High-toughness and high-thermal-conductivity polymer material and preparation method thereof

A polymer material and high thermal conductivity technology, which is applied in the fields of polymer materials and their preparation, high toughness and high thermal conductivity polymer materials and their preparation, can solve the problem that thermally conductive plastics cannot meet the processing performance requirements of polymer materials and affect the scale of thermally conductive plastics Use, reduce the mechanical properties of composite materials and other issues, achieve good surface quality and mechanical properties, avoid stress cracking, and improve the effect of interface properties

Inactive Publication Date: 2015-04-29
HUIZHOU KINGBALI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Granular and flake thermally conductive fillers that are widely used at present, although increasing the content, will greatly reduce the mechanical properties of the composite material, which cannot meet the application in some specific environments, especially in low temperature environments.
At present, most of the LED lamps used in the market are in the form of plastic-wrapped aluminum inserts or die-cast aluminum. Due to the huge difference in the linear expansion coefficients of the two materials, the plastic will crack durin

Method used

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  • High-toughness and high-thermal-conductivity polymer material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] Example 1 According to the formula in Table 1, 6 different formula products (1#~6# in Table 1) were produced, and compared with the products produced by the formula (7#) without adding carbon fiber composite materials. The physical property measurement results of 7 different products produced according to the formula in Table 1 are shown in Table 2. The results show that the high toughness and high thermal conductivity polymer material obtained by the method of the present invention has mechanical properties such as bending strength and elongation at break and It has a better effect in terms of heat conduction effect.

[0036] Table 1 Product formula table (unit: parts by weight)

[0037]

[0038] In the above formula, the specific ingredients adopted are as follows:

[0039] (1) Resin base material: translucent or opaque milky white granular polycaprolactam with a relative viscosity of 2.8;

[0040] (2) Thermally conductive filler: whisker-shaped thermally conduct...

Embodiment 2

[0057] Embodiment 2 The following formula and steps are used to realize the preparation of the high toughness and high thermal conductivity polymer material thermal conductive plastic of the present invention.

[0058] 1. Formula: 55 parts of resin base material (polycaprolactam, compounded with industrial liquid crystal polymer and polypropylene at 2:1:1), 4 parts of carbon fiber composite material (microcrystalline graphite), thermally conductive filler (zinc oxide whisker and Zinc oxide particles are compounded with talcum powder, aluminum oxide, silicon oxide, zinc oxide, magnesium oxide, calcium oxide, aluminum nitride, boron nitride, silicon carbide) in a mass ratio of 1:1) 16 parts, toughening agent (maleic anhydride Grafted SEBS) 0.5 parts, coupling agent (3-glycidyl ether oxypropyltrimethoxysilane) 3 parts, antioxidant (antioxidant 1010) 2 parts, processing aid (release agent) 1 part .

[0059] 2. Preparation steps:

[0060] (1) After atomizing 3-glycidyl etheroxypr...

Embodiment 3

[0068] Embodiment 3 The following formula and steps are used to realize the preparation of the high toughness and high thermal conductivity polymer material thermal conductive plastic of the present invention.

[0069] 1. Formula: 35 parts of resin base material (polyhexamethylene adipamide, polyphenylene sulfide, acrylonitrile-butadiene-styrene copolymer, compounded according to 1:1:1), carbon fiber composite material (short cut carbon fiber) 3.5 parts, thermally conductive filler (zinc oxide whiskers and calcium oxide particles compounded at a mass ratio of 1:3) 36 parts, toughening agent (POE and EVA compounded) 3 parts, coupling agent (liquid silane coupling Antioxidant) 0.1~2 parts, antioxidant (primary antioxidant 1098, auxiliary antioxidant 168) 1 part, processing aid (flame retardant) 5 parts.

[0070] 2. Preparation steps:

[0071] (1) After atomizing the coupling liquid silane coupling agent, pass the thermally conductive filler and carbon fiber composite material...

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Abstract

The invention discloses a high-toughness and high-thermal-conductivity polymer material and a preparation method thereof. The high-toughness and high-thermal-conductivity polymer material is prepared by premixing a resin-based material, a carbon fiber composite material, thermally conductive filler, a toughening agent, a coupling agent and other processing additives as raw materials, extruding, airing, pelletizing and the like in combination with a twin-screw extruder. The thermal conductivity of the obtained polymer material is improved, the polymer material has excellent mechanical properties, especially toughness, the requirements of fields of electronics, automotives and LED lamps on the processing performance of the polymer material are met and the polymer material is more conducive to being applied in the production of multiple products which have special shapes or have larger degree of deformation in the processing process and strict requirements on the toughness.

Description

technical field [0001] The invention relates to a polymer material and a preparation method thereof, in particular to a high toughness and high thermal conductivity polymer material and a preparation method thereof, belonging to the fields of polymer material modification and heat dissipation material preparation. Background technique [0002] In order to ensure the service life of the LED lamp, the heat-conducting composite material for the LED heat-dissipating shell is required to have a high thermal conductivity, good mechanical properties and processing properties. However, the thermal conductivity of the resin currently used to prepare the LED heat dissipation shell is low, only 0.2-04w / m.k, which does not meet the environment with strict heat dissipation requirements. Poor heat dissipation of LEDs can easily lead to problems such as power supply damage, accelerated light decay, and shortened lifespan. [0003] The traditional heat dissipation materials for lamp shells...

Claims

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Application Information

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IPC IPC(8): C08L77/02C08L77/06C08L81/02C08L67/02C08L71/08C08L55/02C08L23/12C08K13/06C08K7/00C08K7/06C08K3/04C08K7/08C08K3/22B29C47/92B29C48/92
CPCC08L77/02B29C48/92B29C2948/9259B29C2948/92704C08K2201/003C08K2201/004C08K2201/014C08L67/02C08L77/06C08L2205/03C08L2205/035C08L51/00C08K13/06C08K9/06C08K7/08C08K2003/2227C08K7/06C08K5/1345C08L101/12C08L23/12C08K3/04C08K2003/2296C08K3/34C08L81/02C08L55/02C08L23/0815C08L23/0853C08K2003/2206C08K5/20C08K5/526C08L53/025C08K9/04C08K7/04C08L33/20
Inventor 杨永佳张彦兵杨小义
Owner HUIZHOU KINGBALI TECH
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