Easily printed PCB (printed circuit board) silver paste and preparation method thereof

Abstract

The invention relates to an easily printed PCB (printed circuit board) silver paste, made with, by weight, 12 to 16 parts of glass frit, 7 to 9 parts of thermosetting acrylic resin, 2 to 4 parts of hydroxymethyl cellulose, 3 to 5 parts of butyl acetate, 6 to 8 parts of tributyl citrate, 0.4 to 0.7 part of oxidized castor oil, 1 to 2 parts of N-phenyl-2-naphthylamine, 0.2 to 0.5 part of cobalt acetate, 1 to 2 parts of anhydrous lanolin, 5 to 7 parts of ethylene glycol monobutyl ether, 5 to 7 parts of xylene, 7 to 10 parts of 1 to 5 nm copper powder, 55 to 60 parts of 1 to 5 micrometers silver powder, 2 to 4 parts of silver-coated TiO2 microspheres, and 4 to 7 parts of silver-coated SiO2 microspheres. The silver paste has good dispersity and levelling property and ease of printing, the printed circuit is continuous and clear, and no pores and cracks occur after drying; with the use of the low-melting glass frit, the adhesion to PCB is good, and shedding rarely occurs; with the use of the conductive micro-powder such as copper powder, consumption of the silver powder is reduced without affecting the conductivity.

Description

technical field [0001] The invention belongs to the technical field of electronic paste, and in particular relates to an easy-to-print PCB circuit board silver paste and a preparation method thereof. Background technique [0002] In the modern microelectronics industry, people have higher and higher requirements for electronic components, and the production is mostly carried out by process and standardization to reduce costs. The printed circuit board (PCB) was born to meet the needs of the microelectronics industry. Correspondingly, conduct research on new conductive pastes to match electronic pastes such as conductive pastes, electrode pastes, dielectric pastes, resistor pastes, and hole filling pastes with printed circuit boards (PCBs) that require new requirements. It is imperative. [0003] Generally speaking, the main components of electronic paste include functional phases such as metal, noble metal powder, etc., inorganic binders such as glass powder, oxide powder, ...

AI Technical Summary

Problems solved by technology

[0005] The binder in the conductive silver paste has a great influence on the yield of circuit printing, such as viscosity, cohesiveness, adhesion, leveling, film formation, solvent volatility, etc. will affect the printing performance of the circuit , there are pores, open circuits, etc., and sometimes the glass phase has not yet begun to melt after the organic matter has volatilized, resulting in the phenomenon that the conductive line falls off from the substrate, and the conductive line is scrapped. Therefore, the performance of the organic binder needs to be improved.

[0006] At present, many inorganic binders use glass powder. Glass powder is made of metal oxides, silicon oxide and other materials. If the melting point is too high, the glass phase has not yet started to melt after the volatilization of organic matter is completed, resulting in conductive lines obtained from conductive silver paste. The phenomenon of falling off from the substrate makes the conductive circuit scrapped; and many of the current glass powders contain harmful substances such as lead, which is not good for the environment, so it is necessary to develop glass powders with better performance