Supercharge Your Innovation With Domain-Expert AI Agents!

Preparation method of resin composition and prepreg, composite base material and pcb base material

A technology of resin composition and prepreg, which is applied in chemical instruments and methods, circuit substrate materials, synthetic resin layered products, etc., can solve the problems of increased substrate brittleness, reduced dielectric and heat resistance, and achieve high crosslinking density , High heat resistance effect

Active Publication Date: 2018-10-23
KUANG CHI INST OF ADVANCED TECH
View PDF8 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the triazine ring structure formed after cyanate ester curing provides excellent heat resistance and dielectric properties, and at the same time increases the brittleness of the substrate.
The existing cyanate matrix composite materials are toughened and modified with epoxy resin, but the toughening of epoxy resin will lead to the reduction of dielectric and heat resistance properties

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Preparation method of resin composition and prepreg, composite base material and pcb base material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Take by weighing the bisphenol A type cyanate ester prepolymer of 90 weight parts, the polytetrafluoroethylene powder of 10 weight parts and the 2-methylimidazole (2-MI) of 0.02 weight part, add in the butanone of 66 weight parts Prepare a resin solution with a solid content of 60% (mass fraction), that is, in the resin solution, the mass ratio of each component is: bisphenol A cyanate prepolymer: polytetrafluoroethylene: 2-methylimidazole: Butanone=90:10:0.02:66. Dip 6 pieces (250mm*250mm) of 7628 quartz cloth into the above resin solution for impregnation, bake in an oven at 130°C for 2 minutes and then at 160°C for 5 minutes to make a semi-cured adhesive sheet. The gel time (G-T) of the splice is 105±15 seconds (171°C), and the fluidity is 25±5%. Superimpose and align the above 6 adhesive sheets, each with a 35μm copper foil on the top and bottom, in a vacuum press, at a temperature of 200°C and a pressure of 25kgf / cm 2 Conditions, pressed for 120 minutes to make a...

Embodiment 2

[0027] Take by weighing 70 parts by weight of dicyclopentadiene phenol type cyanate resin, 30 parts by weight of PFA (tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer) powder and 2-ethyl-4- Methylimidazole (2E4MI), join in the acetone of 66 weight parts and be made into the resin solution that solid content is 60%, i.e. in the resin solution, the mass ratio of each component is: dicyclopentadienol type cyanate resin: PFA:2E4MI:acetone=70:30:0.01:66. Dip 6 pieces (250mm*250mm) of 7628 quartz cloth into the above resin solution for impregnation, bake in an oven at 130°C for 2 minutes and then at 160°C for 5 minutes to make a semi-cured adhesive sheet. The gel time (G-T) of the splice is 105±15 seconds (171°C), and the fluidity is 25±5%. Superimpose and align the above 6 adhesive sheets, each with a 35μm copper foil on the top and bottom, in a vacuum press, at a temperature of 200°C and a pressure of 25kgf / cm 2 Conditions, pressed for 120 minutes to make a double-sided ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle diameteraaaaaaaaaa
quality scoreaaaaaaaaaa
Login to View More

Abstract

The invention discloses a resin composition and preparation methods of a prepreg, a composite substrate and a PCB (printed circuit board) substrate. The resin composition comprises the following components in parts by weight: 70-90 parts of cyanate resin, 10-30 parts of a fluorine-containing polymer and 0.01-0.05 part of an accelerant. The preparation method of the prepreg comprises the following steps: mixing the resin composition with an organic solvent to obtain a resin solution, wherein the solid content by mass fraction in the resin solution is 45-65%; and immersing glass fiber cloth into the resin solution to obtain a preimpregnated material and then drying the preimpregnated material to prepare the prepreg. The preparation method of the composite substrate includes: stacking the prepregs according to a perdetermined number and pressing. The preparation method of the PCB substrate comprises the steps of stacking the prepregs according to the perdetermined number, applying metal foils on double sides or single sides of the prepregs and pressing for preparation. The resin composition disclosed by the invention has high heat resistance, low dielectric loss and good toughness.

Description

technical field [0001] The invention relates to the field of polymer materials, in particular to a method for preparing a resin composition, a prepreg, a composite base material and a PCB base material. Background technique [0002] Cyanate resin is favored by many scientific researchers because of its excellent high temperature resistance and dielectric properties. Cyanate resin as the matrix has been widely used in composite substrates and high-frequency circuit boards. However, the triazine ring structure formed after cyanate ester curing provides excellent heat resistance and dielectric properties, and at the same time increases the brittleness of the substrate. The existing cyanate matrix composite materials are toughened and modified with epoxy resin, but the toughening of epoxy resin will lead to the reduction of dielectric and heat resistance properties. For this reason, it is a market trend to develop composite substrates that not only satisfy heat resistance, rig...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C08L79/04C08L27/12C08L27/18C08K7/14C08J5/24B32B15/08B32B27/04B32B37/10H05K1/03
CPCB32B15/08B32B27/04B32B2307/204B32B2307/306B32B2307/558B32B2457/08C08L79/04C08L2201/08C08L2203/20C08L2203/30H05K1/0313C08L27/18C08K7/14
Inventor 不公告发明人
Owner KUANG CHI INST OF ADVANCED TECH
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com