A device and method for low-stress isotropic organic filling
An isotropic, low-stress technology, applied in ion implantation plating, metal material coating process, coating, etc., can solve the problems of inability to prepare electrodes, achieve low stress, uniform film thickness, and facilitate processing Effect
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Embodiment 1
[0036] like figure 1 As shown, the low-stress isotropic organic filling device provided by the present invention includes a vacuum pump 1, a cold trap 2, an evaporation chamber 3, a high-temperature cracking furnace 8 and a powder vaporization furnace 7 connected in sequence through pipelines;
[0037] The pipeline connecting the cold trap 2 and the evaporation chamber 3 is provided with a deposition gas valve 11, and the pipeline connecting the evaporation chamber 3 and the high temperature cracking furnace 8 is provided with a deposition gas inlet valve 10;
[0038] The evaporation chamber 3 is provided with a sample holder tray 5 and a plasma cleaning source 4, and the sample holder tray 5 is placed at the bottom of the evaporation chamber 3 through a rotating part 6; a plasma cleaning source is provided directly above the sample holder tray 5 4, wherein: the vacuum pump 1 is used to evacuate the evaporation chamber 3, the cold trap 2 is used to cool the parylene waste gas ...
Embodiment 2
[0040] like figure 2 As shown, the groove depth of barium strontium titanate ceramic sample 9 is 20 μm, the groove width is 15 μm as an example, and the filling material is parylene (ParyleneN), which may specifically include the following steps:
[0041] Step a: Baking the gridded sample 9 of barium strontium titanate ceramics at 80°C for 3 hours to remove moisture from the material until the moisture content is less than 1% by mass;
[0042] Step b: Filling the gridded sample 9 of strontium barium titanate ceramics treated in step a with parylene by chemical vapor deposition, specifically including:
[0043] b1. Strontium barium titanate ceramic grid sample 9 has a groove width of 15 μm. In order to ensure that the groove is filled without voids and filled smoothly, the deposition thickness d (μm) that needs to be achieved is at least half of the groove width, and the deposition thickness is set. d is 9 μm, the weight of the calculated polyxylene powder is 30g, weigh 30g o...
Embodiment 3
[0050] like figure 2 As shown, the gridded sample of strontium barium titanate ceramics has a groove depth of 20 μm and a groove width of 15 μm as an example, and the filling material is parylene (ParyleneN). Specifically, the following steps may be included:
[0051] Step a: Baking the gridded sample 9 of barium strontium titanate ceramics at 90°C for 2 hours to remove moisture from the material until the moisture content is less than 1% by mass;
[0052] Step b: Filling the gridded sample 9 of strontium barium titanate ceramics treated in step a with parylene by chemical vapor deposition, specifically including:
[0053] b1. Strontium barium titanate ceramic grid sample 9 has a groove width of 15 μm. In order to ensure that the groove is filled without voids and filled smoothly, the deposition thickness d (μm) that needs to be achieved is at least half of the groove width, and the deposition thickness is set. d is 9 μm, the weight of the calculated polyxylene powder is 30g...
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