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High-stability nickel-tin-phosphorus chemical plating solution

An electroless plating solution, high stability technology, applied in liquid chemical plating, metal material coating process, coating, etc., can solve the problem of unstable nickel-tin-phosphorus electroless plating solution, difficulty in controlling the amount of addition, and the utilization rate of tin salt Low-level problems, to achieve the effects of easy control of the amount of addition, simple implementation, and improved corrosion resistance and compactness

Active Publication Date: 2015-04-29
江苏矽智半导体科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The problem to be solved by the present invention is that the current nickel-tin-phosphorus electroless plating solution is unstable, the utilization rate of tin salt is low and the amount of addition is difficult to control, and the problem of easy formation of precipitation

Method used

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  • High-stability nickel-tin-phosphorus chemical plating solution
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  • High-stability nickel-tin-phosphorus chemical plating solution

Examples

Experimental program
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Effect test

Embodiment 1

[0019] Prepare a kind of highly stable nickel-tin-phosphorus electroless plating solution according to the following formula, containing in every liter of solution:

[0020] NiCl 2 ·6H 2 O 25g

[0021] NaH 2 PO 2 ·H 2 O 20g

[0022] Sn(CH 3 SO 3 ) 2 SiO 2 15g

[0023] CH 3 COONa 8g

[0024] CH 3 COOH 10ml

[0025] Complexing agent 3.5g

[0026] Stabilizer 4g

[0027] Surfactant 2g

[0028] The remainder is water;

[0029] The complexing agent is prepared according to the following ratio: 35% glycine, 20% citric acid, 45% lactic acid, and the stabilizer is a mixture of ethoxy-a-naphtholsulfonic acid (ENSA), thiourea, and sodium thiosulfate. Among them, ethoxy-a-naphtholsulfonic acid (ENSA) accounts for 45%, thiourea accounts for 35%, sodium thiosulfate accounts for 20%, and the surfactant is n-octyl sodium sulfate. After preparing the solutions in turn, use dilute Sulfuric acid and potassium bicarbonate solution adjust the pH to 4.7, and the plating temper...

Embodiment 2

[0038] Prepare a kind of highly stable nickel-tin-phosphorus electroless plating solution according to the following formula, containing in every liter of solution:

[0039] NiCl 2 ·6H 2 O 25g

[0040] NaH 2 PO 2 ·H 2 O 20g

[0041] Sn(CH 3 SO 3 ) 2 SiO 2 6.5g

[0042] CH 3 COONa 7g

[0043] CH 3 COOH 10ml

[0044] Complexing agent 4g

[0045] Stabilizer 4g

[0046] Surfactant 2.5g

[0047] The remainder is water;

[0048] The complexing agent is prepared according to the following ratio: 60% glycine, 40% adipic acid, and the stabilizer is a mixture of ethoxy-a-naphthol sulfonic acid (ENSA), thiourea, and sodium thiosulfate, of which ethoxy Base-a-naphtholsulfonic acid (ENSA) accounts for 45%, thiourea accounts for 35%, sodium thiosulfate accounts for 20%, and the surfactant is n-octyl sodium sulfate. After preparing the solution in turn, use dilute sulfuric acid and carbonic acid to The potassium hydrogen solution adjusts the pH to 4.0,...

Embodiment 3

[0057] Prepare a kind of highly stable nickel-tin-phosphorus electroless plating solution according to the following formula, containing in every liter of solution:

[0058] NiCl 2 ·6H 2 O 35g

[0059] NaH 2 PO 2 ·H 2 O 25g

[0060] Sn(CH 3 SO 3 ) 2 SiO 2 20g

[0061] CH 3 COONa 15g

[0062] CH 3 COOH 20ml

[0063] Complexing agent 5g

[0064] Stabilizer 8g

[0065] Surfactant 3.5g

[0066] The remainder is water;

[0067] The complexing agent is prepared according to the following ratio: 30% citric acid, 40% propionic acid, 30% adipic acid, and the stabilizer is ethoxy-a-naphtholsulfonic acid (ENSA), thiourea, and thiosulfuric acid Sodium mixture, of which ethoxy-a-naphthol sulfonic acid (ENSA) accounts for 40%, thiourea accounts for 30%, sodium thiosulfate accounts for 30%, and the surfactant is n-octyl sodium sulfate. After the solution is prepared in turn , adjust the pH to 4.8 with dilute sulfuric acid and potassium bicarbonate solution, and the plat...

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Abstract

The invention discloses a high-stability nickel-tin-phosphorus chemical plating solution. Each liter of the plating solution comprises 20-45g of nickel chloride hexahydrate, 15-25g of sodium hypophosphite, (Sn(CH3SO3)2@SiO2) tin methanesulfonate microcapsules, 5-35g of sodium acetate, 6-35ml of acetic acid, 3-10g of a complexing agent, 4-15g of a stabilizer, 2-6g of a surfactant and the balance of water, wherein the pH value of the solution is 4.0-5.0. The high-stability nickel-tin-phosphorus chemical plating solution disclosed by the invention has the beneficial effects of high stability and gentle and controllable plating speed.

Description

technical field [0001] The invention relates to a highly stable nickel-tin-phosphorus chemical plating solution, which belongs to the field of chemical reagents. Background technique [0002] At present, the research on the binary nickel system, especially the Ni-P alloy, has been quite common at home and abroad. The Ni-P alloy coating has a bright and smooth surface and outstanding mechanical properties. It adheres well to the substrate, and its wear resistance and corrosion resistance are comparable to those of Compared with other alloy plating, it has obvious advantages, and has been widely used in chemical industry, machinery, electronics, aerospace, energy, transportation and other industrial fields. However, with the development of modernization, people's requirements continue to increase, and binary nickel alloys can no longer To meet certain requirements of scientific production, some scholars have carried out research on nickel-based ternary composite plating. At pr...

Claims

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Application Information

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IPC IPC(8): C23C18/50
CPCC23C18/50
Inventor 樊伟杰赵晓栋杨婕李庆超
Owner 江苏矽智半导体科技有限公司
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