A kind of calcium-aluminosilicate glass-based low-temperature co-fired ceramic material and preparation method thereof

Abstract

The invention provides a calcium aluminum silicon glass base low-temperature cofiring ceramic material and a preparation method thereof. The ceramic material comprises the following components in parts by weight: 40-60 parts of calcium aluminum silicon glass, 2-5 parts of silicon carbide, 10-20 parts of forsterite, and 5-10 parts of carbon nano tube. According to the invention, the calcium aluminum silicon glass is adopted as basic glass; the principal crystalline phase is silicate p-wollostonite adopting a chain structure, and is crossed and arrayed to net in a needle-shaped manner in the glass body; the material is enabled to have characteristics of being abrasion resistant, corrosion-resistant and shock resistant; the silicon carbide, the forsterite and the carbon nano tube are added in the calcium aluminum silicon glass, and the synergistic effect among the materials is utilized, so that the thermal conductivity of the prepared ceramic material is improved; the melting point of the calcium aluminum silicon glass is further reduced; experimental result shows that the coefficient of thermal expansion of the prepared ceramic material is 6.0*10<-6> / K, the dielectric constant of the ceramic material is 5.2 (1 MHz), and the thermal conductivity of the ceramic material is 32 W / mK.

Description

technical field [0001] The invention relates to the technical field of low-temperature co-fired ceramics, in particular to a calcium-aluminosilicate glass-based low-temperature co-fired ceramic material and a preparation method thereof. Background technique [0002] With the rapid development of modern information technology, miniaturization, light weight = integration and high frequency of electronic circuits have put forward requirements for electronic devices such as small size, high frequency, high reliability and high integration. Selecting appropriate ceramics that can be co-fired with conductive materials such as silver at a temperature not exceeding 900°C to prepare multilayer components or embed passive devices in multilayer circuits has become the inevitable trend of the above trend, as passive integration Low-temperature co-fired ceramics as the main dielectric material of components has also become an important development trend. [0003] Low-temperature co-fire...

AI Technical Summary

Problems solved by technology

However, the preparation methods of the basic materials reported above all use aluminum nitride and glass materials to increase the thermal conductivity of the material, and the thermal conductivity of the prepared material is low, and it is not conducive to large-scale industrial production.

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