Easily printed PCB (printed circuit board) silver paste and preparation method thereof

A PCB circuit board and silver paste technology, which is applied in the manufacture of printed circuit components, circuits, cables/conductors, etc., can solve the problems of scrapped conductive lines, falling off of conductive lines, melting of glass phase, etc., and achieves not easy to fall off, continuous lines, The effect of saving consumption

Inactive Publication Date: 2015-09-30
TONGLING HONGZHENG NETWORK SCI & TECH CO LTD
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AI-Extracted Technical Summary

Problems solved by technology

[0005] The binder in the conductive silver paste has a great influence on the yield of circuit printing, such as viscosity, cohesiveness, adhesion, leveling, film formation, solvent volatility, etc. will affect the printing performance of the circuit , there are pores, open circuits, etc., and sometimes the glass phase has not yet begun to melt after the organic matter has volatilized, resulting in the phenomenon that the conductive line falls off from the substrate, and the conductive line is scrapped. Therefore, the performance of the organic binder needs to be improved.
[0006] At prese...
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Abstract

The invention relates to an easily printed PCB (printed circuit board) silver paste, made with, by weight, 12 to 16 parts of glass frit, 7 to 9 parts of thermosetting acrylic resin, 2 to 4 parts of hydroxymethyl cellulose, 3 to 5 parts of butyl acetate, 6 to 8 parts of tributyl citrate, 0.4 to 0.7 part of oxidized castor oil, 1 to 2 parts of N-phenyl-2-naphthylamine, 0.2 to 0.5 part of cobalt acetate, 1 to 2 parts of anhydrous lanolin, 5 to 7 parts of ethylene glycol monobutyl ether, 5 to 7 parts of xylene, 7 to 10 parts of 1 to 5 nm copper powder, 55 to 60 parts of 1 to 5 micrometers silver powder, 2 to 4 parts of silver-coated TiO2 microspheres, and 4 to 7 parts of silver-coated SiO2 microspheres. The silver paste has good dispersity and levelling property and ease of printing, the printed circuit is continuous and clear, and no pores and cracks occur after drying; with the use of the low-melting glass frit, the adhesion to PCB is good, and shedding rarely occurs; with the use of the conductive micro-powder such as copper powder, consumption of the silver powder is reduced without affecting the conductivity.

Application Domain

Non-conductive material with dispersed conductive materialCable/conductor manufacture +1

Technology Topic

MicrometerEther +17

Examples

  • Experimental program(1)

Example Embodiment

[0017] A silver paste for easy-to-print PCB circuit boards, which is made from the following raw materials in parts by weight (kg): glass powder 14, thermosetting acrylic resin 8, hydroxymethyl cellulose 3, butyl acetate 4, tributyl citrate 7, Oxidized castor oil 0.6, N-phenyl-2-naphthylamine 1.5, cobalt acetate 0.3, anhydrous lanolin 1.5, ethylene glycol monobutyl ether 6, xylene 6, 3nm copper powder 8, 3μm silver powder 57, silver coating TiO 2 Microspheres 3, silver-coated SiO 2 Microspheres 6;
[0018] The glass powder is made from the following raw materials in parts by weight (kg): borax 16, Si0 2 7. Bi 2 0 3 23. A1 2 0 3 6. Li 2 0 4, MgO 5, NaF 3, Ti0 2 4. ZnO 6, K 2 O 1.5, anoxic cerium oxide 1.5, nepheline powder 3, nano jade powder 3; the preparation method is: mixing borax, Si0 2 , Bi20 3 , A1 2 0 3 , Li 2 0. MgO, NaF, Ti0 2 , ZnO, K 2 O, mixed with oxygen-deficient cerium oxide, put into a crucible and heated at 1200 ° C to melt into a liquid, stir evenly, and then carry out vacuum defoaming, the vacuum degree is 0.13MPa, and the defoaming time is 7 minutes, and then poured into the mold to shape, and then water Quenched, sent to a ball mill for crushing and sieving to obtain 3μm powder, and then mixed with nepheline powder and nano-jade powder uniformly to obtain.
[0019] The preparation method of the silver paste for the easy-to-print PCB circuit board comprises the following steps:
[0020] (1) Mix butyl acetate, tributyl citrate, anhydrous lanolin and xylene, add thermosetting acrylic resin and hydroxymethyl cellulose, heat to 83°C, stir until the resin is completely dissolved, and then add oxidized castor oil Stir evenly, filter with 400-mesh gauze, remove impurities to obtain organic carrier;
[0021] (2) Mix ethylene glycol monobutyl ether with N-phenyl-2-naphthylamine and 3nm copper powder, stir at 6000 rpm for 15 minutes, and then add silver-coated TiO 2 Microspheres, silver-coated SiO 2 Microspheres, stirred for 15 minutes, then added 3μm silver powder, stirred for 15 minutes, then added to the organic carrier together with other remaining ingredients, mixed and dispersed in a ball mill, and then ultrasonically dispersed for 5 minutes to obtain a uniform slurry;
[0022] (3) Vacuum defoaming the slurry obtained in step (2), the vacuum degree is 0.06MPa, and the defoaming time is 10 minutes, and then grind and roll in a three-roll mill until the fineness of the silver slurry reaches 4 microns , that is.
[0023] Test Data:
[0024] The silver paste obtained in this example was printed on a PCB circuit board by screen printing, and then the temperature was raised to 630° C. and cured for 6 minutes to form a conductive circuit, thereby obtaining a conductive circuit board. The measured wiring width of the conductive line is 0.6mm, the average film thickness is 5μm, the wiring spacing is 0.9mm, and the resistivity is 4.5×10 -5 Ω·m.
[0025] According to the above method, 1000 conductive circuit boards were mass-produced. The conductive circuit and the PCB circuit board were well combined, with clear and continuous lines. The conductive circuit of 6 circuit boards fell off the substrate, and the yield was 99.4%.
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the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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Classification and recommendation of technical efficacy words

  • Good dispersion
  • Good leveling

People also interested in

Easy to printLow melting pointGood adhesionNot easy to fall offReduce dosagePrinted circuit boardSilver pasteCastor oilCopperMicrosphereEthylene glycol
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