideal thermal control phase change material, the low-temperature thermal control phase change microcapsule can be widely used in the fields of thermal protection, like aerospace, precise instruments, and electron devices.

Description

technical field [0001] The invention relates to a low-temperature thermally controlled phase change microcapsule and a preparation method thereof, belonging to the technical field of new energy storage materials. Background technique [0002] With the increasing demand for energy, the shortage and scarcity of energy resources have become particularly prominent. Therefore, energy conservation, energy conservation and efficient use of other renewable energy sources have become important contents in the energy field. Using phase change latent heat of phase change materials to store energy (cold storage, heat storage) is a new type of environmental protection and energy saving technology, which can solve the mismatch in time and space between energy demand and supply, and can realize energy storage. Manage efficiently. According to the different phase change methods, phase change materials can be divided into solid-solid phase change materials, solid-gas phase change materials ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K5/06B01J13/14
Inventor 王瑞杰党广洲金兆国周清彭磊郭慧贺剑詹万初刘斌裴雨辰
Owner 海鹰空天材料研究院(苏州)有限责任公司
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